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Preparation method of aluminum-based composite material

An aluminum-based composite material and aluminum powder technology, which is applied in the field of electronic packaging materials, can solve the problems of affecting performance, composite material strength and large difference in expansion coefficient, etc., and achieve improved heat dissipation, strong material design, and reduced material deformation Effect

Active Publication Date: 2020-12-29
HUNAN JINTIAN ALUMINUM HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing silicon carbide particle reinforced aluminum matrix composites require a high volume percentage of silicon carbide particles, and the prepared material has a large difference in the strength and expansion coefficient of the composite material due to the interface problem between SiC and aluminum and the dispersion problem of SiC, which affects its Use performance, so it is necessary to develop new processes and methods to solve the above problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for preparing an aluminum-based composite material, comprising the steps of:

[0034] (1) SiO 2 After mixing with carbon fiber at a mass ratio of 3:1, add SiO 2 and expanded graphite powder with 6% of the total mass of carbon fibers, and SiO 2 and 0.8% Al in total carbon fiber mass 2 o 3 , under an argon protective atmosphere, sintered at 1600°C for 20h to obtain a mixture of SiC particles and carbon fibers coated with SiC on the surface, which is designated as mixture 1;

[0035] (2) The mixture 1 in step (1) is sintered in air for 0.5 h, the sintering temperature is 1200° C., and the carbon fibers not covered by SiC in the mixture 1 are removed to obtain the mixture 2. The surface of the mixture 2 forms a plurality of microstructures. holes and silicon oxide layer;

[0036] (3) Mix the mixture 2 of step (2) with Si flakes at a volume ratio of 0.5:1, put them in a drum mill for 10 hours, and then sinter at 1450°C for 12 hours under an argon protective atm...

Embodiment 2

[0043] A method for preparing an aluminum-based composite material, comprising the steps of:

[0044] (1) SiO 2 After mixing with carbon fiber at a mass ratio of 3.2:1, add SiO 2 and expanded graphite powder with a total mass of carbon fibers of 6.8%, and SiO 2 and 1.5% Al in total carbon fiber mass 2 o 3 , under an argon protective atmosphere, sintered at 1720 ° C for 18 hours to obtain a mixture of SiC particles and carbon fibers coated with SiC on the surface, which is designated as mixture 1;

[0045] (2) The mixture 1 of step (1) is sintered in air for 2 hours, the sintering temperature is 1100°C, and the carbon fibers not covered by SiC in the mixture 1 are removed to obtain the mixture 2, and the surface of the mixture 2 forms a plurality of micropores and silicon oxide layer;

[0046] (3) Mix the mixture 2 of step (2) with the Si sheet at a volume ratio of 1:1, place it in a roller ball mill for 8.5 hours, and then sinter at 1460°C for 10 hours under an argon prot...

Embodiment 3

[0053] A method for preparing an aluminum-based composite material, comprising the steps of:

[0054] (1) SiO 2 After mixing with carbon fiber at a mass ratio of 3.4:1, add SiO 2 and expanded graphite powder with a total mass of carbon fibers of 7.5%, and SiO 2 and 1.4% Al in total carbon fiber mass 2 o 3 , under an argon protective atmosphere, sintered at 1850 ° C for 16 hours to obtain a mixture of SiC particles and carbon fibers coated with SiC on the surface, which is designated as mixture 1;

[0055] (2) The mixture 1 of step (1) is sintered in air for 4 hours, the sintering temperature is 950°C, and the carbon fibers not covered by SiC in the mixture 1 are removed to obtain the mixture 2, and the surface of the mixture 2 forms a plurality of micropores and silicon oxide layer;

[0056] (3) Mix the mixture 2 of step (2) with the Si sheet at a volume ratio of 1.5:1, put it in a roller ball mill for 7 hours, and then sinter at 1470°C for 8 hours under an argon protecti...

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Abstract

The invention discloses a preparation method of an aluminum-based composite material. The preparation method comprises the following steps that after high-temperature sintering is performed on a mixture of SiO2, carbon fiber, expanded graphite powder and Al2O3, ball milling is carried out, Si is added, high-temperature sintering is carried out to coat or load the Si on the SiC surface by infiltration, secondary ball milling is carried out, aluminum powder and paraffin are added and pressed to obtain a plate, degreasing and sintering are performed on the plate, and multi-temperature-stage and multi-time densification pressing are performed to obtain the aluminum-based composite material. According to the preparation method, the composite material Si / SiC / Al achieves good interface bonding, and atom and molecule physicochemical property matching is good; and meanwhile, the problems of material deformation and the like caused by expansion coefficient difference are solved, the thermal expansion coefficient is low, the weight is light, the mechanical property is good, the heat conductivity, the strength, the plasticity, the heat dissipation property and other properties are good, the operation process is simple, the production control is facilitated, and the preparation method is simple in structure, low in cost, and liable to weld and industrially produced, and can be widely applied to the field of electronic packaging and has a good application prospect.

Description

technical field [0001] The invention relates to the technical field of electronic packaging materials, in particular to a method for preparing an aluminum-based composite material. Background technique [0002] Electronic packaging is the use of film technology and micro-connection technology to arrange, fix and connect semiconductor components and other components on the frame or substrate, lead out the terminals, and seal and fix them through plastic insulating media to form a complete three-dimensional structure. [0003] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. Electronic device packaging and low expansion coefficient materials in the military industry are rapidly developing towards high density, thinning, miniaturization, and high-demand mechanical properties, resulting in technical bottlenecks such as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C49/06C22C49/14C22C47/14C22C47/04C22C101/10
CPCC22C47/04C22C47/14C22C49/06C22C49/14
Inventor 刘春轩高平平吴云张扬罗任曹柳絮张杰苏新
Owner HUNAN JINTIAN ALUMINUM HI TECH CO LTD
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