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Heat conductive composite material with high volume fraction and preparation method thereof

A heat-conducting composite material with a high volume fraction technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of difficult dispersion of fillers, poor heat dissipation, high energy consumption, etc., and achieve excellent thermal conductivity and mechanical properties. Improved mechanical properties and high production efficiency

Inactive Publication Date: 2014-10-29
SOUTHWEAT UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a high volume fraction thermally conductive composite material and its preparation method. The deficiencies of low material thermal conductivity and poor heat dissipation effect; overcome the technical problems of large energy consumption and high cost in the preparation process, and are difficult to apply to industrial production; provide a simple and efficient method for thermally conductive composite materials. The method of the present invention can Directly prepare thermally conductive composite materials with high volume fraction carbon-based micro-nano fillers, significantly improve the mechanical properties of polymer materials, and at the same time endow polymer materials with many new functions, especially in terms of high thermal conductivity of materials, and realize multifunctional high-strength composite materials , and can meet the actual requirements of mass production

Method used

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  • Heat conductive composite material with high volume fraction and preparation method thereof
  • Heat conductive composite material with high volume fraction and preparation method thereof

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Embodiment 1

[0038] A heat-conducting composite material with a high volume fraction, which is composed of: 97wt% carbon nanotubes (single-walled carbon nanotubes or multi-walled carbon nanotubes, the same hereinafter) and 3wt% polytetrafluoroethylene.

[0039] The preparation method of the high volume fraction thermally conductive composite material, the steps are:

[0040] a. Put 97wt% of carbon-based filler and 3wt% of polytetrafluoroethylene into a blast oven, and blow dry at a temperature of 120°C for 15h;

[0041] b. Put the fully dried carbon-based filler powder and polymer binder powder into a high-speed multifunctional pulverizer, stir and mix at a high speed for 2 minutes, and the stirring rate is 25,000 rpm to obtain a fully mixed modeling powder;

[0042] c. Put the fully mixed molding powder evenly into the molding mold, and keep the mold with the molding powder at a temperature of 340°C for 2 hours; at the same time, keep the molding mold with the mixed molding powder at a pr...

Embodiment 2

[0046] The preparation process of the high volume fraction heat-conducting composite material in this example refers to Example 1. Compared with Example 1, the process parameters are basically the same, only the proportion of materials is changed. The mass percentage proportion of the high volume fraction heat-conducting composite material is: Carbon nanotube 94wt%, polytetrafluoroethylene 6wt%.

[0047] The performance test data of the obtained high volume fraction thermally conductive composite material is as follows: thermal conductivity: 13.2Wm -1 K -1 , Compressive strength: 35.68MPa, tensile strength: 10.93MPa.

Embodiment 3

[0049] The preparation process of the high volume fraction heat-conducting composite material in this example refers to Example 1. Compared with Example 1, the process parameters are basically the same, only the proportion of materials is changed. The mass percentage proportion of the high volume fraction heat-conducting composite material is: Carbon nanotube 90wt%, polytetrafluoroethylene 10wt%.

[0050] The performance test data of the obtained high volume fraction thermally conductive composite material is as follows: thermal conductivity: 10.53Wm -1 K -1 , Compressive strength: 45.38MPa, tensile strength: 12.52MPa.

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Abstract

The invention discloses a heat conductive composite material with a high volume fraction. The composite material is characterized by being composed of a heat conductive filling material, which is irregularly stacked to form a heat conductive network and accounts for 90 to 99% of the total weight of the composite material, and a polymer adhesive, which is dispersed in the cavities in the heat conductive network and accounts for 1 to 10% of the total weight of the composite material, wherein the heat conductive filling material is high heat conductive carbon-base micro nano powder. The moulded products can be prepared through the steps of direct mixing and hot press molding, and the preparation efficiency is high. The preparation of the composite material is simple and convenient. Moreover the content of the high heat conductive carbon-base micro nano powder filling material is high, so the composite material can meet the realistic requirements on massive production. The prepared heat conductive composite material has an excellent heat conductive performance and mechanical properties, also has a certain electric conductive performance, and can be used in fields like 3D printing materials, notebook, large power LED luminescence, panel display, digital camera, and mobile communication products and related compact and high-speed electronic elements.

Description

technical field [0001] The invention belongs to carbon-based heat-conducting composite materials, and relates to a high-volume-fraction heat-conducting composite material and a preparation method thereof, in particular to a high-volume-fraction heat-conducting composite material with high heat-conducting carbon-based micro-nano powder as a filler and a preparation method thereof. The high volume fraction thermally conductive composite material of the present invention is mainly used in 3D printing materials, notebook computers, high-power LED lighting, flat panel displays, digital cameras and mobile communication products, as well as related miniaturized and high-speed electronic components. Background technique [0002] In recent years, with the rapid development of microelectronic integration and assembly technology, the miniaturization of integrated circuits has become higher and higher, and the volume of electronic components and logic circuits has been reduced by tens of...

Claims

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Application Information

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IPC IPC(8): C08L27/18C08L33/12C08L27/12C08L77/00C08K7/24C08K3/04C08K7/06C09K5/14
Inventor 刘剑唐榕刘子仪彭汝芳楚士晋
Owner SOUTHWEAT UNIV OF SCI & TECH
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