Shell assembly, manufacturing method thereof and electronic equipment

A shell assembly and manufacturing method technology, which is applied in the direction of electrical equipment shells/cabinets/drawers, chemical instruments and methods, shells/cabinets/drawer parts, etc., and can solve problems such as high cost and heavy shell weight

Pending Publication Date: 2021-08-03
GUANGDONG XINXIU NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a shell assembly, its manufacturing method, and electronic equipment to solve the problems of heavy weight and high cost of the ceramic shell

Method used

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  • Shell assembly, manufacturing method thereof and electronic equipment
  • Shell assembly, manufacturing method thereof and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] This embodiment provides a shell assembly and a manufacturing method thereof. The housing assembly of this embodiment includes a ceramic base, an adhesion promoter layer, and a fiber-reinforced resin layer. The fiber-reinforced resin layer is connected to the ceramic base through an adhesion promoter layer. The thickness of the ceramic substrate is 0.6mm, the thickness of the adhesion promoter layer is 22μm, and the thickness of the fiber reinforced resin layer is 0.32mm.

[0079] The manufacturing method of the housing assembly of the present embodiment includes the following steps:

[0080] The zirconia ceramic base material is subjected to numerical control machining, cutting and grinding, and is thinned to a sheet shape with a thickness of 0.3 mm to obtain a ceramic base.

[0081] Clean the thinned ceramic substrate. The polyurethane adhesion promoter is evenly coated on the non-appearance surface of the ceramic substrate to form an adhesion promoter layer.

[0...

Embodiment 2

[0089] This embodiment provides a shell assembly and a manufacturing method thereof. The housing assembly of this embodiment includes a ceramic base, an adhesion promoter layer, and a fiber-reinforced resin layer. The fiber-reinforced resin layer is connected to the ceramic base through an adhesion promoter layer. The thickness of the ceramic substrate is 0.7mm, the thickness of the adhesion promoter layer is 22μm, and the thickness of the fiber reinforced resin layer is 0.3mm.

[0090] The manufacturing method of the housing assembly of the present embodiment includes the following steps:

[0091] The zirconia ceramic base material is subjected to numerical control machining, cutting and grinding, and is thinned to a sheet shape with a thickness of 0.3 mm to obtain a ceramic base.

[0092] Clean the thinned ceramic substrate. The polyurethane adhesion promoter is evenly coated on the non-appearance surface of the ceramic substrate to form an adhesion promoter layer.

[00...

Embodiment 3

[0100] This embodiment provides a mobile phone, including the casing component, the display component and the circuit board provided by the first embodiment.

[0101] An installation space is defined between the display component and the casing component connected between the display component and the casing component. The circuit board is arranged in the installation space and electrically connected with the display component.

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Abstract

The invention relates to a shell assembly, a manufacturing method thereof and electronic equipment. The shell assembly comprises a ceramic matrix, an adhesion promoter layer and a fiber reinforced resin layer, wherein the fiber reinforced resin layer is connected with the ceramic matrix through the adhesion promoter layer. The fiber reinforced resin layer is arranged on the ceramic matrix, the overall density of the shell assembly can be reduced, for example, the overall relative density of the zirconia ceramic matrix shell can be reduced to 4.0, and light weight is achieved. In addition, the cost can be reduced by partially replacing the shell assembly with the fiber reinforced resin layer. Meanwhile, the fiber reinforced resin layer is good in toughness, so that the overall toughness of the shell assembly can be improved, the thickness of the shell assembly can be reduced under the condition that the strength is met, and lightening and thinning are achieved. Besides, according to the shell assembly, the fiber reinforced resin layer and the ceramic matrix are connected through the adhesion promoter layer, the connection firmness degree between the fiber reinforced resin layer and the ceramic matrix is greatly improved, and the falling phenomenon is avoided.

Description

technical field [0001] The invention relates to the field of housings of electronic products, in particular to a housing assembly, a manufacturing method thereof, and electronic equipment. Background technique [0002] After grinding and polishing, ceramic products have the advantages of soft touch, soft luster, and weather resistance and wear resistance. Therefore, in recent years, ceramic shells have been more and more used in electronic products, such as smartphone back covers and tablet computer back covers. , laptop casings, smart wearable device casings, wireless charger casings, smart home product casings, etc. Zirconia ceramics, in particular, have been used on a large scale due to their fine powder and outstanding impact resistance. [0003] However, due to the high density and high brittleness of ceramic materials, in order to improve the impact resistance of ceramic products, the thickness of ceramic products is often thicker, resulting in heavier weight. Among ...

Claims

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Application Information

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IPC IPC(8): B32B1/00B32B9/00B32B9/04B32B27/38B32B27/20B32B27/08B32B7/12B32B37/06B32B37/10B32B37/12B32B38/18H05K5/02
CPCB32B1/00B32B9/005B32B9/045B32B27/38B32B27/20B32B27/08B32B7/12B32B37/06B32B37/10B32B37/12B32B38/1866B32B38/1858H05K5/0217B32B2307/558
Inventor 梁少雄
Owner GUANGDONG XINXIU NEW MATERIAL CO LTD
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