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Preparation method of hexagonal boron nitride/polymer blocky composite material with high filling amount

A technology of hexagonal boron nitride and composite material, which is applied in the field of preparation of high-filling hexagonal boron nitride/polymer bulk composite material, and can solve the problem that the uniform filling density of hexagonal boron nitride cannot be efficiently improved, etc.

Active Publication Date: 2020-07-17
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is: aiming at the problem that the uniform packing density of hexagonal boron nitride cannot be efficiently improved in the polymer matrix, a method for preparing a high-filling hexagonal boron nitride / polymer block composite material is provided, Through the method of mechanical ball milling, the liquid polymer is uniformly coated and reacted on the surface of hexagonal boron nitride in an ultra-thin layer

Method used

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  • Preparation method of hexagonal boron nitride/polymer blocky composite material with high filling amount
  • Preparation method of hexagonal boron nitride/polymer blocky composite material with high filling amount
  • Preparation method of hexagonal boron nitride/polymer blocky composite material with high filling amount

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Effect test

Embodiment 1

[0044] (1): 15g average lateral size is 700nm hexagonal boron nitride nanosheet-1, 4.32g bisphenol A epoxy resin, 3.67g methyltetrahydrophthalic anhydride (curing agent) and 0.08g 2,4,6- Tris(dimethylaminomethyl)phenol (catalyst) was added into an agate artificial mortar, ground and mixed evenly to obtain a hexagonal boron nitride nanosheet-epoxy resin mixture. Due to the low content of liquid substances, the mixed mixture was a wet powder status, illiquid;

[0045] (2): Put the hexagonal boron nitride nanosheet-epoxy resin mixture into the polytetrafluoroethylene ball mill jar in step (1), and mix evenly in the planetary ball mill, wherein the rotating speed of the ball mill is 500rpm, and the ball milling time is 600min, to obtain Mixed and reacted uniform hexagonal boron nitride nanosheet-epoxy resin mixture;

[0046] (3): Put the hexagonal boron nitride nanosheet-epoxy resin mixture mixed and reacted uniformly in step (2) into a cylindrical stainless steel metal mold with...

Embodiment 2、3、4、5、6、7

[0049] Change the amount of epoxy resin mixture in Example 1 step (1) so that the mass percentage of boron nitride nanosheets in the epoxy resin composite material is 70%, 75%, 80%, 85%, 90%, 95% , other operations are the same as in Example 1, named 70BNNSs / EP, 75BNNSs / EP, 80BNNSs / EP, 85BNNSs / EP, 90BNNSs / EP, 95BNNSs / EP respectively. The compressive strength of the composite material prepared by its embodiment 1 to 7 is as follows Figure 5 As shown, its compressive modulus is as Figure 6 shown.

Embodiment 8

[0051] (1): 10g average lateral size is 700nm hexagonal boron nitride nanosheet-1, 2.29g bisphenol A epoxy resin, 1.87g methyltetrahydrophthalic anhydride (curing agent) and 0.04g 2,4,6- Tris(dimethylaminomethyl)phenol (catalyst) was added into an agate artificial mortar, ground and mixed evenly to obtain a hexagonal boron nitride nanosheet-epoxy resin mixture. Due to the low content of liquid substances, the mixed mixture was a wet powder status, illiquid;

[0052] (2): Put the hexagonal boron nitride nanosheet-epoxy resin mixture into the polytetrafluoroethylene ball mill jar in step (1), and mix evenly in the planetary ball mill, wherein the rotating speed of the ball mill is 500rpm, and the ball milling time is 800min, to obtain Mixed and reacted uniform hexagonal boron nitride nanosheet-epoxy resin mixture;

[0053] (3): Putting the mixture in the step (2) into a cylindrical stainless steel metal mold with a diameter of 40mm, and applying a pressure of 60min by a piston ...

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Abstract

The invention relates to a preparation method of a hexagonal boron nitride / polymer blocky composite material with high filling amount, wherein the method comprises the steps: step 1, adding hexagonalboron nitride and a polymer matrix into a mortar, grinding uniformly, and mixing to obtain a hexagonal boron nitride-polymer matrix mixture, wherein the polymer matrix is in a liquid state at normal temperature and normal pressure, and can be cured under the condition of changing temperature and / or pressure; step 2, putting the mixture obtained in the step 1 into a ball milling tank, and carryingout uniform ball milling to obtain a mixture obtained by further mixing and uniformly carrying out a reaction on hexagonal boron nitride and the polymer matrix; step 3, putting the mixture obtained inthe step 2 into a mold, and carrying out compression molding to obtain a blocky molded prototype of the polymer composite material; and step 4, polymerizing and curing the blocky forming prototype ofthe polymer composite material obtained in the step 3 to obtain the blocky material of the hexagonal boron nitride / polymer composite material with high filling amount. The composite material has ultrahigh mechanical properties and huge thermal management application potential.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and in particular relates to a method for preparing a high-filling hexagonal boron nitride / polymer block composite material. Background technique [0002] Heat dissipation is a key issue for many important applications, especially for electronic and electrical equipment, such as light-emitting diodes (LEDs) and integrated circuits, where heat accumulation will lead to rapid aging or even failure of core chips. Therefore, in order to ensure the working efficiency of electronic and electrical equipment and prolong their safe and normal service life, the development of new materials and new processes for thermally conductive packaging with high performance and high thermal conductivity has become an urgent need for academia and industry. scientific and technical issues. [0003] Polymer composite thermal conductive materials have become the materials of choice for the most advanced electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/00C08K3/38C08F120/14C08F2/44C08L79/08
CPCC08K7/00C08K3/38C08F120/14C08F2/44C08K2201/011C08K2003/385C08L63/00C08L79/085
Inventor 薛彦明付坤翟庆洪杨靖文唐成春
Owner HEBEI UNIV OF TECH
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