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EB curing copper-clad aluminum substrate heat dissipation coating

A technology of heat-dissipating coatings and aluminum substrates, applied in the direction of polyester coatings, epoxy resin coatings, polyurea/polyurethane coatings, etc., can solve the problems of affecting the transparency of coatings, affecting the texture and texture of materials, and insufficient environmental protection, etc., to achieve Improve heat dissipation effect, wide phase change temperature range, and high phase change latent heat effect

Active Publication Date: 2021-06-15
GUANGDONG HEYGEY LIGHT CURING MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the addition of thermally conductive fillers improves the heat dissipation performance of the adhesive film to a certain extent, the addition of thermally conductive materials such as metal powder or metal oxide or carbon black not only affects the transparency of the coating but also affects the original texture and texture of the material. Often contain solvents, insufficient environmental protection

Method used

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  • EB curing copper-clad aluminum substrate heat dissipation coating
  • EB curing copper-clad aluminum substrate heat dissipation coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] (1) 60 parts of paraffin, 30 parts of polyethylene glycol, and 45 parts of octadecane are heated and melted, and then 25 parts of HEMA, 50 parts of MMA and 25 parts of HDDA are added and mixed uniformly to form an oil phase;

[0038] (2) Add 3 parts of SDS to 100 parts of water, stir evenly, adjust the pH value to 9, and form an aqueous phase;

[0039] (3) Blend 100 parts of the oil phase and 100 parts of the water phase, and shear at high speed to form a stable emulsion, react at 60°C for 10 hours under a nitrogen atmosphere, centrifuge the product, wash, and dry to obtain phase-change capsule powder.

Embodiment 2

[0041] (1) 400 parts of paraffin, 200 parts of polyethylene glycol, and 300 parts of octadecane are heated and melted, and then 25 parts of HEMA, 50 parts of MMA and 25 parts of HDDA are added and mixed uniformly to form an oil phase;

[0042] (2) Add 6 parts of SDS to 300 parts of water, stir evenly, adjust the pH value to 7, and form an aqueous phase;

[0043] (3) Take 100 parts of oil phase and 300 parts of water phase to blend, and shear at high speed to form a stable emulsion, react at 80°C for 7 hours under nitrogen atmosphere, centrifuge the product, wash and dry to obtain phase change capsule powder.

Embodiment 3

[0045] (1) 200 parts of paraffin, 120 parts of polyethylene glycol, and 150 parts of octadecane were heated and melted, and then 25 parts of HEMA, 50 parts of MMA and 25 parts of HDDA were added and mixed uniformly to form an oil phase;

[0046] (2) Add 10 parts of CTAB to 200 parts of water, stir evenly, adjust the pH value to 8, and form an aqueous phase;

[0047] (3) Take 100 parts of the oil phase and 200 parts of the water phase to blend, and shear at high speed to form a stable emulsion, react at 80°C under nitrogen atmosphere for 7 hours, centrifuge the product, wash, and dry to obtain phase-change capsule powder.

[0048] Phase Change Capsule Example 4

[0049] (1) 90 parts of paraffin, 60 parts of polyethylene glycol, and 60 parts of octadecane are heated and melted, and then 25 parts of HEMA, 50 parts of MMA and 25 parts of HDDA are added and mixed uniformly to form an oil phase;

[0050] (2) Add 1 part of OP-10 to 100 parts of water, stir evenly, adjust the pH valu...

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Abstract

The invention belongs to the technical field of aluminum-based copper-clad plates, and particularly relates to an EB curing copper-clad aluminum-based plate heat dissipation coating which comprises the following components in parts by weight: 20-30 parts of acrylic resin, 10-20 parts of active monomers, 30-60 parts of phase change capsules, 0.1-0.5 part of a flatting agent, 0.1-0.5 part of a dispersing agent, 0.1-0.5 part of a defoaming agent, 5-10 parts of absolute ethyl alcohol and 10-20 parts of modified inorganic powder. According to the EB curing copper-clad aluminum substrate heat dissipation coating, the phase change capsule is added, heat dissipated by an aluminum-based copper-clad plate can be rapidly absorbed and further dissipated through the surface of the coating, and the phase change capsule is obtained by coating an organic phase change material with an organic matter and has good compatibility with a coating system; and the transparency of the coating and the original texture and texture of the material are not influenced while the heat dissipation effect is improved, excessive solvents do not need to be added, and the method is more environment-friendly.

Description

technical field [0001] The invention belongs to the technical field of aluminum-based copper-clad laminates, and in particular relates to an EB-cured heat-dissipating coating for copper-clad aluminum substrates. Background technique [0002] Aluminum-based copper clad laminate, or aluminum substrate, is a metal-based copper-clad laminate with good heat dissipation function. It is a kind of raw material for aluminum-based printed circuit boards, and it is also widely used in LED lighting products. Generally, the aluminum-based single-sided board is composed of three layers, namely the circuit layer (copper foil), the insulating layer and the aluminum base layer. The production of the circuit layer is to etch the copper plate to form a printed circuit, which is used to realize the assembly and connection of the device. The main process is grinding plate-film-exposure-development-etching-film fading. Aluminum is a highly active metal, and it is easy to react with the acidic / al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D175/14C09D163/10C09D133/04C09D167/06C09D7/65C09D7/62C09D7/63
CPCC09D175/14C09D163/10C09D133/04C09D167/06C09D7/65C09D7/62C09D7/63C08L2205/035C08L67/06C08L91/06C08L71/02C08K9/06C08K3/34C08K9/10C08K5/01C08L63/10C08L75/14C08L33/04
Inventor 赖俊伟彭健华吴勇
Owner GUANGDONG HEYGEY LIGHT CURING MATERIALS
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