Immersion type diamond linear cutting crystalline silicon and cooling lubricating method

Abstract

The invention relates to an immersion type diamond linear cutting crystalline silicon and a cooling lubricating method, and belongs to the field of crystalline silicon machining. A diamond line is immersed into a cutting solution for cutting crystalline silicon, the cutting solution enters a cutting region, the cutting region is cooled and lubricated, the cutting solution is immersed into an immersion groove, the diamond line runs through the immersion groove and is immersed into the cutting solution to cut the crystalline silicon, the cutting solution is brought into the cutting region, cuttings brought out by the cutting region are discharged from a discharge outlet below the immersion groove, the immersion groove is formed below the diamond line net and comprises a side wall and a groove bottom connected with the side wall. The side wall and the groove bottom form a space containing the cutting solution. A line groove through which the diamond line is allowed to penetrate is formedin the upper portion of the corresponding side wall of the diamond line. The crystalline silicon cut by adopting the method is better in surface roughness quality, particularly, the surface roughnessis better under the high production rate such as the high feeding rate, the product quality of the crystalline silicon is remarkably improved, the cost is low, the concept is exquisite, and the application prospect is wide.

Description

technical field [0001] The invention belongs to the field of crystal silicon processing, and in particular relates to a submerged diamond wire cutting crystal silicon and a cooling and lubricating method. Background technique [0002] Crystalline silicon is an important part of solar panels to achieve photoelectric conversion, and it needs to be processed through multiple processes to become a standard crystalline silicon wafer. During the processing of crystalline silicon, processing efficiency and cutting quality are the main concerns in the field of single / multi-wire diamond wire sawing. In the traditional processing process, spraying is used as the main cooling method. The traditional nozzle spraying and pouring methods can reduce the temperature of the cutting area to a certain extent and wash away the chips. It can be as low as 50μm, and the single line cut-off can also reach below 120μm. Therefore, the kerf is extremely small, and the ability of the cutting fluid to...

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Problems solved by technology

Therefore, the kerf is extremely small, and the ability of the cutting fluid to be brought into the cutting area in the thin line is relatively limited, and sufficient cooling and lubrication effects cannot be guaranteed. limit

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