Method for forming groove

Abstract

The invention discloses a method for forming a groove by constructing a nonlinear function model of etching speeds under each etching gas flow distributed on a wafer in advance according to the etching gas flow and the etching speed. The method comprises the steps of: providing the wafer which is provided with an interlayer medium layer; testing a variation curve in thickness of the interlayer medium layer on the wafer from the marginal area to the central area; obtaining etching speeds required from the marginal area to the central area on the wafer based on the variation curve in thickness, gaining required etching gas flow and etching time by utilizing the required etching speed and the nonlinear function model; etching by utilizing the required etching gas flow and the etching time to form a groove in the interlayer medium layer, thereby reducing damages to components under the groove.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for forming a trench. Background technique [0002] With the development of integrated circuits to ultra-large-scale integrated circuits, the circuit density inside integrated circuits is increasing, and the number of components contained is also increasing. This development makes the surface of the wafer unable to provide enough area to manufacture the required interconnecting wires. [0003] In order to meet the requirements of interconnection lines after shrinking components, the design of two or more layers of multilayer metal interconnection lines has become a method commonly used in VLSI technology. At present, the conduction between different metal layers or the metal layer and the pad layer is realized through a metal plug, and the formation of the metal plug includes: a dielectric layer between the metal layer and the metal layer or between ...

AI Technical Summary

Problems solved by technology

[0005] But in above-mentioned method, owing to in previous process, for example chemical mechanical polishing (CMP), make the surface of the interlayer dielectric layer on the wafer not flat, in other words, the interlayer dielectric layer of wafer edge region and the layer of wafer central region The thickness of the interlayer is different, so that the depth of the groove in the edge region of the wafer formed by etching is different from the groove in the central region of the wafer, which will easily cause the groove in the edge region of the wafer to be etched too deep, thereby affecting the underlying semiconductor. device damage

Images