Double-component organic silicon packaging adhesive as well as preparation method and application thereof
A silicone and encapsulant technology, used in adhesives, non-polymer adhesive additives, semiconductor devices, etc., can solve the problems of poor mixing uniformity, affecting product appearance and light efficiency, and uncontrollable glue output. Good clarity and stability, avoids adhesive lamination problems, easy to mix and homogeneous results
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[0046] Specifically, the preparation method of alkoxy-modified polydimethylsiloxane comprises the following steps:
[0047] Mix pendant vinyl silicone oil, solvent and catalyst, then add alkoxysilane, keep the reaction temperature at 50°C-70°C for 5h-7h.
[0048] Further, the alkoxysilane is selected from trimethoxysilane or triethoxysilane. Specifically, its reaction formula can be expressed as follows:
[0049]
[0050]In one specific example, the viscosity of the alkoxysilane-modified polydimethylsiloxane is 500cP-1500cP. Specifically, the viscosity of alkoxysilane-modified polydimethylsiloxane includes but is not limited to: 500cP, 550cP, 600cP, 700cP, 800cP, 900cP, 950cP, 1000cP, 1150cP, 1200cP, 1300cP, 1400cP, 1450cP, 1500cP .
[0051] In one specific example, 1,2-bisalkoxysilylethane is selected from 1,2-bistrimethoxysilylethane and 1,2-bistriethoxysilylethane at least one. Preferably, the 1,2-bisalkoxysilylethane is selected from 1,2-bismethoxysilylethane.
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Embodiment 1
[0072] This embodiment provides a two-component silicone encapsulant for encapsulating LED flexible light strips, the composition of which is as follows:
[0073]
[0074] The preparation method of the above-mentioned two-component silicone encapsulation glue is as follows:
[0075] (1) Preparation of component A: Add hydroxyl-terminated polydimethylsiloxane (107 glue) and methyl MQ silicone resin into a planetary mixer, mix for 20 minutes until uniform, and then obtain component A;
[0076] (2) Preparation of component B: Ethoxysilane-modified polydimethylsiloxane, 1,2-bismethoxysilylethane, γ-aminopropyltriethoxysilane, dilauryl Dibutyltin acid was added to the planetary mixer, and mixed for 15 minutes until uniform, that is, component B.
Embodiment 2
[0078] This embodiment provides a two-component silicone encapsulant for encapsulating LED flexible light strips, the composition of which is as follows:
[0079]
[0080] The preparation method of the above-mentioned two-component silicone encapsulation glue is as follows:
[0081] (1) Preparation of component A: Add hydroxyl-terminated polydimethylsiloxane (107 glue) and methyl MQ silicone resin into a planetary mixer, mix for 20 minutes until uniform, and then obtain component A;
[0082] (2) Preparation of component B: methoxysilane-modified polydimethylsiloxane, 1,2-bismethoxysilylethane, N-βaminoethylγ-aminopropyltrimethoxy Add base silane and dibutyltin diacetate into the planetary mixer, mix for 15 minutes until uniform, and then get component B.
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