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Graphene heat conduction gasket edge covering process and edge-covered graphene heat conduction gasket

A heat-conducting gasket and graphene technology, which is applied in the wrapping process of graphene heat-conducting gaskets and the field of wrapping graphene heat-conducting gaskets, can solve problems such as short circuits, powder dropping, and damage to electronic products, and achieve improved stability and work Long life, improvement of powder drop problem, excellent thermal conductivity and mechanical properties

Pending Publication Date: 2021-12-24
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Thermal pads made of carbon materials such as graphene films are mostly laminated and then sliced. During the cutting process of graphene thermal pads, there will be powder drop on the side due to cutting damage. Phenomenon, this kind of powder has good conductivity, if it falls on the circuit board, it will easily cause a short circuit and cause damage to electronic products

Method used

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  • Graphene heat conduction gasket edge covering process and edge-covered graphene heat conduction gasket
  • Graphene heat conduction gasket edge covering process and edge-covered graphene heat conduction gasket
  • Graphene heat conduction gasket edge covering process and edge-covered graphene heat conduction gasket

Examples

Experimental program
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Effect test

preparation example

[0038] The graphene thermal pad adopts the following preparation method:

[0039] Place the first layer of graphene film flat on the operating table, evenly coat a layer of adhesive on the graphene film, then place the second layer of graphene film on the first layer of graphene film and coat evenly The second layer of adhesive, reciprocating until stacked to the target height to obtain the graphene film block;

[0040] Open some through holes on the obtained graphene film block, the axial direction of the through hole is along the direction of the graphene film stack and run through both sides of the graphene film block, and the through holes are distributed in an array on the graphene block;

[0041]The carbon fiber filaments are soaked from the adhesive and then inserted into the opened through holes, so that the carbon fiber filaments fill the entire through hole along the length direction, and the graphene-carbon fiber filament three-dimensional structure is obtained afte...

Embodiment 1-8

[0051] Embodiment 1-8 discloses a kind of wrapping graphene heat conduction gasket, adopts following preparation process:

[0052] Use a precision dispenser to evenly coat a layer of colloid on the side walls around the thickness direction of the graphene thermal pad obtained in Preparation Example 1 to form an edge layer, and the colloid is bonded to the side walls around the graphene thermal pad. Partially solidified to form a wrapping part, and a part extending from the wrapping part is attached to the upper and lower sides of the graphene thermal pad and solidified to form an extension part.

[0053] Among them, the colloid is silicone rubber, the colloid coating method is high-precision glue dispensing machine dispensing, and the colloid curing method is heat curing. See Table 1 for the viscosity of the colloid and the specification parameters of each part after the wrapping layer is cured and formed. In Table 1, "thickness of hemming part" is attached figure 1 The X sh...

Embodiment 9

[0057] This embodiment discloses an edge-wrapped graphene thermally conductive gasket. The preparation process is: a layer of colloid is coated around the graphene thermally conductive gasket obtained in Preparation Example 1, the colloid is silicone rubber, and the viscosity of the colloid is 10mPa·s. The colloid curing method is thermal curing.

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Abstract

The invention relates to the field of electronic product heat dissipation devices, and particularly discloses a graphene heat conduction gasket edge covering process and an edge-covered graphene heat conduction gasket. The process comprises the steps that a first layer of graphene film is coated with a layer of adhesive, then a second layer of graphene film is placed on the first layer of graphene film, and continuous and repeated laminating is performed to a target height to obtain a graphene film block body; a plurality of through holes penetrating through the upper side and the lower side of the graphene film block body are formed in the graphene film block body, the surfaces of carbon fibers are wrapped with the adhesive and then penetrate into the through holes, and slicing is conducted in the direction parallel to the thickness direction of the graphene film to obtain the graphene heat conduction gasket with the specified thickness; and a layer of colloid is coated on the peripheral edge of the graphene heat conduction gasket to form an edge covering layer. The graphene heat conduction gasket prepared by the technical scheme provided by the invention can effectively improve the problem of powder falling of the side edge of the graphene heat conduction gasket while ensuring excellent heat conduction performance and mechanical properties, and has wide application prospects in the field of chip heat dissipation.

Description

technical field [0001] This application relates to the field of heat dissipation devices for electronic products, and more specifically, it relates to a graphene heat-conducting gasket wrapping process and an edge-wrapped graphene heat-conducting gasket. Background technique [0002] With the advent of the 5G era, the operating frequency of electronic chips continues to increase, and electronic products are gradually developing in the direction of light weight and high integration, resulting in a significant increase in the heat generated by the equipment. If the heat generated is not conducted in time, it will greatly affect the electronic components. When the working state of the device is serious, the life of the electronic device will be reduced or even fail, resulting in serious quality problems. In order to solve the heat dissipation problem of electronic products, thermal interface materials came into being. [0003] Thermal interface material is a general term for m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B7/12B32B37/12B32B3/24B32B3/08H05K7/20
CPCB32B9/007B32B9/04B32B7/12B32B37/1284B32B3/266B32B3/08H05K7/2039B32B2262/106B32B2307/302F16J15/102F16J15/064C09J5/06F16J15/022
Inventor 曹勇孙爱祥羊尚强贺西昌窦兰月周晓燕
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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