Low-temperature cured normal-temperature stored flame-retardant epoxy resin composition and flame-retardant prepreg
An epoxy resin storage technology at room temperature, which is applied in the field of flame retardant prepregs, can solve problems such as working time cannot exceed 48 hours, prepreg failure, high porosity, etc., and achieve ultra-long effective storage period, low heat release, The effect of low smoke toxicity
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Embodiment 1
[0053] The low-temperature curing flame-retardant epoxy resin composition disclosed in this embodiment and stored at room temperature, the composition is composed of bisphenol F epoxy resin, novolac epoxy resin, phosphorus silicon boron flame retardant, modified inorganic flame-retardant filler and Modified low-temperature curing latent curing agent composition, wherein the components are set according to the following quality:
[0054] Bisphenol F epoxy resin: 30~80 parts
[0055] Novolak epoxy resin: 20~70 parts
[0056] Phosphorous silicon boron flame retardant: 20~40 parts
[0057] Modified inorganic flame retardant filler: 50~100 parts
[0058] Modified low temperature curing latent curing agent: 10~35 parts.
[0059] In this example,
[0060] Preparation of phosphorous silicon boron flame retardant:
[0061] (1) Using the reactivity of P-H in DOPO, it reacts with C=C of vinyltrimethoxysilane to obtain trimethoxysilane (PSi) with DOPO on the side group;
[0062] (2) S...
Embodiment 2
[0074] In this embodiment, the flame retardant epoxy resin composition that is cured at low temperature and stored at room temperature is set according to the following mass fractions:
[0075] Bisphenol F epoxy resin: 30~70 parts
[0076] Novolak epoxy resin: 24~70 parts
[0077] Phosphorous silicon boron flame retardant: 22~40 parts
[0078] Modified inorganic flame retardant filler: 50~100 parts
[0079] Modified low temperature curing latent curing agent: 10~25 parts.
[0080] In this example,
[0081] Preparation of phosphorous silicon boron flame retardant:
[0082] (1) Using the reactivity of P-H in DOPO, it reacts with C=C of vinyltrimethoxysilane to obtain trimethoxysilane (PSi) with DOPO on the side group;
[0083] (2) Si-OCH3 of vinyltrimethoxysilane is hydrolyzed and dehydrated and condensed with boric acid B(OH)3 to obtain borosiloxane (BSi);
[0084] (3) The addition reaction of DOPO and vinyltrimethoxysilane to obtain the PSi intermediate, and then react i...
Embodiment 3
[0095] According to the present embodiment, the composition is composed of bisphenol F epoxy resin, novolac epoxy resin, phosphorus silicon boron flame retardant, modified inorganic flame retardant filler and modified low temperature curing latent curing agent, wherein:
[0096] Bisphenol F epoxy resin: 30 parts
[0097] Novolak epoxy resin: 25 parts
[0098] Phosphorus silicon boron flame retardant: 25 parts
[0099] Modified inorganic flame retardant filler: 55 parts
[0100] Modified low temperature curing latent curing agent: 20 parts.
[0101] The flame-retardant prepreg prepared by the flame-retardant epoxy resin composition stored at low temperature and cured at room temperature, the flame-retardant prepreg is a VOC-free fiber prepreg, specifically as follows:
[0102] (1) The fiber is one or more mixed weaves of carbon fiber, glass fiber, basalt fiber, Kevlar fiber, quartz fiber, alumina fiber and other fibers with good flame retardant and high temperature resistanc...
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