Method for manufacturing selective welding nozzle, selective welding nozzle and selective welding assembly

A manufacturing method and nozzle technology, which are applied to the manufacturing method of selective welding nozzles, selective welding nozzles and selective welding components, can solve the problems of easy corrosion and damage of nozzles, poor thermal conductivity of nozzles, and changes in surface morphology, and reduce electrochemical Corrosion rate, low carbon content, effect of slowing corrosion rate

Active Publication Date: 2022-02-18
DELTA ELECTRONICS JIANGSU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing nozzles generally have the disadvantages of short life and poor thermal conductivity
On the one hand, due to the low purity of the material used for the nozzle base, the nozzle is easily damaged by corrosion (such as grooves), and the surface morphology is changed so that it cannot continue to be used; on the other hand, since the nozzle surface has no coating or is only coated with a layer of tin , leading to poor thermal conductivity of the nozzle, the heat at the bottom of the nozzle cannot be better transferred to the tin and solder joints, increasing energy consumption

Method used

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  • Method for manufacturing selective welding nozzle, selective welding nozzle and selective welding assembly
  • Method for manufacturing selective welding nozzle, selective welding nozzle and selective welding assembly
  • Method for manufacturing selective welding nozzle, selective welding nozzle and selective welding assembly

Examples

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no. 1 example

[0110] The selective welding nozzle in the first embodiment of the present invention has a composite structure, including a substrate 110 , a nitrided layer 111 , a silver-plated layer 112 and a nano-silver oxide surface structure 113 in sequence. The carbon content of the substrate 110 is 0.03%, the iron content is 99.9%, and the content of other elements is 0.07%. The nozzle substrate 110 is processed by turning and finely ground. Microns. The nozzle base 110 is subjected to pressurized gas nitriding treatment for 5 hours in a pressurized nitriding furnace to obtain a surface nitrided layer 111 with a thickness of 1000 microns, wherein the temperature of the pressurized nitriding furnace is 550°C and the pressure is 5atm . Adopt a hanger to hang-plate mist silver on the surface of the nozzle to form a silver-plated layer 112 on the surface of the nitrided layer 111. The thickness of the silver-plated layer 112 is 10 microns, and the surface roughness of the substrate 110 wi...

no. 2 example

[0114] The process steps of making the selective welding nozzle of the second embodiment of the present invention, the shape and specific size of the selective welding nozzle are basically the same as those of the first embodiment. The difference between the selective welding nozzle of this embodiment and the first embodiment is that The carbon content in the material components of the substrate 110 is 0.02%, the iron content is 99.9%, and the remaining elements are 0.08%. The inner and outer surface roughness of the nozzle substrate 110 is 0.05 microns, the thickness of the nitrided layer 111 is 800 microns, and the thickness of the silver-plated layer 112 is 30 microns, the average diameter of the silver oxide particles of the nano-silver oxide surface structure 113 ranges from 50 nanometers.

no. 3 example

[0116] The selective welding assembly of the third embodiment of the present invention, the selective welding assembly includes a nozzle 10, a magnetic ring 20, a connecting head 30, a fixing slot 40 and an inner spray pipe 50, and the above-mentioned first embodiment is adopted in this embodiment. Select a welding nozzle. The magnetic ring 20 is made of a samarium cobalt magnet resistant to a high temperature of 350° C., and has a chromium nitride coating on the surface. When the magnetic ring 20 and the connector 30 are installed, the connector 30 is cooled to a suitable temperature to reduce the outer diameter of the boss 302, and then the magnetic ring 20 is put on to realize the cold interference fit between the connector 30 and the magnetic ring 20 . After the magnetic ring 20 is installed, the bottom of the connector 30 communicates with the inner nozzle 50 through the fixed slot 40, and then the nozzle 10 is set on the magnetic ring 20, and the magnetic ring 20 attrac...

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Abstract

The invention provides a manufacturing method of a selective welding nozzle, the selective welding nozzle and a selective welding assembly.The manufacturing method of the selective welding nozzle comprises the following steps that S1, industrial pure iron is machined to obtain a base body of the nozzle; s2, nitriding treatment is conducted on the base body, so that a nitriding layer is formed on the surface of the base body; s3, silver is plated on the substrate treated in the step S2 so as to form a silver plating layer on the surface of the nitriding layer; s4, a nano-silver layer is formed on the surface of the silver coating; and S5, the base body treated in the step S4 is subjected to thermal oxidation, and the nozzle is obtained. The selective welding nozzle manufactured according to the method has a composite structure; the service life of the nozzle is prolonged due to corrosion resistance; and the heat conductivity is good, and energy consumption in the welding process is reduced.

Description

technical field [0001] The invention relates to the field of welding, in particular to a method for making a selective welding nozzle, a selective welding nozzle and a selective welding assembly. Background technique [0002] Selective wave soldering technology is a newly developed technology in SMT technology, and its appearance largely meets the assembly requirements of high-density and diverse mixed PCB boards. Selective wave soldering has the advantages of independent setting of solder joint parameters, less thermal shock to PCB, less flux spraying, and strong soldering reliability. It is gradually becoming an indispensable soldering technology for complex PCBs. [0003] In selective soldering, the solder is drawn by a pump into a nozzle located in a tin bath. When the solder is pumped into the nozzle, small solder waves are created and flow back into the solder bath. [0004] Existing nozzles generally have the disadvantages of short life and poor thermal conductivity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/08B23K3/06
CPCB23K1/085B23K3/0653
Inventor 覃仁树王永元李柏霖
Owner DELTA ELECTRONICS JIANGSU
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