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LED with high heat dissipation metal substrates and their preparation methods

A metal substrate, high heat dissipation technology, applied in metal material coating process, coating and other directions, can solve problems such as high cost, reduced thermal conductivity, complex process, etc., to improve insulation performance, improve thermal conductivity, adhesion strong effect

Active Publication Date: 2022-08-09
HANGZHOU ANYU TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this technical solution is relatively complicated in process, high in cost, and will form micropores in the insulating layer, and the existence of micropores will reduce its thermal conductivity

Method used

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  • LED with high heat dissipation metal substrates and their preparation methods
  • LED with high heat dissipation metal substrates and their preparation methods
  • LED with high heat dissipation metal substrates and their preparation methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] Example 1: A high heat dissipation metal substrate for LED:

[0086] This embodiment provides a high heat dissipation metal substrate for LED, and the preparation method includes:

[0087] S1: Prepare fluorine-containing silane coupling agent modified graphene oxide: prepare a 2% mass fraction of a fluorine-containing silane coupling agent represented by formula (1) in absolute ethanol solution, according to the weight ratio of coupling agent to graphene oxide It is 2:1, slowly added to 4mg / mL graphene oxide aqueous solution within 2h, at ultrasonic frequency 35KHz, ultrasonic intensity 0.5W / cm 2 , Disperse for 1.5h at a stirring rate of 150r / min until the system is homogeneous, then adjust the pH of the solution to 3.0 with 2mol / L hydrochloric acid, raise the temperature to 50°C for 8h at 5°C / min, and then raise the temperature to 70°C for 2h reaction, filter with Washed with pure water, dried at 50°C for 45min, and ground to a particle size of not more than 100μm, th...

Embodiment 2

[0106] Example 2: A high heat dissipation metal substrate for LED:

[0107] This embodiment provides a high heat dissipation metal substrate for LED, and the preparation method includes:

[0108] S1: Prepare fluorine-containing silane coupling agent modified graphene oxide: prepare a 2.5% mass fraction of a fluorine-containing silane coupling agent represented by formula (1) in anhydrous ethanol solution, according to the weight ratio of coupling agent to graphene oxide It is 2.5:1, slowly added to the graphene oxide aqueous solution with a concentration of 3.5mg / mL within 1.5 hours, at an ultrasonic frequency of 50KHz and an ultrasonic intensity of 0.6W / cm 2 , Disperse at 180r / min for 1h until the system is homogeneous, then adjust the pH of the solution to 3.2 with 2mol / L hydrochloric acid, raise the temperature to 55°C for 6h at 4°C / min, then raise the temperature to 70°C for 3h, filter and wash with pure water , dried at 55 °C for 30 min, and ground to a particle size of ...

Embodiment 3

[0127] Embodiment 3: A high heat dissipation metal substrate for LED:

[0128] This embodiment provides a high heat dissipation metal substrate for LED, and the preparation method includes:

[0129] S1: Preparation of modified graphene oxide: prepare a 2.5% mass fraction of (3,3,3-trifluoropropyl)trimethoxysilane in anhydrous ethanol solution, according to the weight ratio of coupling agent to graphene oxide is 2.5 : 1, slowly added to the graphene oxide aqueous solution with a concentration of 3.5mg / mL within 1.5 hours, at an ultrasonic frequency of 50KHz and an ultrasonic intensity of 0.6W / cm 2 , Disperse at 180r / min for 1h until the system is homogeneous, then adjust the pH of the solution to 3.2 with 2mol / L hydrochloric acid, raise the temperature to 55°C for 6h at 4°C / min, then raise the temperature to 70°C for 3h, filter and wash with pure water , dried at 55 °C for 30 min, and ground to a particle size of not more than 100 μm;

[0130] S2: Preparation of ceramic slurr...

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Abstract

The invention relates to the technical field of LED metal substrate preparation, in particular to a high heat dissipation metal substrate for LED and a preparation method thereof. , cooled to room temperature to form a ceramic layer; the ceramic layer is immersed in the sol until the surface of the ceramic layer is smooth, graded, dried and heat-treated; the ceramic slurry contains modified graphite oxide by beryllium fluoride and fluorine-containing silane coupling agent A sintering aid composed of alkene. The high heat dissipation metal substrate for LED disclosed in the present invention has high thermal conductivity, excellent insulation performance, high bonding force and dense material.

Description

technical field [0001] The invention relates to the technical field of LED metal substrate preparation, in particular to a high heat dissipation metal substrate for LED and a preparation method thereof. Background technique [0002] LED is a thermal element, its core is a P-N junction electroluminescent device, which finally emits light through a series of electro-optical conversion processes, but its by-product heat is useless to it, and if the heat cannot be quickly dissipated, the chip temperature may rise. This will seriously affect its performance, mainly in the following aspects: as the temperature increases, the spectrum of the chip is red-shifted, resulting in a decrease in light conversion efficiency; as the temperature of the chip increases, the luminous intensity decreases. Studies have shown that the luminous efficiency of the chip decreases rapidly with the increase of temperature, especially The luminous amount of blue, green and white LED devices decreases lin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/64C04B35/10C23C26/00
CPCC04B35/64C04B35/62222C04B35/10C23C26/00C04B2235/445C04B2235/425C04B2235/3873C04B2235/447
Inventor 方涌章贤骏雷诺成朱魁
Owner HANGZHOU ANYU TECH CO LTD
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