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Removable glue and preparation method thereof

A technology of glue and epoxy resin, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of low mechanical strength and easy cracks in the bonding layer, and overcome the problems of low mechanical strength, easy peeling, The effect of excellent adhesive strength

Active Publication Date: 2021-05-25
SHANGHAI QINGJIN PHOTOELECTRON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a kind of removable glue, which is applied in the process of acousto-optic devices, and can overcome the problem that the prior art bonding layer is prone to appear due to low mechanical strength. Crack defects, the glue not only has excellent bonding strength, but also can repair the misplaced components by removing the glue when they fail due to misalignment during the bonding process

Method used

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  • Removable glue and preparation method thereof
  • Removable glue and preparation method thereof

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preparation example Construction

[0044] Another aspect of the present invention also provides a preparation method of removable glue, comprising the following steps:

[0045] (1) Slowly add the polymer into the organic solvent, while stirring until uniformly dispersed;

[0046] (2) Add curing agent, plasticizer, defoamer, coupling agent and stir evenly, seal and let stand for 3-6h;

[0047] (3) Open the lid and stir until the mixture is fully dissolved and becomes transparent, then seal and let stand for 12-36 hours.

[0048] When the composition of the glue does not contain defoaming agent or coupling agent, this operation is correspondingly omitted in the preparation step.

Embodiment 1

[0051] On the one hand, this embodiment provides a kind of removable glue, which includes the following components in parts by weight:

[0052] 30 parts of bisphenol A epoxy resin, 15 parts of polyvinyl butyral resin, 15 parts of hydroxypropyl methacrylate, 5 parts of 2-methylimidazole, 4 parts of tributyl citrate, EX-1710 defoamer 1 part, 5 parts of vinyltriethoxysilane, 15 parts of methylcyclohexane, 10 parts of isopropanol.

[0053] The bisphenol A epoxy resin was purchased from Changsha Fudakang Chemical Materials.

[0054] The polyvinyl butyral resin was purchased from Tianyuan New Material Company.

[0055] Another aspect of this embodiment provides a method for preparing removable glue, comprising the following steps:

[0056] (1) Bisphenol A epoxy resin, polyvinyl butyral resin, and hydroxypropyl methacrylate are slowly added to the organic solvent methylcyclohexane and isopropanol mixture, and stirred until uniformly dispersed;

[0057] (2) Add 2-methylimidazole, t...

Embodiment 2

[0060] On the one hand, this embodiment provides a kind of removable glue, which includes the following components in parts by weight:

[0061] 32 parts of bisphenol F epoxy resin, 16 parts of polyvinyl butyral resin, 16 parts of hydroxypropyl methacrylate, 4 parts of 2-imidazole, 5 parts of acetyl tributyl citrate, 1 part of EX-1710 defoamer Parts, 6 parts of vinyltrimethoxysilane, 12 parts of ethylcyclohexane, 8 parts of propanol.

[0062] The bisphenol F epoxy resin was purchased from Henan Water Ring Company, and the model was NPEF-170.

[0063] The polyvinyl butyral resin was purchased from Tianyuan New Material Company.

[0064] Another aspect of this embodiment provides a method for preparing removable glue, comprising the following steps:

[0065] (1) Slowly add bisphenol F epoxy resin, polyvinyl butyral resin, and hydroxypropyl methacrylate into the organic solvent ethylcyclohexane and propanol mixture, and stir until uniformly dispersed;

[0066] (2) Add imidazole...

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Abstract

The invention discloses removable glue and a preparation method thereof. The removable glue comprises the following components in parts by weight: 50-65 parts of a high-molecular polymer, 4-6 parts of a curing agent, 3-5 parts of a plasticizer and 20-30 parts of an organic solvent. The glue can be applied to process manufacturing of acousto-optic devices, has excellent bonding strength and is easy to operate, when a bonded element becomes a failure element due to dislocation, a bonded substance can be peeled off by removing the glue without damaging the element, so that the dislocated element can be repaired, and the peeled element can be used again.

Description

technical field [0001] The invention relates to the field of chemical industry, in particular to a removable glue and a preparation method thereof, which can be applied to the technological manufacture of acousto-optic devices. Background technique [0002] In the acousto-optic device, the acousto-optic crystal and the transducer are bonded together by a bonding process after the bonding layer is respectively plated. The bonding layer of common acousto-optic devices is generally composed of a primer layer, an electrode layer, and a soldering layer. The soldering layer Choose a relatively soft metal (such as In), align the acousto-optic crystal coated with a bonding layer with the transducer, pressurize mechanically and maintain a constant pressure, and the metal atoms in the welding layer diffuse each other, so that the acousto-optic crystal and transducer energy devices bonded together, [0003] In high-frequency acousto-optic devices, the bonding layer is required to have...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J129/14C09J133/14C09J11/06
CPCC09J163/00C09J11/06C08L2203/20C08L29/14C08L33/14C08K5/5425
Inventor 钟能能谢尧寰许晓程
Owner SHANGHAI QINGJIN PHOTOELECTRON TECH CO LTD
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