Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer

A manufacturing method and sandwich layer technology, applied in the direction of mechanical processing/deformation, etc., can solve the problems of limited corrugated height, difficult processing, large amount of glue used for forming and bonding, etc., and achieve good stability and synchronization of mechanical properties The effect of lifting and small consumption of raw materials

Pending Publication Date: 2022-01-11
ZHEJIANG SCI-TECH UNIV +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Three-layer corrugated cardboard (also known as single corrugated cardboard) has relatively high compressive strength, but the cushioning performance is not good, and the corrugated height is limited. It can only reach 6.6-7.0mm; although multi-layer corrugated cardboard can increase the overall thickness of the structure by superimposing multiple corrugated core layers or bonding multiple single-layer corrugated cardboards, the processing process is complicated and the bonding strength between layers is also low. It will have a great impact on the mechanical properties of the entire material, and because the corrugated peaks and valleys of the adjacent corrugated core layer or adjacent single corrugated cardboard are not perfectly aligned, the cushioning performance of the final multi-layer corrugated cardboard is acceptable but The problem of poor compressive strength is even more unfavorable. In the process of making multi-layer corrugated cardboard, the consumption of raw materials and adhesives is large, the cost is high, and it is not environmentally friendly; The thickness is basically unlimited, but it is difficult to process, the amount of glue used for forming and bonding is large, the consumption of raw materials per unit area of ​​honeycomb paperboard is large, and the ends of the honeycomb cells are closed, the humidity between the boards cannot be well dissipated, and Not suitable for use in humid, refrigerated, etc. environments
How to improve the poor cushioning performance and limited corrugation height of the three-layer corrugated cardboard by redesigning the core layer structure based on the structural characteristics of the existing three-layer corrugated cardboard, and propose a new type of paper buffer board, which is A New Topic in the Research Field of Cushioning Packaging Materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer
  • Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer
  • Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] The selected quantitative is 170g / m 2 Kraft paper as the upper and lower panels, the basis weight is 170g / m 2 Corrugated paper is used as the material for the sandwich layer; the sandwich layer is topologically formed by the first type of cell three-dimensional structure with the following basic structural characteristics: the cell three-dimensional structure is composed of four parallelogram plates with the same geometric parameters, and the two sides of the parallelogram have the same length is 10mm, the angle Δ between the two sides is 60°, and the folding angle γ is 80°, which is recorded as sample 1#. The thickness of sample 1# is 7.99mm.

Embodiment 2

[0076] The selected quantitative is 170g / m 2 Kraft paper as the upper and lower panels, the basis weight is 170g / m 2 Corrugated paper is used as the material for the sandwich layer; the sandwich layer is topologically formed by the second type of cell three-dimensional structure with the following basic structural characteristics: the cell three-dimensional structure is composed of four parallelogram plates with the same geometric parameters, and the lengths of the two sides of the parallelogram are respectively It is a=10mm, b=20mm, the angle Δ between the two sides is 60°, and the folding angle γ is 80°, which is recorded as sample 2#. The thickness of sample 2# is 7.99mm.

Embodiment 3

[0078] The selected quantitative is 170g / m 2 Kraft paper as the upper and lower panels, the basis weight is 170g / m 2 Corrugated paper is used as the material for the sandwich layer; the sandwich layer is topologically formed by the third type of cell three-dimensional structure with the following basic structural characteristics: the cell three-dimensional structure is composed of four parallelogram plates with the same geometric parameters, and the lengths of the two sides of the parallelogram are respectively It is a=20mm, b=10mm, the angle Δ between the two sides is 60°, and the folding angle γ is 80°, which is recorded as sample 3#. The thickness of sample 3# is 16.00mm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a manufacturing method for a paper buffer type board with a bidirectional corrugated sandwich layer. The manufacturing method comprises the steps that a flat-plate-shaped upper panel and a flat-plate-shape lower panel are manufactured; a cell paperboard composed of a plurality of cell plane structures is manufactured, and the multiple cell plane structures are connected and arranged on the same paperboard in a close array mode; each cell plane structure is mainly formed by connecting four identical parallelogram boards which are arranged in a shape like a Chinese character 'tian' through folding lines, and the cell paperboard is folded through folding lines of the cell paperboard to form the sandwich layer formed by a plurality of cell three-dimensional structures; and the sandwich layer is bonded with the upper panel and the lower panel correspondingly to form the paper buffer type board. The manufactured board is easy to process and form, the structural height change range is wide, and the problem that the thickness of a single corrugated board is limited is solved; and the unit mass bearing capacity and the buffering energy absorption characteristic are excellent, and the mechanical property is synchronously improved on the premise that the total thickness of the sandwich board is increased.

Description

technical field [0001] The invention belongs to the technical field of new materials and relates to a method for making a paper board, in particular to a method for making a paper buffer board with a bidirectional corrugated sandwich layer. Background technique [0002] Due to the demand for environmental protection, the consumption and market demand of paper cushioning boards have been very strong. At present, most of the paper cushioning plates on the market are three-layer corrugated cardboard, multi-layer corrugated cardboard or honeycomb cardboard. Three-layer corrugated cardboard (also known as single corrugated cardboard) has relatively high compressive strength, but the cushioning performance is not good, and the corrugated height is limited. It can only reach 6.6-7.0mm; although multi-layer corrugated cardboard can increase the overall thickness of the structure by superimposing multiple corrugated core layers or bonding multiple single-layer corrugated cardboards,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B31F1/20
CPCB31F1/20
Inventor 朱先梅鄂玉萍杨光
Owner ZHEJIANG SCI-TECH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap