High-performance single-component organic silicon modified epoxy heat-conducting material and preparation method thereof

A heat-conducting material and organosilicon technology, which is applied in the field of high-performance single-component organosilicon-modified epoxy heat-conducting materials and its preparation, can solve the problems of unsatisfactory material adhesion, service stability, and reduced mechanical properties, and achieve good performance. Effect of heat dissipation, good bond strength and toughness, good thermal conductivity and mechanical properties

Pending Publication Date: 2021-06-01
江苏晶河电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, there are many types of thermal interface materials on the market, such as thermal silicone grease, thermal gel, thermal potting glue, phase change thermal conductivity materials, etc., but the popular thermal interface materials on the market are mainly silicone materials with a large amount of Thermally conductive filler, while having good thermal conductivity, greatly reduces the mechanical properties and cannot satisfy the adhesion and long-term service stability of the material

Method used

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  • High-performance single-component organic silicon modified epoxy heat-conducting material and preparation method thereof
  • High-performance single-component organic silicon modified epoxy heat-conducting material and preparation method thereof

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preparation example Construction

[0047] A method for preparing a high-performance single-component organosilicon-modified epoxy thermally conductive material, comprising the following steps;

[0048] (ⅰ) Drying of thermally conductive powder

[0049] Bake the conductive powder at 60°C for 60h-80h to remove moisture;

[0050] (ii) The particle size of the thermally conductive powder is extremely matched

[0051] The particle size of the heat-conducting powder is perfectly matched, and the heat-conducting powder of three particle sizes, large, medium and small, is pre-mixed according to the weight ratio of 8:6:1, so that the heat-conducting powder of three different particle sizes is initially mixed;

[0052] (Ⅲ) Thermally conductive powder coating

[0053] Surface treatment is performed on the powder obtained in step (ii) by a wet method to obtain a thermally conductive powder coated with a titanate coupling agent;

[0054] (ⅳ) mixed

[0055] First, fully mix the silicone-modified epoxy resin with the cros...

Embodiment 1～3

[0057] (1) Prepare raw materials

[0058] a. Silicone modified epoxy resin with a viscosity of about 90cps;

[0059] b. Methyl hexahydrophthalic anhydride;

[0060] c. Dicyandiamide accelerator;

[0061] d. Polypropylene glycol diglycidyl ether;

[0062] e. Titanate coupling agent KR-TTS;

[0063] f. Thermally conductive powder;

[0064] Among them: f1 zinc oxide powder (average particle size 0.6μm);

[0065] f2 alumina powder (average particle size 25μm);

[0066] f3 Aluminum powder (average particle size 60μm).

[0067] The above-mentioned heat-conducting powder f that has been dewatered is mixed according to the ratio shown in Table 1, and then the surface of the mixed powder is treated by wet method, so that the surface is coated with a layer of titanate coupling Agent e thermal conductive powder.

[0068] Put the above components a, b, c, d in proportion (see Table 1 for the specific components and their ratios) into a high-speed disperser for 10 to 20 minutes of ...

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Abstract

The invention discloses a high-performance single-component organic silicon modified epoxy heat-conducting material and a preparation method thereof. The heat-conducting material is prepared from organic silicon modified epoxy resin, a cross-linking agent, an accelerant, a diluent, a coupling agent and heat-conducting powder according to a certain mass ratio. The preparation method of the heat-conducting material comprises the following steps: i) drying heat-conducting powder; (ii) polar matching the particle size of the heat-conducting powder; iii) coating the heat-conducting powder; and iv) mixing and the like. The prepared heat-conducting material has good heat conduction performance and mechanical performance with a substrate, the reliability under long-term working conditions can be guaranteed, the bonding strength and toughness between a cooling fin for a communication RRU made of the heat-conducting material and the substrate are good, and meanwhile the heat-conducting material has good heat dissipation performance.

Description

technical field [0001] The invention belongs to the field of thermally conductive interface organic materials, and in particular relates to a high-performance single-component organosilicon-modified epoxy thermally conductive material and a preparation method thereof. Background technique [0002] With the development of mobile networks, the 5G era has arrived, and new services and applications are emerging one after another. Higher frequencies bring higher data transmission speeds, and the number of network base stations and antenna arrays has multiplied, but the design space size is getting smaller and smaller. The functions of equipment products become more complex and powerful, and the power consumption increases accordingly. If the heat energy generated during the use of components cannot be dissipated from the inside in time, the increase in temperature will slow down its operation speed and shorten its life. Therefore, how to effectively remove a large amount of heat...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 王晶杨福河
Owner 江苏晶河电子科技有限公司
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