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Gold wire bonding structure based on multi-branch matching and multi-chip microwave circuit

A gold wire bonding and branching technology, applied in circuits, electrical components, waveguide-type devices, etc., to solve problems such as poor signal transmission quality

Inactive Publication Date: 2020-10-27
BEIJING UNIV OF POSTS & TELECOMM
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a gold wire bonding structure based on multi-twig matching and a multi-chip microwave circuit to solve the problem of poor signal transmission quality during high-frequency transmission

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  • Gold wire bonding structure based on multi-branch matching and multi-chip microwave circuit
  • Gold wire bonding structure based on multi-branch matching and multi-chip microwave circuit
  • Gold wire bonding structure based on multi-branch matching and multi-chip microwave circuit

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] figure 2 yes figure 1 The traditional gold wire bonding structure is equivalent to a low-pass filter circuit composed of capacitors, inductors and resistors. Among them, the value of the parallel capacitor is small in the high frequency band, which can be approximately ignored. In free space, for a single-bond gold wire with length l and diameter d, the values ​​of resistance and inductance are as follows:

[0039] The series resistance R can be exp...

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Abstract

The embodiment of the invention provides a gold wire bonding structure based on multi-branch matching and a multi-chip microwave circuit. The structure comprises a first microstrip line, a second microstrip line, and at least two gold bonding wires, wherein the first microstrip line comprises a first dielectric substrate and a first transmission line arranged on the upper surface of the first dielectric substrate; the first transmission line comprises a microstrip matched with the source end; the second microstrip line comprises a second dielectric substrate and a second transmission line; thesecond transmission line comprises a microwave network and a microstrip matched with the load end; one end of the microwave network is connected with the microstrip matched with the load end, and theother end is connected with the first transmission line through the gold bonding wire; the microwave network comprises a plurality of microstrips connected in series and is used for carrying out impedance matching on the gold bonding wires. According to the scheme, the problem of poor signal transmission quality in the high-frequency transmission process can be solved.

Description

technical field [0001] The invention relates to the technical field of microwave circuits, in particular to a multi-twig matching-based gold wire bonding structure and a multi-chip microwave circuit. Background technique [0002] With the rapid growth of global communication traffic, the requirements for information transmission rate are getting higher and higher, and the transmission signal frequency band is gradually developing to the microwave and millimeter wave band. Microwave circuit is an important technical means to realize high-speed information transmission. Multi-chip component technology is usually used in today's microwave circuits, that is, various micro devices (chip components or bare chips) of electronic circuits are assembled on high-density substrates through packaging technology and micro-welding, thereby forming high-density, high-reliability components. , high-performance, three-dimensional microelectronic devices (including components, assemblies, sub...

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Application Information

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IPC IPC(8): H01P5/02H01P11/00
CPCH01P5/028H01P11/003
Inventor 陈远祥孙尚斌朱虎付佳余建国林尚静
Owner BEIJING UNIV OF POSTS & TELECOMM
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