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Tape casting method for ceramic substrate

A ceramic substrate and tape casting technology is applied in the field of ceramic material manufacturing, which can solve the problems of waste of resources, affecting the production quality and use value of ceramic substrates, uneven surface of ceramic substrates, etc., so as to achieve easy crushing, improve production quality and use value , clay crushed fine effect

Inactive Publication Date: 2021-07-13
王真真
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. When crushing pottery clay, the crushing equipment used only increases the time for crushing pottery clay, and does not use multi-stage grinding methods with different effects on pottery clay, so that the grinding effect of pottery clay is average. After mixing pottery clay powder with Larger particles of clay are prone to appear in the slurry formed by mixing other chemicals, so that the surface of the sintered ceramic substrate is uneven, thereby reducing its use value and causing resource waste;
[0005] 2. When the existing clay is crushed, the crushing equipment used only crushes the clay, and does not sieve the clay multiple times during the crushing process, so that the clay powder contains some impurity particles that are difficult to crush again. These impurity particles will affect the production quality and use value of ceramic substrates

Method used

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  • Tape casting method for ceramic substrate
  • Tape casting method for ceramic substrate
  • Tape casting method for ceramic substrate

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Embodiment Construction

[0036] In order to make the technical means realized by the present invention, creative features, goals and effects easy to understand, the following combination Figure 1 to Figure 7 , to further elaborate the present invention.

[0037] A ceramic substrate tape casting method, which uses a ceramic substrate tape casting equipment, the ceramic substrate tape casting equipment includes a base 1 and a grinding device 2, characterized in that: using the above ceramic substrate tape casting equipment for ceramic The specific method of grinding and pulverizing the raw material clay of the substrate is as follows:

[0038] Step 1. Preparatory work: debug the ceramic substrate tape casting equipment, and prepare the raw material clay of the ceramic substrate;

[0039]Step 2: Grinding and pulverizing the pottery clay: Pour an appropriate amount of the pottery clay prepared in step 1 into the grinding device 2, and start the grinding device 2 to perform multi-stage grinding, crushing...

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Abstract

The invention relates to a tape casting method for a ceramic substrate. Tape casting equipment for the ceramic substrate is used in the tape casting method. The tape casting equipment for the ceramic substrate comprises a base and a grinding device, wherein the grinding device is arranged on the upper surface of the base. The tape casting method can solve the problems that the used crushing equipment only prolongs the time for crushing argil, and the argil is not ground in a multi-stage grinding mode with different effects, so that the grinding effect of the argil is not very good; and the used crushing equipment only crushes the argil, and does not screen the argil in the crushing process for many times, so that argil powder contains some impurity particles which are difficult to crush again, and the impurity particles affect the manufacturing quality and the use value of the ceramic substrate.

Description

technical field [0001] The invention relates to the field of ceramic material manufacturing, in particular to a tape casting method for a ceramic substrate. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. Capability, therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology. For the production of ceramic substrates, it is necessary to mix clay with binders, plasticizers, dispersants, and solvents to form a slurry with a certain viscosity, and use a casting machine...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C19/00B02C21/00B02C23/16B28B1/29B28B11/14B28B11/24
CPCB02C19/0056B02C21/00B02C23/16B02C2023/165B28B1/29B28B11/14B28B11/243
Inventor 王真真
Owner 王真真
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