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A high-frequency and high-speed pcb board for macro and micro base stations for 5g communication and its preparation process

A kind of PCB board and preparation process technology, which is used in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, and printed circuits. problems, to achieve the effects of improved etching accuracy, excellent high-speed/high-frequency transmission characteristics, and simple process

Active Publication Date: 2022-05-03
广东兴达鸿业电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The preparation process of the existing 5G communication macro / micro base station high-frequency high-speed PCB board is relatively complicated, and it is easy to etch the copper layer during the production process.
The product scrap rate is relatively high

Method used

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  • A high-frequency and high-speed pcb board for macro and micro base stations for 5g communication and its preparation process
  • A high-frequency and high-speed pcb board for macro and micro base stations for 5g communication and its preparation process
  • A high-frequency and high-speed pcb board for macro and micro base stations for 5g communication and its preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A preparation process of a macro / micro base station high-frequency and high-speed PCB board for 5G communication, comprising the following steps:

[0041] S1. Cutting: Cut the PTFE base material, rigid base material and FR4 copper clad laminate according to the preset size to obtain PTFE base material core board, rigid base material core board and FR4 base material core board;

[0042] S2. Surface roughening treatment: roughen the surface of the PTFE base material core plate, rigid base material core plate, and FR4 base material core plate after cutting to form a rough surface on the surface of each core plate; the surface roughening treatment The method is grinding plate or microetching.

[0043] S3. Inner plate drilling: Drill holes on PTFE substrate core boards and FR4 substrate core boards, and carry out hole metallization and electroplating on the above-mentioned drill holes; the hole metallization is ultrasonic copper sinking, and drilling Hole plating is pulse p...

Embodiment 2

[0050] A kind of preparation technology of macro / micro base station high-frequency high-speed PCB board for 5G communication, it is characterized in that comprising the following steps:

[0051] S1. Cutting: Cut the PTFE base material, rigid base material and FR4 copper clad laminate according to the preset size to obtain PTFE base material core board, rigid base material core board and FR4 base material core board;

[0052] S2. Surface roughening treatment: roughen the surface of the PTFE base material core plate, rigid base material core plate, and FR4 base material core plate after cutting to form a rough surface on the surface of each core plate; the surface roughening treatment The method is grinding plate or microetching.

[0053] S3. Inner plate drilling: Drill holes on PTFE substrate core boards and FR4 substrate core boards, and carry out hole metallization and electroplating on the above-mentioned drill holes; the hole metallization is ultrasonic copper sinking, and ...

Embodiment 3

[0060] A kind of preparation technology of macro / micro base station high-frequency high-speed PCB board for 5G communication, it is characterized in that comprising the following steps:

[0061] S1. Cutting: Cut the PTFE base material, rigid base material and FR4 copper clad laminate according to the preset size to obtain PTFE base material core board, rigid base material core board and FR4 base material core board;

[0062] S2. Surface roughening treatment: roughen the surface of the PTFE base material core plate, rigid base material core plate, and FR4 base material core plate after cutting to form a rough surface on the surface of each core plate; the surface roughening treatment The method is grinding plate or microetching.

[0063] S3. Inner plate drilling: Drill holes on PTFE substrate core boards and FR4 substrate core boards, and carry out hole metallization and electroplating on the above-mentioned drill holes; the hole metallization is ultrasonic copper sinking, and ...

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Abstract

The invention discloses a macro / micro base station high-frequency high-speed PCB board for 5G communication and its preparation process, wherein the preparation process includes the following steps: S1, material cutting, S2, surface roughening treatment, S3, inner layer board drilling, S4, inner graphics production, S5, lamination, S6, drilling, S7, outer graphics production and S8, post-processing. The purpose of the present invention is to overcome the deficiencies in the prior art and provide a preparation of high-frequency and high-speed PCB boards for 5G communication macro / micro base stations with simple process, good etching uniformity, high production efficiency, and can effectively reduce the scrap rate craft. Another object of the present invention is to provide a high-frequency and high-speed PCB board for macro / micro base stations for 5G communication using the above preparation method. The macro / micro base station high-frequency and high-speed PCB board for 5G communication of the present invention has the advantages of excellent high-speed / high-frequency transmission characteristics, small dielectric loss, and the like.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a macro / micro base station high-frequency and high-speed PCB board for 5G communication and a preparation process thereof. Background technique [0002] With the full arrival of the 5G commercial era, all links in the communication field need to use PCBs, and the number of 5G base stations is expected to increase significantly. The peak rate of 4G is 100Mbps to 1Gbps, while 5G will provide peak bandwidth of more than 10Gbps, 1ms delay and ultra-high-density connection, mobility of 500km / h, and traffic density of 10Mbps / m2. At present, my country's three major operators have entered the stage of accelerating 5G construction. Pilots have been launched for 5G scale testing and application testing. Local governments have drawn up 5G coverage timetables and accelerated infrastructure construction to achieve the goal of large-scale commercial use in 2020. Since 5G requires mass...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K1/00
CPCH05K3/068H05K1/00
Inventor 郑小红张忠庆袁丕盛易振林向良才
Owner 广东兴达鸿业电子有限公司
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