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Acrylonitrile-butadiene-styrene copolymer based heat-insulation composite material

A styrene copolymer, insulation and heat insulation technology, applied in the direction of organic insulators, plastic/resin/wax insulators, etc., can solve the problems of reduced processing performance, poor heat insulation performance, and affecting the insulation performance of ABS composite materials, and achieve processing and shaping Convenience, good flame retardancy, good heat insulation effect

Inactive Publication Date: 2017-06-13
SUZHOU LUOTELAN NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its thermal insulation performance is poor, and the processing performance is seriously reduced when adding thermal insulation fillers to improve its thermal insulation and / or thermal insulation performance. At the same time, due to the selection of thermal insulation fillers, it will affect the insulation performance of ABS composite materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Example 1: Acrylonitrile-butadiene-styrene copolymer-based insulation and thermal insulation composite material, including the following parts by weight of raw materials: 60 parts of acrylonitrile-butadiene-styrene copolymer and phthalic diene 15 parts of propyl ester, 15 parts of triallyl isocyanurate, 10 parts of vinyl tris(β-methoxyethoxy) silane, 5 parts of styrene-maleic anhydride copolymer, phthalic acid 3 parts of diallyl ester, 2 parts of hydroxy silicone oil, 3 parts of fluorodiol, 1 part of sodium polyacrylate, 4 parts of tert-butyl peroxybenzoate, 3 parts of resorcinol bis(diphenyl) phosphate, heat preservation The filler is 50 parts, and the antioxidant is 1 part; the thermal insulation filler includes ceramic hollow microspheres, silica hollow spheres, and polyanionic cellulose, and the ratio of the parts by mass is 3:2:1.

[0014] Further, the antioxidant is bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite, the average particle size of the hollow sili...

Embodiment 2

[0015] Example 2: Acrylonitrile-butadiene-styrene copolymer-based insulation and thermal insulation composite material, including the following parts by weight of raw materials: 50 parts of acrylonitrile-butadiene-styrene copolymer and phthalic diene 10 parts of propyl ester, 10 parts of triallyl isocyanurate, 5 parts of vinyl tris(β-methoxyethoxy) silane, 3 parts of styrene-maleic anhydride copolymer, phthalic acid 1 part of diallyl ester, 1 part of hydroxy silicone oil, 2 parts of fluorodiol, 0.5 part of sodium polyacrylate, 2 parts of tert-butyl peroxybenzoate, 2 parts of resorcinol bis(diphenyl) phosphate, heat preservation The filler is 40 parts and the antioxidant is 0.5 parts; the thermal insulation filler includes ceramic hollow microbeads, silica hollow spheres, and polyanionic cellulose, and the ratio of the parts by mass is 2:1:1.

[0016] Further, the antioxidant is 2,5-di-tert-butyl hydroquinone, the average particle size of the hollow silica spheres is 0.5 to 1.5 μm...

Embodiment 3

[0017] Example 3: Acrylonitrile-butadiene-styrene copolymer-based insulation and thermal insulation composite material, including the following parts by weight of raw materials: 70 parts of acrylonitrile-butadiene-styrene copolymer, phthalic diene 20 parts of propyl ester, 20 parts of triallyl isocyanurate, 15 parts of vinyl tris(β-methoxyethoxy) silane, 8 parts of styrene-maleic anhydride copolymer, phthalic acid 5 parts of diallyl ester, 3 parts of hydroxy silicone oil, 4 parts of fluorodiol, 2 parts of sodium polyacrylate, 6 parts of tert-butyl peroxybenzoate, 5 parts of resorcinol bis(diphenyl) phosphate, heat preservation The filler is 60 parts and the antioxidant is 1.5 parts; the thermal insulation filler includes ceramic hollow microspheres, silica hollow spheres, and polyanionic cellulose, and the ratio of the parts by mass is 4:3:1.

[0018] Further, the antioxidant is bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite, the average particle size of the hollow sili...

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Abstract

The invention relates to an acrylonitrile-butadiene-styrene copolymer based heat-insulation composite material, which is prepared from the following raw materials in parts by weight: 50 to 70 parts of acrylonitrile-butadiene-styrene copolymer, 10 to 20 parts of diallyl phthalate, 10 to 20 parts of triallyl isocyanurate, 5 to 15 parts of vinyltrib (beta-methoxyethoxy) silane, 3 to 8 parts of styrene-maleic anhydride copolymer, 1 to 5 parts of diallyl phthalate, 1 to 3 parts of hydroxyl silicone oil, 2 to 4 parts of fluorine diol, 0.5 to 2 parts of sodium polyacrylate, 2 to 6 parts of tert-butyl peroxybenzoate, 2 to 5 parts of resorcinol (bis-diphenyl) phosphate, 40 to 60 parts of heat-insulation filler, and 0.5 to 1.5 parts of antioxidant. The invention relates to the acrylonitrile-butadiene-styrene copolymer based heat-insulation composite material with a favorable heat-insulation performance, and better fire resistance, insulativity and corrosion resistance obtained through multiple experiments, the material can be processed and shaped conveniently, a favorable machinable property of ABS is maintained, and the application range of an ABS material is further expanded.

Description

Technical field [0001] The invention relates to the technical field of thermal insulation materials, in particular to an acrylonitrile-butadiene-styrene copolymer based insulation and thermal insulation composite material. Background technique [0002] Insulation materials can block the transfer of heat flow, play a role in heat insulation and / or heat preservation, and greatly buffer temperature changes. Acrylonitrile-butadiene-styrene copolymer resin (ABS) is a graft copolymer of acrylonitrile, 1,3-butadiene, and styrene. It has high strength, low weight and is non-toxic. , Odorless, with tough, hard and rigid characteristics, excellent impact strength, good dimensional stability, electrical properties, abrasion resistance, chemical resistance, dyeability, good molding processing and mechanical processing, and excellent overall performance. However, its thermal insulation performance is poor, and the processing performance is severely reduced when the thermal insulation filler ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L55/02C08L35/06C08L83/06C08L33/02C08K13/04C08K5/12C08K5/3492C08K5/5425C08K5/053C08K5/14C08K5/523C08K7/24C08K7/26C08K5/526C08K5/13H01B3/44
CPCC08L55/02C08L2201/02C08L2205/035H01B3/44C08L35/06C08L83/06C08L33/02C08K13/04C08K5/12C08K5/3492C08K5/5425C08K5/053C08K5/14C08K5/523C08K7/24C08K7/26C08K5/526C08K5/13
Inventor 马志明
Owner SUZHOU LUOTELAN NEW MATERIAL TECH
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