Etching solution for etching through hole or recess in substrate, and preparation method and application thereof

Abstract

The invention relates to an etching solution for etching a through hole or a recess in a substrate and a preparation method and application thereof. The etching solution comprises alkali, alcohol andsolvent water, the content of alkali in the etching solution is 20-50% in percentage by mass; the alcohol content in the etching solution is 5-20% in volume fraction. According to the etching solutionprovided by the invention, a specific alcohol component is introduced, so that efficient etching of a specific area of the substrate is realized, and the problem of excessive etching caused by a hydrofluoric acid etching solution is avoided. The introduction of the alcohol reduces the surface tension of the etching solution, so that the etching solution can permeate into the microstructure on thesurface of the glass more easily to accelerate etching, and further, the addition of the alcohol can promote the substance exchange between the etching solution and the substrate and accelerate the etching reaction.

Description

technical field [0001] The invention relates to the field of basic etching, in particular to an etching solution for etching through holes or recesses on a substrate, a preparation method and application thereof. Background technique [0002] At present, the introduction of through holes or recesses on substrates used as interposers or micro components is usually achieved by a process of mask + hydrofluoric acid chemical etching or laser irradiation + hydrofluoric acid chemical etching. [0003] For example, CN105102177A discloses a method and a device for introducing a plurality of recesses (5) in a substrate (2) used as an interposer by means of a laser beam, and a substrate (2) manufactured in this way. To this end, a laser beam (3) is directed onto the surface of the substrate (2). In this case, the exposure duration of the laser beam (3) is chosen to be extremely short, so that only a modification of the substrate (2) concentrically around the optical axis (Z) of the l...

AI Technical Summary

Problems solved by technology

[0005] However, hydrofluoric acid is highly corrosive and volatile, and this type of glass etching process using hydrofluoric acid has high requirements for the sealing and ventilation of the etching environment. Further, hydrofluoric acid still has etching during use. excessive problem