A kind of insulating and heat-dissipating coating for eb-cured aluminum-based copper-clad laminates

Abstract

The invention relates to the technical field of aluminum-based copper-clad laminates, in particular to an insulating and heat-dissipating coating for EB-cured aluminum-based copper-clad laminates. Adding metal powder or carbon fiber material with good thermal conductivity to the insulating layer material can significantly improve the thermal conductivity of the insulating layer, but to a certain extent, it will reduce the insulation reliability of the insulating layer. Based on the above problems, the present invention provides an insulating and heat-dissipating coating for EB cured aluminum-based copper-clad laminates. In the present invention, fluorine-modified nano phase-change capsules are added to the coating system, and the outer surface of the fluorine-modified nano-phase-change capsules introduces fluorine-containing The long carbon chain makes the fluorine-modified nano-phase change capsules have low surface energy, which tends to be concentrated on the upper surface of the coating system and close to the bottom of the circuit layer, and can quickly absorb and transfer The heat, to a certain extent, reduces the amount of thermally conductive filler carbon nanotubes added, increasing the reliability of the insulating layer.

Description

technical field [0001] The invention relates to the technical field of aluminum-based copper-clad laminates, in particular to an insulating and heat-dissipating coating for EB-cured aluminum-based copper-clad laminates. Background technique [0002] Aluminum-based copper clad laminate, or aluminum substrate, is a metal-based copper-clad laminate with good heat dissipation function. It is a kind of raw material for aluminum-based printed circuit boards and is widely used in LED lighting products. Generally, aluminum-based copper clad laminates are composed of a circuit layer (copper foil), an insulating layer and an aluminum base layer. The insulation layer is used to bond the circuit layer and the aluminum base layer, and has the function of insulation and heat dissipation to resist voltage breakdown. [0003] In order to increase the heat dissipation performance of the insulating layer, the usual practice is to add metal powder or carbon fiber material with good thermal co...

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Problems solved by technology

[0003] In order to increase the heat dissipation performance of the insulating layer, the usual practice is to add metal powder or carbon fiber material with good thermal conductivity to the insulating layer material. This method can significantly improve the thermal conductivity of the insulating layer, but it will reduce the thermal conductivity of the insulating layer to a certain extent. The dielectric constant greatly reduces the anti-voltage breakdown effect of the insulating layer

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