A grinding wheel manufacturing method and manufacturing device for silicon wafer chamfering

Abstract

The invention relates to a method and device for manufacturing a grinding wheel for chamfering silicon wafers: 1) A metal bond diamond grinding wheel in the shape of a disc is sintered by hot pressing and sintering; The surface shape of the outer cylinder of the metal bond diamond grinding wheel; 3) Use a specific shape of the carbide rolling wheel to roll out a trapezoidal groove on the outer cylindrical surface of the diamond grinding wheel; 4) Use the same shape as the carbide rolling wheel Electrode EDM for dressing trapezoidal grooves of diamond grinding wheels. The device is equipped with a rough machining carbide rolling wheel, a finishing carbide rolling wheel, a diamond grinding wheel dressing working electrode and a grinding wheel groove dressing working electrode to respectively manufacture and process the diamond grinding wheel. The invention effectively solves the problems that diamond abrasive grains are easy to fall off in the traditional preparation method of silicon wafer chamfering grinding wheel, the shape accuracy of the groove section of the grinding wheel is not high, the groove shape and spacing are inconsistent, and the arc at the bottom of the groove is difficult to form.

Description

technical field [0001] The invention belongs to the field of precision machining, in particular to a method and device for manufacturing a grinding wheel for chamfering silicon wafers. Background technique [0002] With the development of economy and technology, monocrystalline silicon is used in more and more fields such as integrated circuits. The quality requirements for silicon wafers in these fields are also getting higher and higher. Silicon wafers are prone to various problems during transportation and use, such as defects such as chipping, cracks, and corners, which will cause a series of damage to subsequent surface processing and integrated circuit processes. In order to prevent defects in silicon wafers and increase the surface mechanical strength of the edge of silicon cutting wafers, eliminate edge cutting stress, reduce particle contamination, prevent edge cracking and particle shedding, silicon wafers should be chamfered. Silicon wafer chamfering is to trim ...

AI Technical Summary

Problems solved by technology

[0010] Compared with the traditional grinding wheel manufacturing technology, the present invention proposes a grinding wheel manufacturing method and manufacturing device for chamfering silicon wafers, which effectively solves the problem that the diamond abrasive grains are easy to fall off in the traditional silicon wafer chamfering grinding wheel preparation method, and the cross-sectional shape of the grinding wheel groove The accuracy is not high, the groove shape and spacing are inconsistent, and the arc of the groove bottom is difficult to form problems

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