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A solar cell cutting and passivation integrated processing method and solar cell thereof

A technology of solar cells and processing methods, applied in the direction of electrolytic capacitors, electric solid devices, sustainable manufacturing/processing, etc., which can solve the problems of good coverage of P3 grooves, unstable effects, and difficulty in adding protective layers

Active Publication Date: 2021-08-20
HANGZHOU MICROQUANTA SEMICON CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, it is difficult for the protective layer material to enter the groove of P3, and cannot completely and well cover the groove of P3, the effect is unstable, and it is very difficult to realize the addition of a protective layer

Method used

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  • A solar cell cutting and passivation integrated processing method and solar cell thereof
  • A solar cell cutting and passivation integrated processing method and solar cell thereof
  • A solar cell cutting and passivation integrated processing method and solar cell thereof

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Embodiment Construction

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] Please also refer to image 3 as well as Figure 4 As shown, the solar cell cutting and passivation integrated processing method of the present invention and a preferred embodiment of the solar cell thereof, the solar cell includes a substrate 1, a front electrode layer 2, a light-absorbing layer 3 and a back electrode layer 4 sequentially from bottom to top . The substrate 1 is arranged at the bottom, and the back electrode layer 4 is arranged at the top.

[0023] Before performing laser structured cutting on the back electrode layer 4, a protective laye...

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Abstract

The invention relates to an integrated processing method for cutting and passivating a solar cell. The solar cell includes a substrate, a front electrode layer, a light-absorbing layer and a back electrode layer. Before the back electrode layer is subjected to laser structured cutting, a protective layer is arranged on the surface of the back electrode layer. , and then perform laser structured cutting on the back electrode layer or on the back electrode layer and the light-absorbing layer through the protective layer to obtain corresponding structured grooves, while the protective layer is kept from being cut by laser, and the material of the protective layer is laser structured During the cutting process, it is partially melted by the local high temperature generated by laser processing and penetrates into the corresponding structured groove below. The invention also discloses a solar battery prepared by using the method. The present invention passivates the grooves just processed while laser cutting, reduces the production cost, saves the processing time, and repairs the edges of the grooves after cutting, thereby improving the appearance of the processed grooves and improving the performance of the battery. Stability, extended battery life.

Description

technical field [0001] The invention belongs to the technical field of solar cell processing and preparation, and in particular relates to a solar cell cutting and passivation integrated processing method and the solar cell. Background technique [0002] In the existing solar cell manufacturing process, laser cutting is commonly used to process solar cell components. Commonly used laser cutting processing methods are mainly divided into three steps, and each step processes a structured groove, or processing line, referred to as three processing lines P1, P2, and P3, such as figure 1 with figure 2 shown. The three processing lines are arranged in sequence, from P1 to P3 are the dead zone of the solar cell. Among them, the P1 processing line mainly cuts off the front electrode layer A, and mainly laser-processes structured grooves on the front electrode layer A, and the P2 processing line mainly Cut off the light-absorbing layer B, and mainly laser process another set of s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L21/304H01L31/04H10K99/00
CPCH01L31/1868H01L31/1876H01L21/3043H01L31/04H10K30/50H01L31/0463H10K30/57Y02P70/50H10K39/12H01G9/2009H10K71/621H10K30/88H10K30/451
Inventor 不公告发明人
Owner HANGZHOU MICROQUANTA SEMICON CO LTD
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