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A kind of copper/graphene composite film material and its preparation method and application

A graphene composite, thin-film material technology, applied in heat exchange materials, chemical instruments and methods, metal material coating processes, etc., can solve the problems of poor thermal stability and low strength of pure copper, and achieve easy operation and preparation of equipment. Simple method, combined with good effect

Active Publication Date: 2022-05-31
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pure copper has low strength and poor thermal stability, and it is necessary to add reinforcements to improve its performance

Method used

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  • A kind of copper/graphene composite film material and its preparation method and application
  • A kind of copper/graphene composite film material and its preparation method and application
  • A kind of copper/graphene composite film material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment 1 (comparative example, does not add graphene dispersion liquid)

[0038] Preparation of basic electroless copper plating thin film materials, the specific steps are as follows:

[0039] (1) Ultrasonic cleaning of the red copper sheet for 3 minutes, then soaking in 60°C alkaline washing solution for 4 minutes, taking it out and rinsing it with deionized water, putting it in 0.1mol / L dilute hydrochloric acid at room temperature for 30 seconds, and finally Rinse briefly with deionized water and blow dry;

[0040] (2) Preparation of alkaline lotion: Weigh 20g of trisodium phosphate, 20g of sodium carbonate and 8g of sodium hydroxide per liter of deionized water, place them in 100mL of deionized water, and stir at a constant temperature of 60°C until clear;

[0041] (3) Preparation of basic electroless copper plating solution: Weigh 10g of copper sulfate pentahydrate, 14g of potassium sodium tartrate, 20g of disodium edetate, 12g of sodium hydroxide, 20mg of 2,2...

Embodiment 2

[0046] A kind of preparation method of copper / graphene composite film, concrete steps are as follows:

[0047] (1) Ultrasonic cleaning of the red copper sheet for 3 minutes, then soaking in 50°C alkaline washing solution for 4 minutes, taking it out and rinsing it with deionized water, putting it in 0.1mol / L dilute hydrochloric acid at room temperature for 30 seconds, and finally Rinse briefly with deionized water and blow dry;

[0048] (2) Preparation of alkaline lotion: Weigh 10g of trisodium phosphate, 10g of sodium carbonate and 8g of sodium hydroxide for each liter of deionized water, place them in 100mL of deionized water, and stir at a constant temperature of 50°C until clear;

[0049] (3) Prepare a 0.1g / L single-layer graphene dispersion: weigh 1 mg of single-layer graphene and dissolve it in 10 mL of deionized water. The agent is composed of polyvinylpyrrolidone and chloroform with a mass ratio of 2:1, ultrasonicated again and stirred for 2 hours before use, and stir...

Embodiment 3

[0056] A kind of preparation method of copper / graphene composite film, concrete steps are as follows:

[0057] (1) Ultrasonic cleaning of the red copper sheet for 3 minutes, then soaking in 60°C alkaline washing solution for 4 minutes, taking it out and rinsing it with deionized water, putting it in 0.1mol / L dilute hydrochloric acid at room temperature for 30 seconds, and finally Rinse briefly with deionized water and blow dry;

[0058] (2) Preparation of alkaline lotion: Weigh 30g of trisodium phosphate, 30g of sodium carbonate and 5g of sodium hydroxide for each liter of deionized water, place them in 100mL of deionized water, and stir at a constant temperature of 60°C until clear;

[0059] (3) Prepare a 0.5g / L single-layer graphene dispersion: weigh 5 mg of single-layer graphene and dissolve it in 10 mL of deionized water, ultrasonically and stir for 2 hours, then weigh 25 mg of mixed dispersant and add, wherein, mixed and dispersed The agent is composed of polyvinylpyrrol...

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Abstract

The invention discloses a copper / graphene composite thin film material obtained by adding a single-layer graphene dispersion liquid to the basic chemical copper plating solution by ultrasonic-assisted chemical plating, so that metal copper and single-layer graphene are co-deposited on the substrate surface , the metal copper on the surface of the material is closely packed with single-layer graphene, the surface has no holes, high density and uniform grain shape; Mixture quality is 17-51g, sodium hydroxide quality is 10-13g, formaldehyde is 10-25mL, 2,2 ， When the mass of ‑bipyridine is 10‑30mg and the mass of single-layer graphene is 0.1‑2g, and the balance is deionized water, the thermal conductivity can reach up to 501.45W / (m·K). The copper / graphene composite thin film material of the invention has uniform growth distribution, good stability and wide application prospects.

Description

technical field [0001] The invention belongs to the technical field of electroless copper plating, and in particular relates to a copper / graphene composite film material and a preparation method and application thereof. Background technique [0002] Electroless plating, also known as electroless plating (Electroless Plating), refers to the use of a reducing agent in the solution to reduce metal ions on the surface of a substrate with catalytic activity under the condition of no external current to form a metal layer on the surface of the substrate. surface treatment technology. Due to its unique properties, electroless copper plating has been widely used in metallization of non-metallic materials, preparation of composite materials, printed circuit boards and electromagnetic shielding materials. As we all know, metal copper has high thermal conductivity and excellent ductility, and is an indispensable material in the fields of aerospace, electronic power, construction indus...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40C23C18/18C23G1/20C09K5/14
CPCC23C18/1666C23C18/1662C23C18/405C23C18/1844C23C18/1651C23G1/20C09K5/14
Inventor 张勇左延正吴玉程周志尚陶欣欣秦永强王岩崔接武舒霞
Owner HEFEI UNIV OF TECH
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