An etching liquid for through-hole or recess etching on a substrate and its preparation method and use

Abstract

The invention relates to an etching liquid for through-hole or recess etching on a substrate and its preparation method and use. The etching liquid includes alkali, alcohol and solvent water; the alkali in the etching liquid is 20-50 in terms of mass percentage. %; the volume fraction of alcohol in the etching solution is 5-20%. The etching solution provided by the present invention achieves efficient etching of a specific area of ​​the substrate by introducing a specific alcohol component, and avoids the over-etching problem caused by the hydrofluoric acid etching solution. The introduction of alcohol reduces the surface tension of the etching solution, making it easier for the etching solution to penetrate into the microstructure of the glass surface, accelerating etching. Furthermore, the addition of alcohol can promote material exchange between the etching solution and the substrate, accelerating the etching reaction.

Description

technical field [0001] The invention relates to the field of basic etching, in particular to an etching solution for etching through holes or recesses on a substrate, a preparation method and application thereof. Background technique [0002] At present, the introduction of through holes or recesses on substrates used as interposers or micro components is usually achieved by a process of mask + hydrofluoric acid chemical etching or laser irradiation + hydrofluoric acid chemical etching. [0003] For example, CN105102177A discloses a method and a device for introducing a plurality of recesses (5) in a substrate (2) used as an interposer by means of a laser beam, and a substrate (2) manufactured in this way. To this end, a laser beam (3) is directed onto the surface of the substrate (2). In this case, the exposure duration of the laser beam (3) is chosen to be extremely short, so that only a modification of the substrate (2) concentrically around the optical axis (Z) of the l...

AI Technical Summary

Problems solved by technology

[0005] However, hydrofluoric acid is highly corrosive and volatile, and this type of glass etching process using hydrofluoric acid has high requirements for the sealing and ventilation of the etching environment. Further, hydrofluoric acid still has etching during use. excessive problem