Crosslinkable and chemically sinterable high-cohesiveness silver nanowire conductive ink and conductive film prepared from same

Abstract

The invention discloses crosslinkable and chemically sinterable high-cohesiveness silver nanowire conductive ink and a conductive film prepared from the same. The formula of the conductive ink comprises the following components in percentage by mass: 0.1 to 2.0 percent of silver nanowires; 0.01 to 0.5 percent of a bonding agent; 0.001 to 0.008 percent of a dispersing agent; 0.001 to 0.016 percentof a leveling agent, 0.001 to 0.005 percent of a surfactant, 0.1 to 1 percent of a thickening agent, 0.001 to 0.1 percent of a defoaming agent, 0.001 to 0.01 percent of a cross-linking agent and chemical sintering agent, and 96.361 to 99.785 percent of a solvent, and the binding agent is one or a mixture of more of sodium alginate, polyvinyl alcohol, polyurethane, chitosan and the like; and the cross-linking agent and chemical sintering agent is one or a mixture of more of calcium chloride, magnesium chloride, zinc chloride, nickel chloride and the like. According to the invention, the problem of poor adhesiveness of the silver nanowire transparent conductive film on the substrate is solved, and the film has structural stability, high conductivity and high visible light transmittance.

Description

technical field [0001] The invention belongs to the field of conductive ink, and relates to a silver nanowire conductive ink and a conductive film prepared therefrom. Background technique [0002] Silver nanowires have excellent electrical conductivity and ductility, and the network film composed of them exhibits better optoelectronic properties than indium tin oxide transparent conductive films, and will play a key role in the field of flexible and wearable electronic products in the future. Silver nanowires are generally coated on various substrates to form transparent conductive films. Therefore, the adhesion of silver nanowires on substrates has become a key bottleneck factor affecting the practical application of films. Generally, the adhesion to silver nanowires is enhanced by pre-coating a layer of organic binder on the substrate (Nanoscale 2014, 6, 4812); The binding force of the substrate (J.Mater.Chem.C 2016,4,9834); or the silver nanowires are welded to the subst...

AI Technical Summary

Problems solved by technology

However, the above methods all involve external energy input, and the implementation process is complicated, which increases the manufacturing cost of the silver nanowire transparent conductive film.

[0003] Adding binding agent in silver nanowire ink can improve the adhesion performance of silver nanowire on substrate (for example CN103627255B, CN104464880A, CN105131719A, CN106867318A), but these inks or have used the macromolecule additive that common method is difficult to remove, significantly It increases the junction resistance between the silver nanowires in the film, the overall square resistance of the film and the visible light transmittance of the film, or uses a large number of ether compounds with poor environmental protection, which is difficult to be practical, and there are no specific implementation cases to show the use of Its conductive ink-coated film has strong adhesion to the substrate

Images