A kind of cultivation substrate for shiitake mushrooms and its preparation method
A substitute material cultivation and substrate technology, applied in mushroom cultivation, botanical equipment and methods, cultivation, etc., can solve the problems of long germination cycle in the vegetative stage of shiitake mushrooms, insufficient nutrients in mushroom bags, and insufficient growth stamina of mushroom bodies, etc., to achieve Excellent nutritional and health value, reduced bacteria cycle, good ventilation of bacteria bags
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0025] The technical scheme adopted in the present invention is:
[0026] A cultivation base material for shiitake mushrooms as a substitute material, characterized in that the proportioning by weight is as follows: 49 parts of mulberry branch shavings nutrient material, 30 parts of hazelnut shell matrix particles, 20 parts of decomposed dry material of sesame paste residue, and 1 part of base auxiliary material.
[0027] The ratio of the matrix auxiliary materials is as follows by weight: 0.5% of sheep bone calcification powder, 0.4% of quick-acting bactericide, and 0.1% of bacteriocin.
[0028]The preparation method is as follows: (1) Mulberry twig shavings nutrient material: collect Xiafa mulberry twigs, and place them in air-dried or exposed to the sun for 48 hours at room temperature at 38°C, and use a BC1000EVBM large-scale branch grinder to pulverize, and the pulverized particle size is controlled at 7mm, and set aside; After the branches are crushed, add 2% quicklime i...
Embodiment 2
[0035] The technical scheme adopted in the present invention is:
[0036] The invention discloses a raw material of a cultivation matrix for shiitake mushrooms, which is characterized in that the ratio by weight is as follows: 40 parts of mulberry branch shavings nutritional material, 39 parts of hazelnut shell matrix particles, 20 parts of decomposed dried sesame paste residue, and 1 part of matrix auxiliary material.
[0037] A cultivation substrate auxiliary material for shiitake mushrooms as a substitute material, characterized in that the proportioning by weight is as follows: 0.5 part of sheep bone calcification powder, 0.4 part of quick-acting bactericide, and 0.1 part of mushroom element.
[0038] The preparation method is:
[0039] (1) Mulberry twig shavings nutrient material: collect winter cut mulberry branches, air-dry or expose to the sun for 120 hours at room temperature of 12°C to 16°C, and use BC1000EVBM large-scale tree branch crusher to crush, and the crushed...
Embodiment 3
[0046] The technical scheme adopted in the present invention is:
[0047] The invention discloses a raw material of a cultivation substrate for shiitake mushrooms, which is characterized in that the ratio by weight is as follows: 43.5 parts of mulberry branch shavings nutrient material, 35 parts of hazelnut shell matrix particles, 20 parts of decomposed dried sesame paste residue, and 1.5 parts of matrix auxiliary material.
[0048] A shiitake mushroom substitute cultivation base auxiliary material is characterized in that: the proportion by weight is as follows: 1 part of sheep bone calcification powder, 0.4 part of quick-acting bactericide, and 0.1 part of mushroom element.
[0049] A method for preparing a raw material for cultivation substrate of shiitake mushrooms, characterized in that:
[0050] (1) Mulberry twig shavings nutrient material: collect summer mulberry branches, air-dry or expose to the sun for 36 hours at a room temperature of 32°C to 35°C, and use a BC1000E...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com