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Heat-conducting composite material as well as preparation method and application thereof

A technology of heat-conducting composite materials and composites, which is applied in the direction of heat exchange materials, chemical instruments and methods, semiconductor devices, etc., and can solve the problems of inability to meet high heat accumulation, inability to meet heat conduction requirements, and low thermal conductivity between surfaces , to achieve the effect of overcoming thermal anisotropy, good thermal conductivity, and improving thermal conductivity between surfaces

Pending Publication Date: 2021-07-16
宁波材料所杭州湾研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Metal materials have good weldability, effective thermal conductivity and excellent bonding strength, but their thermal conductivity is limited and cannot meet the problem of high heat accumulation caused by increasing integration. For example, the thermal conductivity of copper is only 397W / mK, the thermal conductivity of aluminum is only 220W / mK
Thermally conductive materials such as graphite have high in-plane thermal conductivity, but their interplane thermal conductivity is low, and their thermal conductivity shows anisotropy, which makes the thermal conductivity of the prepared graphite-based composite materials also directional. The thermal conductivity is less than 10% of the in-plane thermal conductivity, and even the inter-plane thermal conductivity is 1% of the in-plane thermal conductivity, which cannot meet the thermal conductivity requirements of the use

Method used

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  • Heat-conducting composite material as well as preparation method and application thereof
  • Heat-conducting composite material as well as preparation method and application thereof
  • Heat-conducting composite material as well as preparation method and application thereof

Examples

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preparation example Construction

[0033] see Figure 1 to Figure 3 , the preparation method of the thermally conductive composite material, comprising the following steps:

[0034] S1: providing a composite body 100, the composite body 100 comprising a metal substrate 10 and a graphite layer 20 disposed on the surface of the metal substrate 10;

[0035] S2: Under vacuum and heating conditions, apply a first pressure F1 to the composite body 100 on the side wall of the composite body 100, so that the graphite layer 20 forms a plurality of graphite aggregates 202 arranged anisotropically, and at the same time The metal matrix 10 is melted and mixed with the graphite aggregate 202 to obtain the thermally conductive composite material, wherein the angle between the direction of the first pressure F1 and the direction of the surface of the metal matrix 10 is α, 0 °≤α≤60°.

[0036] In step S1, the material of the metal base 10 includes at least one of copper, aluminum, and silver, and the material of the graphite ...

Embodiment 1

[0071] Take a 60 μm thick aluminum foil, and spray atomized glue on the surface of the aluminum foil. Then pour the spherical graphite powder onto the atomized rubber layer, and blow off the excess graphite powder with a blower to form a graphite layer with a thickness of 40 μm, and the mass ratio of the graphite layer to the aluminum foil is 50:50 to obtain a graphite-aluminum composite . Put the graphite-aluminum composite body vertically into a hot-pressing mold and sinter in a vacuum one-way hot-pressing sintering furnace, and heat the temperature in the sintering furnace to 650°C at a heating rate of 10°C / min for sintering. for 60 minutes, the first pressure is 40 MPa, and the angle α between the direction of the first pressure and the direction of the surface of the metal substrate is 0°, and then cooled to room temperature with the furnace to prepare a thermally conductive composite material.

Embodiment 2

[0073] Take a copper foil with a thickness of 100 μm, and spray atomized glue on the surface of the copper foil. Then pour the flake graphite powder onto the atomized glue layer, and blow off the excess graphite powder with a blower to form a graphite layer with a thickness of 20 μm, and the mass ratio of flake graphite to copper foil is 40:60. Then, the flake graphite is subjected to rolling treatment, the rolling pressure is 0.5 MPa, and the rolling time is 1 minute, to form a graphite-copper composite.

[0074] Put the graphite-copper composite vertically into a hot-pressing mold and sinter in a vacuum one-way hot-pressing sintering furnace. Heat the temperature in the sintering furnace to 1000°C at a heating rate of 20°C / min for sintering. The holding time is for 60 minutes, the first pressure is 10 MPa, and the angle α between the direction of the first pressure and the direction of the surface of the metal substrate is 5°, and then cooled to room temperature with the fur...

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Abstract

The invention relates to a heat-conducting composite material and a preparation method and application thereof, and the preparation method comprises the following steps: providing a composite body which comprises a metal matrix and a graphite layer arranged on the surface of the metal matrix; and under the vacuum and heating conditions, first pressure is applied to the composite body from the side wall of the composite body, so that the graphite layer forms a plurality of graphite aggregates which are arranged in different directions, meanwhile, the metal matrix is molten and mixed with the graphite aggregates, and the heat-conducting composite material is obtained, wherein an included angle alpha between the direction of the first pressure and the surface of the metal matrix is greater than or equal to 0 degree and less than or equal to 60 degrees. The heat-conducting composite material prepared by the invention has good heat-conducting property in all directions.

Description

technical field [0001] The invention relates to the technical field of heat-conducting composite materials, in particular to a heat-conducting composite material, its preparation method and application. Background technique [0002] With the progress and development of science and technology, electronic devices continue to develop in the direction of high integration, high power, and high intelligence. The power and heat flux of high-power electronic devices increase by 5 to 8 times, which also brings about the problem of heat accumulation, which affects the normal operation and use of electronic devices, and may even burn the entire device. In order to avoid the high temperature problem caused by long-term operation and achieve efficient and stable heat dissipation, heat is currently mainly conducted through copper heat spreaders, aluminum heat dissipation materials, graphite high thermal conductivity sheets or composite material shells. [0003] Metal materials have good ...

Claims

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Application Information

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IPC IPC(8): C09K5/14H01L23/373
CPCC09K5/14H01L23/3735H01L23/3736H01L23/3738Y02E60/10
Inventor 薛晨马洪兵江南
Owner 宁波材料所杭州湾研究院
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