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5G antenna flexible insulation cooling fin and preparation process thereof

A preparation process and technology for heat sinks, applied in antennas, antenna parts, heat exchange materials, etc., can solve the problems that heat sinks cannot meet insulation requirements, 5G mobile phone requirements, and low dielectric performance requirements. Achieve high heat dissipation requirements, easy operation, and low dielectric loss values

Pending Publication Date: 2020-06-19
厦门海洋南方特种光电材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, heat sinks of categories 1 and 2 cannot meet the insulation requirements in 5G mobile phone applications; thermal conductive films of category 3 are coated with ordinary resin and insulating and thermally conductive powder, which do not meet the performance requirements of low dielectric , heat sinks made of sintered aluminum nitride, boron nitride ceramics and other materials are relatively brittle and do not meet the softness characteristics in applications. Since it is difficult to achieve a thickness of less than 0.1mm for thermally conductive silica gel sheets, they cannot meet the requirements of 5G mobile phones. Require

Method used

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  • 5G antenna flexible insulation cooling fin and preparation process thereof

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preparation example Construction

[0030] The preparation process of the 5G antenna flexible insulating heat sink, the preparation process of the heat sink includes the following steps:

[0031] In the first step, put component A into a planetary grinder for grinding and pre-dispersion, control the rotation speed of the planetary grinder to 1-100r / min, the temperature to 10-25°C, the stirring time to 20min, and then control the temperature to 60 -75°C, the stirring reaction time is 3-4h, and the slurry A is obtained;

[0032] In the second step, add component B to the slurry A for mixing and pre-dispersion, control the low gear of the planetary mill at 1-10RPM / min, the high gear at 2000-5000RPM / min, control the temperature at 10-25°C, and stir for 0.5 -3 hours, obtain slurry B;

[0033] The third step is to add dispersant A to the slurry B to mix and pre-disperse, control the low gear of the planetary mill at 0-10RPM / min, the high gear at 1000-5000RPM / min, control the temperature at 10-25°C, and mix and pre-di...

Embodiment 1

[0043] Component A accounts for 60%: high thermal conductivity insulating powder accounts for 50%, of which alumina (7μm): silicon carbide (20μm): aluminum nitride (5μm) = 3:5:2; solvent A (toluene: acetic acid Ethyl ester mass ratio is 2:8) accounted for 49%; dispersant B accounted for 1%;

[0044] Component B accounts for 39%; MPi resin accounts for 50%, solvent B (toluene:ethyl acetate mass ratio is 2:8) accounts for 50%;

[0045] Dispersant A accounted for 1%.

Embodiment 2

[0047] Component A accounts for 60%: high thermal conductivity insulating powder accounts for 50%, of which alumina (7μm): silicon carbide (20μm): boron nitride (5μm) = 3:5:2; solvent A (toluene: acetic acid Ethyl ester mass ratio is 2:8) accounted for 49%; dispersant B accounted for 1%;

[0048] Component B accounts for 39%; LCP resin accounts for 50%, solvent B (toluene:ethyl acetate mass ratio is 2:8) accounts for 50%;

[0049] Dispersant A accounted for 1%.

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Abstract

The invention provides a 5G antenna flexible insulation cooling fin, which comprises 60% of a component A, 39%-39.8% of a component B and 0.2%-1% of a dispersing agent A, wherein the component A comprises the following raw materials: 30%-80% of high-thermal-conductivity insulating powder, 0.2%-1% of a dispersing agent B and 20%-70% of a solvent A, and the component B comprises the following raw materials: 30%-60% of a resin and 40%-70% of a solvent B. According to the invention, the component A, the component B and the dispersing agent A are mixed to prepare the cooling fin, the resin with lowdielectric loss is adopted, the dielectric loss is small, the advantages of being soft and bendable are achieved after resin film forming, and the added high-thermal-conductivity insulating powder can meet the high heat dissipation requirement in 5G antenna application. The invention further provides a preparation process of the 5G antenna flexible insulation cooling fin. According to the invention, the preparation process of the cooling fin is simple and easy to operate, and the prepared cooling fin has the characteristics of low dielectric loss value, softness, excellent heat dissipation performance and the like, and meets the requirements of antenna material products in the 5G electronic industry.

Description

technical field [0001] The invention relates to the technical field of heat sinks, in particular to a flexible insulating heat sink for 5G antennas and a preparation process thereof. Background technique [0002] Most of the existing heat sinks on the market fall into the following three categories: [0003] The first category is metal heat dissipation, including heat dissipation copper foil, heat dissipation aluminum foil, etc.; [0004] The second category is graphite, specifically including natural graphite flakes, artificial graphite flakes, graphene films, etc.; [0005] The third category is insulation and heat dissipation, which specifically includes ordinary heat-conducting films (composed of epoxy resin and insulating heat-conducting powder), heat-conducting silica gel sheets, sintered aluminum nitride, boron nitride ceramics and other materials. [0006] However, with the advent of 5G mobile phones, the heat sink of the mobile phone antenna needs to meet performa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/22C08K3/34C08K3/28C08J5/18C09K5/14C08L101/12C08K3/38C08L63/00H01Q1/00
CPCC08J5/18C08J2300/12C08J2363/00C08J2379/08C08K3/34C08K2003/2227C08K2003/282C08K2003/385C09K5/14H01Q1/02
Inventor 陈磊柳载铉马茜茜廖茂林曹福英
Owner 厦门海洋南方特种光电材料有限公司
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