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Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof

An aluminum-silicon alloy, electronic packaging technology, applied in the fields of metallurgy and rolling processing, can solve the problems of weak packaging, poor material surface quality, open welding and other problems

Pending Publication Date: 2021-09-14
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the large differences in equipment configuration, process route, technical level, market application and enterprise standards of each unit, especially the huge difference in multi-pass rolling production and extrusion production process, the product quality will be uneven
At present, the domestic materials mainly have the following problems in practical application: (1) The strength of the material is insufficient, and it will be deformed when it is airtightly packaged; (2) The surface quality of the material is poor, and it is easy to cause the package to be unstable when packaged; (3) The flat surface of the cover material During and after packaging, the cover material is easily deformed, resulting in open soldering

Method used

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  • Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof
  • Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] The furnace weight during semi-continuous casting is 100kg.

[0060] Weigh 10kg of Si, 0.01kg of Mg, 0.01kg of Cu, 0.01kg of Zn, 0.01kg of Ti, and 89.96kg of Al into the graphite crucible of the semi-continuous casting machine, adopt intermediate frequency induction melting, after the metal is completely melted, refining and degassing, Start the casting device, use the seed rod to introduce the melt into the graphite mold, the melting temperature is 700°C, and the casting speed is 3mm / s. Cast a billet with a diameter of Φ165.0mm and a length of about 2m.

[0061] The obtained billet is sawed into 200mm long rod ingots, peeled off and then extruded.

[0062] Place the rod ingot in a heat treatment furnace, raise the temperature to 440°C, and heat it for homogenization for 12 hours. Use a 1250-ton forward extrusion machine to extrude the billet into a slab of ≠10mm×200mm, with an extrusion temperature of 450°C, an extrusion speed of 15mm / s, and an extrusion pressure of ...

Embodiment 2

[0066] The furnace weight during semi-continuous casting is 100kg.

[0067] Weigh 12kg of Si, 0.05kg of Mg, 0.05kg of Cu, 0.05kg of Zn, 0.05kg of Ti, and 87.8kg of Al into the graphite crucible of the semi-continuous casting machine, adopt intermediate frequency induction melting, after the metal is fully melted, refining and degassing, Start the casting device, use the seed rod to introduce the melt into the graphite mold, the melting temperature is 720°C, and the casting speed is 4mm / s. Cast a billet with a diameter of Φ165.0mm and a length of about 2m.

[0068] The obtained billet is sawed into 200mm long rod ingots, peeled off and then extruded.

[0069] Place the ingot in a heat treatment furnace, raise the temperature to 430° C., and heat the homogenized heat treatment for 12 hours. Use a 1250-ton forward extrusion machine to extrude the billet into a slab of ≠10mm×220mm, with an extrusion temperature of 450°C, an extrusion speed of 20mm / s, and an extrusion pressure of...

Embodiment 3

[0073] The furnace weight during semi-continuous casting is 100kg.

[0074] Weigh 15kg of Si, 0.03kg of Cu, 0.03kg of Zn, 0.03kg of Ti, 0.03kg of Mg, and 84.88kg of Al into the graphite crucible of the semi-continuous casting machine, adopt medium frequency induction melting, after the metal is fully melted, refining and degassing, Start the casting device, use the seed rod to introduce the melt into the graphite mold, the melting temperature is 750°C, and the casting speed is 3mm / s. Cast a billet with a diameter of Φ165.0mm and a length of about 2m.

[0075] The obtained billet is sawed into 200mm long rod ingots, peeled off and then extruded.

[0076] Place the ingot in a heat treatment furnace, raise the temperature to 450°C, and heat it for homogenization for 12 hours. Use a 1250-ton forward extrusion machine to extrude the billet into a slab of ≠7mm×200mm, the extrusion temperature is 450°C, the extrusion speed is 15mm / s, and the extrusion pressure is 22MPa;

[0077] R...

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Abstract

The invention relates to an aluminum-silicon alloy cover plate material for electronic packaging and a preparation method of the aluminum-silicon alloy cover plate material, and belongs to the technical field of metallurgy and calendering processing. In the aluminum-silicon alloy cover plate material, the content of Si is 7 to 20 percent by weight, the content of Mg is 0.01 to 0.5 percent by weight, the content of Cu is 0.01 to 0.1 percent by weight, the content of Zn is 0.01 to 0.1 percent by weight, the content of Ti is 0.01 to 0.5 percent by weight, the balance is Al, and the preparation method comprises the steps of vertical semi-continuous casting, hot extrusion cogging, isothermal cold rolling, surface treatment, later shaping and the like. The aluminum-silicon alloy cover plate is uniform in component, accurate in size, excellent in performance and good in consistency; by adopting the method, components can be effectively and accurately controlled, impurity introduction is avoided, and the alloy purity is improved; and the internal structure of the alloy is improved, the processing difficulty is reduced, and the aluminum-silicon alloy cover plate material with excellent performance can be prepared.

Description

technical field [0001] The invention relates to an aluminum-silicon alloy cover plate material for electronic packaging and a preparation method thereof, which is mainly used for airtight packaging of electronic devices and belongs to the technical field of metallurgy and rolling processing. Background technique [0002] In recent years, with the rapid development of the electronics industry and aviation and aerospace industries, as well as the continuous improvement of the performance of electronic machines and systems, the application side has higher and higher requirements for electronic devices, not only requiring devices to be small in size and light in weight, but also requiring The device has high air tightness, can withstand strong shock vibration and irradiation conditions in various harsh environments, can work stably in a wide temperature range and vacuum state, and has a long working life. Therefore, in order to ensure the stability and long-term reliability of e...

Claims

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Application Information

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IPC IPC(8): C22C21/02B21C37/02B22D11/00C22C1/02
CPCC22C21/02C22C1/026B22D11/003B21C37/02
Inventor 焦磊陈晓宇韩鹏黄晓猛李笑颖张震张朦
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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