Epoxy resin composite material and preparation method thereof

An epoxy resin and composite material technology, applied in the chemical field, can solve the problems of limited application scope of epoxy resin, poor heat resistance, high crosslinking density, etc., achieve good economic benefits and market prospects, reduce edge collapse rate, improve Yield effect

Inactive Publication Date: 2021-07-06
无锡协芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin has high cross-linking density after curing, and has shortcomings such as brittleness, poor heat resistance, and weak fatigue resistance, which limit the application range of epoxy resin.
At present, the performance of epoxy resin can no longer meet the ever-changing social needs, but people fill the epoxy resin matrix with rubber, plastic, inorganic nanomaterials, etc. to improve the thermal energy, light energy, mechanical properties, etc. of epoxy resin, making it Adapt to the development of modern technology

Method used

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  • Epoxy resin composite material and preparation method thereof

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preparation example Construction

[0025] The preparation method of epoxy resin composite material as above, comprises the following steps:

[0026] (1) weigh the polyamide-based rubber elastic body powder and epoxy resin of corresponding weight by proportioning, first fully stir the two;

[0027] (2) Then add the corresponding weight of polythiol curing agent and stir thoroughly for about 2 minutes.

[0028] The epoxy resin composite material provided by the invention can significantly reduce the edge chipping rate, crack rate and notch rate of the silicon wafer during the production process of the silicon wafer, can significantly improve the yield rate of the silicon wafer production, and has good economic benefits and market prospects.

Embodiment 1

[0030] Take 100g epoxy resin, 10g polyamide rubber elastomer powder, and 100g polythiol curing agent.

[0031] Mix 100g of epoxy resin and 10g of polyamide-based rubber elastomer powder and stir evenly; then add 100g of polythiol curing agent and stir fully again for about 2 minutes; quickly and evenly coat the surface on clean, dry, rough glass On the other hand, the operating time must be less than 10 minutes; for the silicon wafer bonding, briquetting and curing process, the curing time must be greater than 6 hours, ready for cutting.

Embodiment 2

[0033] Take 100g epoxy resin, 30g polyamide rubber elastomer powder, and 100g polythiol curing agent.

[0034] Mix 100g of epoxy resin and 30g of polyamide-based rubber elastomer powder and stir evenly; then add 100g of polythiol curing agent and stir fully again for about 2 minutes; quickly and evenly coat the surface on clean, dry, rough glass On the other hand, the operating time must be less than 10 minutes; for the silicon wafer bonding, briquetting and curing process, the curing time must be greater than 6 hours, ready for cutting.

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Abstract

The invention provides an epoxy resin composite material which comprises epoxy resin and a powder material, the mass ratio of the epoxy resin to the powder material is 10: 1-2: 1, and the average particle size of the powder material is 1-15 microns; the epoxy resin is one or more of bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin or bisphenol F type epoxy resin; the powder material is polyamide rubber elastomer powder; the epoxy resin composite material further comprises a curing agent, and the curing agent is polymercaptan. According to the epoxy resin composite material, the edge breakage rate, the crack rate and the notch rate of the silicon wafer in the silicon wafer production process can be remarkably reduced, the yield of silicon wafer production can be remarkably improved, and good economic benefits and market prospects are achieved.

Description

technical field [0001] The invention relates to the field of chemistry, in particular to an epoxy resin composite material and a preparation method thereof. Background technique [0002] Epoxy resins generally refer to organic compounds containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weights are not high. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble polymers with a three-way network structure. All polymer compounds containing epoxy groups in their molecular structure are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties, it has excellent bonding strength to the sur...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L77/00C08G59/66C09J163/02C09J177/00C09J11/08H01L21/02
CPCC08L63/00C08G59/66C09J163/00C09J11/08H01L21/02002C08L77/00
Inventor 马国庆孟涛叶洪英
Owner 无锡协芯半导体科技有限公司
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