Cermet vertical pin injection molding process for chip packaging

Abstract

The invention discloses a cermet vertical pin injection molding process for chip packaging. The cermet vertical pin injection molding process for chip packaging comprises the following steps of formula design, material proportioning, material pulverizing, powder drying, addition of a molding agent, material extrusion, material crushing, injection molding, blank degreasing and product sintering. According to the cermet vertical needle injection molding process for chip packaging, a cermet material is adopted, metal can cover the surface of a workpiece after molding, the hardness and the compactness of the workpiece are improved, the production cost is reduced, the compactness of the material is improved through degreasing and sintering, the porosity of the product is reduced, and powder canbe distributed more uniformly by using an adhesive, so that the non-uniformity of the microstructure of a blank can be eliminated, and theoretical density of the workpiece is improved.

Description

technical field [0001] The invention relates to the technical field of injection molding, in particular to a cermet vertical needle injection molding process for chip packaging. Background technique [0002] Integrated circuits that manufacture circuits on the surface of semiconductor chips are also called thin-film integrated circuits; another kind of thick-film integrated circuits is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into substrates or circuit boards. It is necessary to package the chip before it can continue to be used, and the packaging category includes metal packaging, ceramic packaging and plastic packaging, and the injection molding process is generally used for packaging workpieces, which refers to a model with a certain shape, which will be melted by pressure. The colloid in the state is injected into the mold cavity and molded, but most of the existing chip packaging materials are single, which l...

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Problems solved by technology

[0002] Integrated circuits that manufacture circuits on the surface of semiconductor chips are also called thin-film integrated circuits; another kind of thick-film integrated circuits is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into substrates or circuit boards. It is necessary to package the chip before it can continue to be used, and the packaging category includes metal packaging, ceramic packaging and plastic packaging, and the injection molding process is generally used for packaging workpieces, which refers to a model with a certain shape, which will be melted by pressure. The colloid in the state is injected into the mold cavity and molded, but most of the existing chip packaging materials are single, which leads to high cost of the injection molding process, and also leads to poor performance of the packaging parts, and the hardness and density are not good during use. High, and in the injection molding process, the degreasing and sintering process is too simple, resulting in low density of packaged parts and poor quality of parts

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