Heat sink structure design method based on contour extraction

Abstract

The invention relates to a heat sink structure design method based on contour extraction. The method comprises the following steps: firstly, establishing a two-dimensional heat transfer model of a traditional cylindrical micro-pin-fin heat sink, carrying out numerical calculation on the model, and analyzing flow characteristics and heat transfer characteristics; extracting a two-dimensional contour of a low-flow-speed area in the speed cloud picture, and designing a novel three-dimensional model of the micro-pin-fin heat sink based on the two-dimensional contour; and then carrying out numerical calculation and comparative analysis on the designed novel micro-pin-fin heat sink three-dimensional model and the traditional MCFHS three-dimensional model under the same condition. The novel micro pin fin designed according to the design method has a larger cross sectional area and a streamline shape, obtains a larger fluid-solid contact heat exchange area, improves heat transfer efficiency, eliminates eddy current in a circular pin fin wake flow area in a traditional MCFHS, reduces pressure loss, and is better in flowing property and higher in heat transfer efficiency. The overall cooling performance of the heat sink is improved.

Description

technical field [0001] The invention belongs to the technical field of thermal energy engineering, and in particular relates to a structural design optimization method suitable for microchannel heat sinks of high-power electronic integrated devices. Background technique [0002] With the rapid development of Micro Electro-Mechanical System (MEMS) toward high integration and miniaturization, the energy density in MEMS continues to increase, accompanied by the continuous increase of chip heat inside the system, which makes its The heat dissipation performance requirements of thermal management devices are becoming more and more stringent. In 1981, the introduction of Microchannel heat sink (MCHS) provided an efficient cooling technology for high-power electronic equipment. In the follow-up research on MCHS, researchers obtained better cooling performance by optimizing its size parameters, inner wall shape, channel structure, etc. [0003] Compared with traditional MCHS, Micr...

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Problems solved by technology

[0004] However, through the analysis of the heat transfer characteristics and flow characteristics of the existing MCFHS, it is found that the heat flux in the wake area downstream of the circular pin fin is low, which indicates that compared with the stronger flow heat transfer efficiency outside the wake area, The flow and cooling capacity of the wake area is poor, coupled with the pressure loss caused by the eddy current caused by flow separation, the heat dissipation performance of MCFHS is difficult to meet the heat dissipation problem of MEMS with higher energy density

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