High-thermal-conductivity single-component thermal-conductive gel and preparation method thereof

Abstract

The invention provides high-thermal-conductivity single-component thermal conductive gel and a preparation method thereof. The high-thermal-conductivity single-component thermal conductive gel is prepared from 70-95 parts of thermal conductive powder, 7-10 parts of silicone oil, 3-5 parts of a silane coupling agent and 0.5-1 part of a platinum mixture. The heat conduction powder is prepared from 60-70 parts of stearic acid modified aluminum oxide, 10-20 parts of aluminum hydroxide and 15-30 parts of zinc oxide, the particle size of the stearic acid modified aluminum oxide is 30-80 microns, theparticle size of the aluminum hydroxide is 8-30 microns, and the particle size of the zinc oxide is 1-5 microns; the silane coupling agent is a mixture composed of octyl trimethoxy siloxane, diethoxymethyl phenyl silane and stearic acid according to the mass ratio of 1: 0.4-0.8: 2. The heat-conducting powder can form a uniform dispersion system in the single-component heat-conducting gel, so that the heat conductivity coefficient of the single-component heat-conducting gel is greatly improved, the contact heat resistance of the interface of the single-component heat-conducting gel is effectively reduced, and a better heat dissipation effect can be achieved.

Description

technical field [0001] The invention relates to the technical field of thermally conductive interface materials for high-power electronic and electrical equipment, in particular to a high thermally conductive single-component thermally conductive gel and a preparation method thereof. Background technique [0002] With the rapid development of computer technology, the computing speed of the central processing unit (CPU), which is the core of the computer system, is getting faster and faster, and its calorific value is also increasing. If the CPU heat dissipation is not good, it will cause the computer to overheat during operation, which will affect the normal operation of the computer. Therefore, in order to ensure the normal operation of the computer, it is necessary to solve the heat dissipation problem of the CPU. [0003] The commonly used heat dissipation method is to install a heat sink on the CPU, and even if the contact surface between the heat source such as the CPU...

AI Technical Summary

Problems solved by technology

However, the two-component thermally conductive gel has endothermic and exothermic phenomena during curing, and the curing shrinkage rate is large, resulting in poor bonding performance.

However, the thermal resistance of the existing one-component thermally conductive gel is relatively high, and the thermal conductivity needs to be improved.

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