Water-based cutting fluid for diamond wire cutting and preparation method and use method thereof

Abstract

The invention relates to a water-based cutting fluid for diamond wire cutting and a preparation method and a use method thereof. The cutting fluid is mainly prepared from the following components in parts by weight: 8-33 parts by weight of silicone modified polyether; 3-7 parts by weight of a silane hydrolysis inhibiting stabilizer; and the balance of water, wherein the total weight part is 100. By implementing the embodiment of the invention, the cutting fluid has the following beneficial effects that the cutting fluid has a low-foam self-defoaming function, and a defoaming agent component does not need to be additionally added; the silicon modified polyether can be subjected to hydrolysis endothermic reaction on a cutting contact interface, and heat which cannot be taken away in time in the cutting process is balanced; meanwhile, the hydrolyzed silicon hydroxyl has a strong adsorption effect and can play roles in protecting the diamond wire, enhancing the lubricating property, reducing the cutting resistance and reducing the wire breakage probability; the dispersion of silicon powder is enhanced and the silicon powder is enabled not to be agglomerateand, active sites on the surface of the silicon powder are adsorbed and combined in time so that the problem of spontaneous combustion caused by high reaction activity of the filter-pressing silicon powder is avoided.

Description

technical field [0001] The invention relates to a water-based cutting fluid for wire cutting, in particular to a water-based cutting fluid for diamond wire cutting hard and brittle materials. Background technique [0002] The production process of silicon wafers for solar photovoltaic cells has gone through the following stages in turn: inner circle cutting process stage, mortar straight steel wire multi-wire cutting process stage, mortar structure wire multi-wire cutting process stage, diamond wire multi-wire cutting process stage , since 2010, silicon wafer production enterprises have conducted experimental research on diamond wire multi-wire cutting. With the breakthrough of (wet black silicon texturing process), the diamond wire cutting process has developed explosively, replacing the mortar multi-wire cutting process. The comprehensive promotion of the diamond wire multi-wire cutting process is due to its specific advantages: ①The cutting process time is short, which i...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the embodiments of the present invention is that, in view of the more stringent cutting processes such as the thinner diamond wire diameter, high cutting speed, and large-scale silicon wafers, the silicon powder particle size is smaller and the silicon powder is smaller during the cutting process. The more difficult it is to disperse, the easier it is to cause contamination. At the same time, the yield indicators such as cutting silicon wafer lines, TTV, and edge chipping are getting worse.

Images