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Monocrystalline silicon rod cutting and grinding all-in-one machine

An all-in-one machine, cutting and grinding technology, applied in the direction of grinding frame, gantry grinding machine, grinding machine parts, etc. Low cost, high cost of use

Pending Publication Date: 2020-07-07
福州天瑞线锯科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, it is necessary to provide an integrated machine for cutting and grinding monocrystalline silicon ingots to solve the problem that the existing monocrystalline silicon ingot processing equipment cannot be used for squaring and polishing of monocrystalline silicon ingots at the same time, and the equipment has poor versatility and processing efficiency. low cost of use

Method used

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  • Monocrystalline silicon rod cutting and grinding all-in-one machine
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  • Monocrystalline silicon rod cutting and grinding all-in-one machine

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Embodiment Construction

[0075] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0076] Please also refer to Figure 1 to Figure 13 , the present invention provides an integrated cutting and grinding machine for monocrystalline silicon ingots. The integrated cutting and grinding machine can be used to square the single crystal silicon ingot 800 and polish the square material 920 after squaring. The equipment has strong versatility. Specifically, the integrated cutting and grinding machine includes a clamping tool 100, a cutting operation mechanism 200 and a grinding and polishing mechanism 300;

[0077] The clamping tool 100 is used to clamp the silicon crystal bar to be cut and ground, so as to prevent the silicon crystal bar from shaking during squaring or polishing, which affects the processing accuracy;

[00...

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Abstract

The invention relates to the technical field of hard and brittle material cutting, in particular to a monocrystalline silicon rod cutting and grinding all-in-one machine, which comprises a clamping tool, a cutting operation mechanism and a grinding and polishing mechanism, wherein the clamping tool is used for clamping a crystalline silicon rod to be cut and grinded; the cutting operation mechanism comprises a rack, an annular wire sawing unit and a lifting unit, wherein the annular wire sawing unit is slidably fixed to the rack and is arranged above the clamping tool, and the lifting unit isused for driving the annular wire sawing unit to ascend or descend in order to extract a monocrystalline silicon rod; the grinding and polishing mechanism is slidably arranged on the side wall of therack and comprises a grinding and polishing assembly and a horizontal sliding component, wherein the grinding and polishing component comprises a grinding and polishing motor, a transmission part anda grinding head, the grinding and polishing motor is connected to the grinding head through the transmission part, the grinding and polishing component is arranged on the horizontal sliding component,and the horizontal sliding component is used for driving the grinding head to abut against or keep away from a crystalline silicon square stock after extraction. The equipment in the scheme is high in universality, high in processing efficiency and low in use cost.

Description

technical field [0001] The invention relates to the technical field of cutting hard and brittle materials, in particular to an integrated machine for cutting and grinding single silicon crystal rods. Background technique [0002] Silicon crystals are widely used in the photovoltaic industry. Preliminary processing of silicon ingots in order to meet the quality parameters of silicon ingots and the shape and size of the next process. [0003] Round monocrystalline silicon rods need to be cut squared and polished before they are used in product manufacturing and processing. At present, in the process of processing single silicon crystal ingots, the squaring and polishing of the ingots are generally processed by two different equipments, which will undoubtedly increase the demand for equipment, and the versatility of the equipment is poor. The transfer between equipment, repeated bar material conveying and clamping will prolong the processing time of the bar material, resultin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/00B28D5/04B28D7/00B28D7/04B24B7/22B24B41/02B24B47/12B24B41/06B24B47/22
CPCB28D1/003B28D5/045B28D5/0058B28D5/0082B24B7/224B24B41/02B24B47/12B24B41/06B24B47/22
Inventor 李海威梁兴华黄田玉林孝狮陈绍森方捷林光展刘林炎姚煌
Owner 福州天瑞线锯科技有限公司
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