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Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

A technology of prepreg and manufacturing method, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of decreased resin strength, shortened molecular chain, decreased insulation reliability, etc., and achieves reduced warpage and low thermal expansion. the effect of

Active Publication Date: 2020-07-17
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high filling of inorganic fillers may cause a decrease in insulation reliability, a decrease in the adhesion between the resin and the wiring layer formed on the surface, and poor press molding when manufacturing laminated boards.
On the other hand, as a resin having a low coefficient of thermal expansion, a resin whose glass transition temperature (Tg) is increased and the coefficient of thermal expansion is lowered by increasing the crosslinking density by using a cyanate resin, etc., but the use of a cyanate resin For resins that increase the crosslink density, the molecular chain between functional groups becomes shorter, which may cause a decrease in the strength of the resin, so there is a limit in terms of low thermal expansion.

Method used

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  • Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
  • Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
  • Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0112] Next, the present invention is further described in detail through the following examples, but these examples do not limit the present invention.

[0113] In addition, about the laminated board obtained in the following Example, the physical property or characteristic was measured and evaluated according to the following method.

[0114] (1) Determination of flexural modulus

[0115] An evaluation substrate of 40 mm x 25 mm was cut out from the laminate obtained in each example, and was set at 25° C., at a crosshead speed of 1 mm / min, at a fulcrum ( Japanese: span) measured flexural modulus (GPa) at a distance of 20mm.

[0116] (2) Evaluation of Feibai

[0117]The laminated board produced in each example was visually observed, and it evaluated based on the following evaluation criteria.

[0118] A: Blurring was not observed at all.

[0119] B: Only a small amount of whitening is observed.

[0120] C: Much whitening is observed.

[0121] (3) Determination of warpag...

manufacture example 1

[0124] Production example 1 (production of thermosetting resin composition 1)

[0125] "NC-3000H" (trade name, manufactured by Nippon Kayaku Co., Ltd.) as an epoxy resin, an addition reaction product of a bismaleimide compound and a diamine compound as a maleimide resin, and as a cured "G-8009L" (trade name, imidazole-blocked isocyanate (Japanese: イソゲシアネートマスクイミダゾール), manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.) as an accelerator, "YOSHINOX BB" (trade name, 4,4'- Butylenebis-(6-tert-butyl-3-methylphenol), produced by Mitsubishi Chemical Corporation) was mixed in a mixed solvent of methyl ethyl ketone and cyclohexanone to obtain a thermosetting resin composition with a solid content concentration of 55% by mass. Object 1.

Embodiment 1

[0127] Using a polyethylene terephthalate film with a thickness of 38 μm as a carrier material, the thermosetting resin composition 1 obtained in Production Example 1 was coated on the above-mentioned carrier material with a thickness of 12 μm to form a resin coating with a thickness of 12 μm. Cloth film1.

[0128] Next, a glass fiber bundle formed by bundling 6,000 glass fiber filaments with a fiber diameter (diameter) of 12 μm was opened at a fiber-opening ratio of 3.2 times, and the opened glass fiber filaments were arranged in a widthwise direction of 300 mm Wide, aligned on the above-mentioned resin coating film 1 with a thickness of 12 μm. Another resin coating film 1 having a thickness of 12 μm was attached thereon so that the resin coating surface faced downward.

[0129] The prepreg precursor thus obtained was B-staged using a hot roll at a pressure of 1 MPa, a temperature of 150° C., and a transport speed of 1 m / min to obtain a prepreg having a glass fiber content o...

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Abstract

Provided is a prepreg which is capable of reducing warpage as a result of achieving reduced thermal expansion and increased elasticity without increasing the filling ratio of an inorganic filler and / or employing a resin having a low coefficient of thermal expansion. Specifically provided is a prepreg containing glass fibers and a thermosetting resin composition, wherein the prepreg includes a layer in which a plurality of glass fiber filaments are disposed extending in a substantially parallel manner in a single direction. Additionally provided are a production method for said prepreg, a laminate containing the prepreg, a production method for said laminate, a printed circuit board containing the laminate, and a semiconductor package obtained by mounting a semiconductor element on said printed circuit board.

Description

technical field [0001] The present invention relates to prepregs, laminates and their manufacturing methods, as well as printed wiring boards and semiconductor packages. Background technique [0002] In recent years, the demand for thinner and lighter electronic equipment has been increasing, and the thinner and higher density of semiconductor packages and printed wiring boards has been advancing. In order to cope with these reductions in thickness and density and to mount electronic components stably, it is important to suppress warpage that occurs during mounting. [0003] One of the main causes of warping of the semiconductor package during mounting is the difference in thermal expansion coefficient between the laminated board used for the semiconductor package and the silicon chip mounted on the surface of the laminated board. Therefore, efforts have been made to make the thermal expansion coefficient of the laminated sheet for a semiconductor package close to that of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29B15/08C08J5/04
CPCC08J2363/00B29B15/12H05K2201/0287H05K1/0366H05K2201/068H05K2201/0293C08G59/4042C08J5/244B29B15/105B29C70/06B29C70/02B29C70/30C08J5/04B29K2105/0872B29L2031/3425B29L2007/002B29B15/14H05K1/0306H05K3/4629B29B15/08C08G59/40B29B15/10
Inventor 清水麻理藤本大辅上方康雄小竹智彦高根泽伸清水明根岸春巳青柳浩一菊池纱也香
Owner RESONAC CORPORATION
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