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Two-component heat-conducting gel as well as preparation method and application thereof

A two-component, gel technology, applied in the direction of modification by conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve the problems of poor high temperature resistance and high hardness of thermally conductive gel, and achieve small thermal weight loss and good resistance. high temperature effect

Active Publication Date: 2021-12-03
GUANGZHOU JOINTAS CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermally conductive gel prepared by this technical scheme has relatively high hardness and poor high temperature resistance

Method used

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  • Two-component heat-conducting gel as well as preparation method and application thereof
  • Two-component heat-conducting gel as well as preparation method and application thereof
  • Two-component heat-conducting gel as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] This embodiment provides a two-component thermally conductive gel and a preparation method thereof, the two-component thermally conductive gel includes A component and B component;

[0087] Described A component comprises the component of following parts by weight:

[0088]

[0089] Described B component comprises the component of following parts by weight:

[0090]

[0091] The viscosity of the monovinyl-terminated polydimethylsiloxane is 1000cps, and the simplified structure is (CH 3 ) 3 SiO[R 1 R 2 SiO 1 / 2 ] p [(R 1 ) 2 SiO 1 / 2 ] q Si(CH 3 ) 2 CH=CH 2 ; where R 1 for -CH 3 , R 2 is -H, p is 20, q is 20;

[0092] The viscosity of the methyl hydrogen polydimethylsiloxane is 100cps, and the simplified structure is H(CH 3 ) 2 Si[SiMeR 3 O] m [SiR 3 HO 3 / 2 ] n [SiO 2 ] s Si(R 4 ) 2 H; where, R 3 is methyl, R 4 is ethyl, m is 10, n is 18, s is 20;

[0093] The particle size of the first thermally conductive filler in the alumina is 40 μm...

Embodiment 2

[0101] This embodiment provides a two-component thermally conductive gel and a preparation method thereof, the two-component thermally conductive gel includes A component and B component;

[0102] Described A component comprises the component of following parts by weight:

[0103]

[0104] Described B component comprises the component of following parts by weight:

[0105]

[0106] The viscosity of the monovinyl-terminated polydimethylsiloxane is 500cps, and the simplified structure is (CH 3 ) 3 SiO[R 1 R 2 SiO 1 / 2 ] p [(R 1 ) 2 SiO 1 / 2 ] q Si(CH 3 ) 2 CH=CH 2 ; where R 1 for -CH 2 CH 3 , R 2 for -CH 3 , p is 10, q is 32;

[0107] The viscosity of the methyl hydrogen polydimethylsiloxane is 150cps, and the simplified structure is H(CH 3 ) 2 Si[SiMeR 3 O] m [SiR 3 HO 3 / 2 ] n [SiO 2 ] s Si(R 4 ) 2 H; where, R 3 is ethyl, R 4 is n-propyl, m is 17, n is 19, s is 26;

[0108] The particle size of the first thermally conductive filler in the mag...

Embodiment 3

[0116] This embodiment provides a two-component thermally conductive gel and a preparation method thereof, the two-component thermally conductive gel includes A component and B component;

[0117] Described A component comprises the component of following parts by weight:

[0118]

[0119]

[0120]Described B component comprises the component of following parts by weight:

[0121]

[0122] The viscosity of the monovinyl-terminated polydimethylsiloxane is 5000cps, and the simplified structure is (CH 3 ) 3 SiO[R 1 R 2 SiO 1 / 2 ] p [(R 1 ) 2 SiO 1 / 2 ] q Si(CH 3 ) 2 CH=CH 2 ; where R 1 for-C 6 h 5 , R 2 is -H, p is 35, q is 40;

[0123] The viscosity of the methyl hydrogen polydimethylsiloxane is 1000cps, and the simplified structure is H(CH 3 ) 2 Si[SiMeR 3 O] m [SiR 3 HO 3 / 2 ] n [SiO 2 ] s Si(R 4 ) 2 H; where, R 3 is n-butyl, R 4 For n-propyl; m is 36, n is 42, s is 18;

[0124] The particle size of the first thermally conductive filler in ...

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Abstract

The invention provides two-component heat-conducting gel as well as a preparation method and application thereof. The double-component heat-conducting gel comprises a component A and a component B, the component A is prepared from the following components in parts by weight: 10 to 40 parts of monovinyl terminated polydimethylsiloxane, 5 to 10 parts of methyl hydrogen polydimethylsiloxane and 100 to 200 parts of heat-conducting filler A; and the component B is prepared from the following components in parts by weight: 10 to 40 parts of alkoxy-terminated vinyl polydimethylsiloxane, 100 to 200 parts of heat-conducting filler B and 0.1 to 2 parts of catalyst. The preparation method comprises the following steps: firstly, mixing all the components in the component A to obtain a premix A; mixing all the components in the component B to obtain a premix B; and then mixing the premix A and the premix B to obtain the double-component heat-conducting gel. The double-component heat-conducting gel provided by the invention has a relatively high heat conductivity coefficient, relatively good high temperature resistance and relatively low oil yield.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a two-component heat-conducting gel and its preparation method and application. Background technique [0002] During the heat dissipation process of electronic components, the heat is transferred from the inside of the device to the radiator, and then dissipated to the external environment through the radiator. Thermal resistance analysis shows that there is a "hard contact" between the device and the radiator. Due to the rough and uneven microscopic surface of the solid, the actual contact between the two only accounts for 1 to 5% of the apparent area, and the rest is tiny pores filled with air. Therefore, the thermal resistance of the interface between the device and the heat sink is large, and it is difficult to form an effective heat dissipation channel, resulting in a poor heat dissipation effect. Therefore, how to reduce the interface thermal resistance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K3/22C08K3/38C08K3/34H05K7/20
CPCC08L83/04H05K7/2039C08K2003/2227C08K2003/385C08K2003/222C08K2003/2296C08L2201/08C08L2205/025C08K3/22C08K3/38C08K3/34Y02E60/10
Inventor 刘廷铸胡国新陈柏富赵志垒黄永军
Owner GUANGZHOU JOINTAS CHEM
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