Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preparing flexible circuit board based on liquid crystal polymer film

A technology of flexible circuit boards and liquid crystal polymers, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuit manufacturing, etc., can solve problems such as defects in the forming holes of flexible metal-clad plates, and achieve bending resistance Good foldability, good practicability, and simple operation

Active Publication Date: 2021-02-09
UNIV OF SCI & TECH OF CHINA
View PDF11 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention is mainly used to solve the problem that in the prior art, in the process of preparing flexible circuit boards based on liquid crystal polymer films, defects are prone to occur when flexible metal-clad plates form holes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing flexible circuit board based on liquid crystal polymer film
  • Method for preparing flexible circuit board based on liquid crystal polymer film
  • Method for preparing flexible circuit board based on liquid crystal polymer film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] The liquid crystal polymer material is a liquid crystal copolyester of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid with a melting point of 280°C, and the liquid crystal polymer material is dried and pretreated in a vacuum drying oven at a drying temperature of 150°C. The drying time is 5 hours, and the water content of the resin after drying is less than 400ppm. Using a multi-layer co-extrusion blown film device, the liquid crystal polymer was melt-extruded to form a film. Under the conditions of a traction ratio of 10 and an inflation ratio of 4, a film with a melting point of 280°C and a thickness of 25 μm was obtained. The above film was placed in a high-temperature blast drying oven and treated at 260°C for 6 hours. After the treatment, the modulus adjustment process was completed at a cooling rate of 3°C / min, and the melting point of the film became 298°C.

[0079] Two electrolytic copper foils with a thickness of 10 μm and a surface roughness of about 1.5...

Embodiment 2

[0082] The difference from Example 1 is that the thickness of the liquid crystal polymer film 1 is 50 μm.

Embodiment 3

[0084] The difference from Example 1 is that the modulus adjustment process takes 8 hours.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Tensile modulusaaaaaaaaaa
Flexural modulusaaaaaaaaaa
Tensile modulusaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for preparing a flexible circuit board based on a liquid crystal polymer film, and the method comprises the steps: firstly, preparing a metal foil, and preparing a prefabricated film of a liquid crystal polymer material with the tensile modulus of 0.5-6.0 GPa and the bending modulus of 1.0-11.0 GPa; adjusting the tensile modulus of the prefabricated film from 0.5-6.0 GPa to 1.8-3.5 GPa through the modulus adjusting procedure; besides, adjusting the bending modulus of the prefabricated film to 2.0-8.0 GPa from 1.0-11.0 GPa through the modulus adjusting procedure, and obtainng a finished film, wherein the modulus adjustment process comprises the following steps: carrying out heat treatment on the prefabricated film under the condition of temperature T, cooling the prefabricated film, and controlling the heat treatment time t and the cooling rate vt; then, enabling the metal foil and the finished film to be subjected to hot press molding, and obtaining a molded metal-clad plate; and finally, etching a circuit on the metal conductive layer coated with the metal plate according to the circuit design drawing, and carrying out hole turning and electroplating on the circuit to obtain the flexible circuit board. The problem that in the prior art, a metal-clad plate has the hole forming defect can be solved.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit board preparation, and mainly relates to a method for preparing a flexible circuit board based on a liquid crystal polymer film. Background technique [0002] With the rapid development of communication equipment and technology, the production and preparation of high-performance high-frequency substrate materials has become an indispensable part of the development of high-frequency wireless communication. The flexible circuit board is a single-layer or multi-layer flexible circuit board formed by using a flexible metal-clad plate through the flexible printed circuit board (FPC) process. Steps form a line. When preparing a multi-layer circuit board, the liquid crystal polymer film can be directly used as an adhesive layer and laminated with metal foil to form a metal-clad board, or a low-dielectric adhesive sheet can be used to bond the liquid crystal polymer film and metal foil in sequen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0011H05K3/0014H05K3/06
Inventor 李良彬赵浩远
Owner UNIV OF SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com