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Filler with low dielectric constant, epoxy composite material and preparation method thereof

A low dielectric constant, composite material technology, applied in the field of composite materials, can solve the problems of low dielectric constant, poor hydrothermal stability and thermal stability, and reduce the dielectric constant of epoxy resin, etc.

Active Publication Date: 2021-06-08
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a filler with a low dielectric constant, an epoxy-based composite material and a preparation method thereof, so that the modified zeolite coated with mesoporous silica can be better dispersed in the epoxy resin matrix, and utilize The porous structure and core-shell structure of the modified zeolite coated with mesoporous silica allow the epoxy resin to enter the porous structure through the mesoporous channels, improve the interfacial compatibility between inorganic particles and epoxy resin, and improve the mesoporous silica The problem of poor hydrothermal stability and thermal stability exists, and the hierarchical porous structure of the modified zeolite coated with mesoporous silica can introduce air, thereby effectively reducing the dielectric constant of the epoxy resin

Method used

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  • Filler with low dielectric constant, epoxy composite material and preparation method thereof
  • Filler with low dielectric constant, epoxy composite material and preparation method thereof
  • Filler with low dielectric constant, epoxy composite material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0055]In the first step, put the zeolite powder with a particle size ranging from 100 mesh to 500 mesh in a muffle furnace for 3 hours at 200°C, add 2.5g of zeolite powder to 75g of deionized aqueous solution, stir at room temperature for 10min, and transfer to ultrasonic dispersion Ultrasonic dispersion for 1h, and keep stirring. Add 75g of absolute ethanol, 1.4g of template agent cetyltrimethylammonium bromide and 0.24g of sodium hydroxide. After continuing the ultrasonic dispersion for 30 minutes, slowly add 12.5 g of ethyl orthosilicate dropwise to the mixed solution, and place the reaction vessel in a water bath, and keep the temperature at 40°C for 4 hours. After the reaction, the resulting mixture was filtered, washed, and moved to an oven for drying. Transfer it to a muffle furnace at 600 degrees Celsius and bake it for 4 hours to obtain a modified zeolite with a mesoporous silica-coated structure, that is, a low dielectric constant filler.

[0056] In the second ste...

Embodiment 2 5

[0058] The difference from Example 1 is:

[0059] In the second step, the epoxy resins with low dielectric constant fillers added to 3g, 5g, 7g or 10g and 100g were physically blended through a high-speed disperser, and vacuumized to obtain mesoporous silica coatings. For the modified zeolite / epoxy resin mixture of the coating structure, 70g of epoxy curing agent and 0.5g of accelerator were added to the mixture, and the resulting mixture was poured into a mold, cured at 80 degrees Celsius for 2 hours, and cured at 120 degrees Celsius for 4 hours. That is, an epoxy composite material doped with a modified zeolite coated with silica is prepared.

[0060] First, the zeolite powder is heat-treated and modified by heat treatment, and the roasted zeolite is coated and modified by mesoporous silica to obtain a modified zeolite with a mesoporous silica-coated structure, that is, a low dielectric constant filler. Mesoporous silica has huge specific surface area and pore volume, adjus...

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Abstract

The invention discloses a filler with a low dielectric constant, an epoxy-based composite material and a preparation method thereof, belongs to the technical field of composite materials, and comprises the preparation of the filler with the low dielectric constant and the preparation of the epoxy-based composite material with the low dielectric constant. The preparation method comprises the following steps: roasting zeolite powder at a high temperature, dispersing the roasted zeolite powder in deionized water, adding absolute ethyl alcohol, a template agent and a sodium hydroxide solution into a zeolite dispersion liquid, slowly dropwise adding a calculated amount of tetraethoxysilane into a mixed solution, and after the reaction is finished, filtering and washing the obtained mixture, and transferring the mixture into a drying oven for drying; roasting the product at high temperature to obtain the low-dielectric-constant filler; stirring and dispersing the low-dielectric-constant filler in epoxy resin at a high speed, adding a curing agent and an accelerant, and vacuumizing an obtained epoxy compound; pouring the epoxy compound into a mold, and heating and curing to obtain the epoxy composite material with low dielectric constant. The composite material has the beneficial effects that the dielectric constant of the composite material is effectively reduced, and the strength of the composite material is improved.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing an epoxy composite material with high dielectric properties doped with mesoporous silica-coated structure zeolite. Background technique [0002] Epoxy resin and epoxy curing agent can produce a highly cross-linked three-dimensional network structure after curing. The network structure endows it with excellent mechanical properties, electrical insulation, adhesion, etc. Because of its excellent comprehensive properties, epoxy resin is Widely used in the electronics industry (packaging and circuit boards), aerospace, microelectronic devices, advanced composite material substrates, adhesives and coatings and other fields. Due to the gradual development of integrated circuit electronic devices towards lightweight, multi-functional and high-frequency, epoxy resins with low dielectric constant and dielectric loss will play an increasingly important ro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/10C08K7/26C08L63/02
CPCC08K9/10C08K7/26C08K2201/005C08L63/00
Inventor 王磊李为立吴继明汪丽君胡振文卢文广张毅枫陈立庄
Owner JIANGSU UNIV OF SCI & TECH
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