Circulating cooling system preparation method based on nanometer limited water pressure thermal effect

A technology of circulating cooling system and thermal effect, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as unfavorable large-scale application, unfavorable circulating refrigeration, low refrigeration efficiency, etc., and achieve high-efficiency working refrigeration effect, The effect of optimizing interaction strength and broadening the scope of application

Active Publication Date: 2021-07-13
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, the boiling point of water is too high for cyclic refrigeration near room temperature
In addition, water is used as a refrigerant, although the latent heat of phase change is large, but under the working pressure, the volume of water vapor generated is much larger than that of commercial refrigerants, resulting in excessive compression work, making the cooling efficiency of water as a refrigerant much lower than that of fluorochloro Expensive and solid material, not conducive to large-scale application

Method used

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  • Circulating cooling system preparation method based on nanometer limited water pressure thermal effect
  • Circulating cooling system preparation method based on nanometer limited water pressure thermal effect
  • Circulating cooling system preparation method based on nanometer limited water pressure thermal effect

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preparation example Construction

[0030] Such as figure 1 As shown, the present invention discloses a method for preparing a circulating cooling system based on nanometer confined hydraulic thermal effect, comprising the following steps:

[0031] Step 1: integrating the electronic chip that needs to be dissipated on the silicon wafer, and the end surface of the silicon wafer away from the electronic chip is provided with an edge groove;

[0032] Step 2: depositing a confined layer with good thermal conductivity in the groove of the silicon wafer;

[0033] Step 3: Prepare a rigid nanocolumn array on the surface of the silicon wafer, and invert it on the groove of the silicon wafer, so that the nanocolumn array on the silicon wafer is located in the groove of the silicon wafer and in the groove restricted layer contact;

[0034] Step 4: Cast an epoxy resin film in the groove of the silicon wafer, separate the silicon wafer and the silicon wafer after cooling, so that the epoxy resin film on the restricted laye...

Embodiment 1

[0040] A graphene layer is used as a confined layer, capped carbon nanotubes are used as nanopillars, water is used as a cooling medium, and organic material vinylidene fluoride (PVDF) is used as a piezoelectric film. By applying an external electric field, the piezoelectric film will deform and drive the nanopillars to move up and down as a whole. in room temperature( T 0 = 298 K) When we reduce the distance between the nanopillars and the confinement layer, water molecules undergo a phase transition from disorder to order, and the temperature of water increases under adiabatic conditions, and the rising heat can pass through the nanopillars slowly Dissipate out; when we quickly separate the nanopillars and the confined layer, the water molecules will undergo an order-to-disorder phase transition, and the temperature of the water will drop, thereby realizing the cooling of the electronic chip integrated on the silicon wafer. Estimated by computer simulation, the adiabatic ...

Embodiment 2

[0042] A graphene layer is used as a confined layer, capped carbon nanotubes are used as nanopillars, water is used as a cooling medium, and organic material vinylidene fluoride (PVDF) is used as a piezoelectric film. By applying an external electric field, the piezoelectric film will deform and drive the nanopillars to move up and down as a whole. When the system is operating at a lower temperature, such as T 0=250 K, when we reduce the distance between the nanopillars and the confined layer, water molecules undergo a phase transition from disorder to order, which will generate a temperature rise, and the increased heat can be slowly released through the nanopillars Going out, when we rapidly increase the distance between the nanopillars and the confined layer, the water molecules will undergo an order-to-disorder phase transition, and the temperature of the water will drop, thereby realizing the cooling of the electronic chips integrated on the silicon wafer. Estimated by ...

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Abstract

The invention discloses a circulating cooling system preparation method based on a nanometer limited water pressure thermal effect, and the method comprises the steps: firstly enabling an electronic chip needing to be cooled to be integrated on a silicon wafer, and enabling the silicon wafer to be provided with a groove; depositing a limited layer in the groove; secondly, preparing a rigid nano-pillar array on the surface of the silicon wafer, and enabling the nano-pillar array to be located in the groove of the silicon wafer and to be in contact with the limited layer; casting an epoxy resin film in the groove, cooling, separating the silicon wafer and the silicon wafer, and filling the obtained nano micropore array with a liquid refrigerant through vapor pressure; and finally, depositing a piezoelectric film on the silicon wafer. The piezoelectric film drives the nano-columns to move, so that pressurization and decompression of the refrigerating medium are achieved, water limited in the nano-micropores is induced to generate phase change, and then refrigeration is achieved. The refrigerating system has the advantages of large adiabatic temperature change, wide working temperature range, clean and pollution-free refrigerating medium and the like.

Description

technical field [0001] The invention relates to the field of cooling of electronic components, in particular to a preparation method of a circulating cooling system based on the nano-limited water pressure heat effect. Background technique [0002] With the continuous development of science and technology and social economy, people's demand for refrigeration continues to increase. The traditional refrigeration technology based on gas compression is not only inefficient, but also the extensive use of halogenated hydrocarbon refrigerants has caused serious ozone layer hole effect and greenhouse effect. In addition, with the rapid development of large-scale integrated circuit technology, electronic chip technology is constantly advancing towards low power consumption, high performance, and miniaturization, and the heat flux density of chips is getting higher and higher. bottlenecks in device performance. Solving these problems urgently requires the development of more advance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/473
CPCH01L23/473H01L21/4882
Inventor 张助华赵志强轩啸宇胡知力
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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