Homojunction magnetoresistive device of magnetic two-dimensional semiconductor and preparation method and application thereof
A technology of two-dimensional semiconductors and magnetoresistive devices, which is applied in the fields of magnetic field controlled resistors, components of electromagnetic equipment, and manufacturing/processing of electromagnetic devices, and can solve problems such as limited applications
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0046] The present invention also discloses a method for preparing the homojunction magnetoresistive device as described above, including:
[0047] Preparing a silicon dioxide layer on a silicon wafer;
[0048] preparing a first nanosheet on the silicon dioxide layer;
[0049] transferring a second nanosheet on the first nanosheet, placing a portion of the second nanosheet on the first nanosheet to form a partial overlap;
[0050] The source and the drain are respectively prepared on the first nanosheet and the second nanosheet, and the source and the drain are respectively located on the first nanosheet and the second nanosheet without intersecting, that is, the homojunction magnetoresistive device is obtained .
[0051] In some embodiments of the present invention, both the first nanosheet and the second nanosheet are Fe x sn 1-x S 2 Nanosheets;
[0052] In some embodiments of the present invention, the Fe x sn1-x S 2 The preparation method of nanosheet comprises: Sn...
Embodiment 1
[0080] like figure 1 Shown, Si / SiO 2 On the substrate, two layers of Fe 0.021 sn 0.979 S 2 The thin slices are provided with metal electrodes on the two edges of the two thin slices. figure 1 A cross-sectional schematic diagram of the device.
[0081] The lower layer Fe shown in this example 0.021 sn 0.979 S 2 The layer thickness is about 12nm;
[0082] The upper layer Fe shown in this example 0.021 sn 0.979 S 2 The layer thickness is about 25 nm.
[0083] The annealing temperature and time used in this embodiment are annealing at 150° C. for 60 minutes.
[0084] Both the source electrode and the drain electrode are thermally evaporated Au electrodes with a thickness of about 46nm. When testing, use a bonding machine to draw electrodes from the source and drain electrodes and connect them to external circuits.
[0085] The measurement method is to use low-temperature strong magnetic field quantum transport equipment for measurement, which can provide a stable tes...
Embodiment 2
[0091] Compared with Example 1, the preparation process of the device is the same, the difference is that nanosheets with different thicknesses are used to prepare homojunction devices.
[0092] The lower layer Fe shown in this example 0.021 sn 0.979 S 2 The layer thickness is 12.3nm, about 15 layers;
[0093] The upper layer Fe shown in this example 0.021 sn 0.979 S 2 The layer thickness is 11.5 nm, about 14 layers.
[0094] The annealing temperature and time used in this embodiment are annealing at 200° C. for 60 minutes.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com