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Dispersive copper alloy drawing process

A drawing process, a technology of dispersing copper, applied in metal processing equipment, metal extrusion, manufacturing tools, etc., can solve the problems of alloy body damage, affecting alloy properties, poor toughness, etc., to improve tensile strength, improve drawing The effect of improving efficiency and tensile strength

Active Publication Date: 2020-11-20
EAST CHINA JIAOTONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the diameter of the wire is ≤0.25mm, there is no need to heat the mold during processing; the drawing method is given in this document, but it is not suitable for dispersed copper alloys. The dispersed copper alloy itself has high strength and poor toughness. On the contrary, it will cause damage to the alloy body and affect the performance of the alloy.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A kind of dispersed copper alloy drawing process of the present embodiment comprises the following steps:

[0028] Step 1, softening the matrix: first place the alloy body in a cobalt chloride solution, then treat it with alternating current, wash it once with boiling water, and then mix it with a wetting agent and add it to the reaction bottle. The temperature in the reaction bottle is 75 ℃, send the reaction bottle into the irradiation box for irradiation treatment;

[0029] Step 2, pre-drawing treatment: put the alloy body at 50°C for 10 minutes, then repeatedly draw for 1 minute at a drawing speed of 1m / min, then spray the matrix additive, and then soak into the wetting agent of step 1 1min, take out;

[0030] Step 3, hot drawing treatment: the alloy body is hot drawn twice at a temperature of 350°C, then annealed, annealed to 210°C, kept for 15 minutes, and finally cooled naturally to room temperature;

[0031] Step 4, cold drawing treatment: stand at -5°C for 2 ...

Embodiment 2

[0040] A kind of dispersed copper alloy drawing process of the present embodiment comprises the following steps:

[0041] Step 1, softening the matrix: first place the alloy body in cobalt chloride solution, then treat it with alternating current, then wash it with boiling water for 1-3 times, then mix it with a wetting agent and add it to the reaction bottle, the temperature in the reaction bottle When the temperature is 75°C, send the reaction bottle into the irradiation box for irradiation treatment;

[0042] Step 2, pre-drawing treatment: put the alloy body at 50-60°C for 10-20 minutes, then repeatedly draw for 1-2 minutes at a drawing speed of 1-2m / min, then spray the matrix additives, and then infiltrate Into the penetrating agent in step 1 for 1-5 minutes, then take it out;

[0043] Step 3, hot drawing treatment: hot drawing the alloy body for 2-5 times first, the temperature of hot drawing is 350-450°C, then annealing treatment, annealing to 210-240°C, then holding fo...

Embodiment 3

[0056] A kind of dispersed copper alloy drawing process of the present embodiment comprises the following steps:

[0057] Step 1, softening the matrix: first place the alloy body in cobalt chloride solution, then treat it with alternating current, then wash it with boiling water for 1-3 times, then mix it with a wetting agent and add it to the reaction bottle, the temperature in the reaction bottle When the temperature is 75°C, send the reaction bottle into the irradiation box for irradiation treatment;

[0058] Step 2, pre-drawing treatment: put the alloy body at 50-60°C for 10-20 minutes, then repeatedly draw the wire at a drawing speed of 1-2m / min for 1-2 minutes, then spray the matrix additives, and then infiltrate Into the penetrating agent in step 1 for 1-5 minutes, then take it out;

[0059] Step 3, hot drawing treatment: first hot draw the alloy body for 2-5 times, the temperature of hot drawing is 350-450°C, then annealing treatment, annealing to 210-240°C, and then ...

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Abstract

The invention discloses a dispersive copper alloy drawing process. The dispersive copper alloy drawing process comprises the following step: step 1, substrate softening: placing an alloy body in a cobalt chloride solution firstly, then treating the mixture with alternating current, and then washing the treated mixture with boiling water 1-3 times. According to the drawing process, substrate softening is first performed before drawing, and a substrate is first placed in the cobalt chloride solution and then treated with alternating current, which is aimed to disperse the internal structure of the substrate and enable the substrate to be more easily infiltrated by a wetting agent. Raw materials such as sodium dodecyl polyoxyethylene ether sulfate and triethanolamine of the wetting agent cansoften the internal structure of the substrate, and graphene can enhance the toughness and drawability of the substrate, so that the substrate is easier to be drawn.

Description

technical field [0001] The invention relates to the technical field of alloy drawing, in particular to a dispersion copper alloy drawing process. Background technique [0002] Dispersion strengthened copper alloy, also known as alumina copper, is an excellent high-strength, high-conductivity material; due to the dispersion strengthening effect of nano-scale alumina on the matrix copper, the alloy has high strength, high hardness, high conductivity and high softening temperature, etc. characteristic. Its characteristics are as follows: stable organization, no phase change. High yield strength and tensile strength. High hardness at normal temperature, with the increase of temperature, the decrease in hardness is small, and the creep resistance at high temperature is good. High thermal and electrical conductivity. Excellent processing performance. The softening temperature is as high as 930°C, which is the highest among copper alloys. [0003] Chinese patent document CN11...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C1/00B21C9/00B21C43/02B21C9/02C22F1/08
CPCB21C1/003B21C9/00B21C43/02B21C9/02C22F1/08
Inventor 汤文亮项峻求乐昱马浩航喻卓成
Owner EAST CHINA JIAOTONG UNIVERSITY
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