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Flame-retardant low-dielectric copper-clad plate and preparation method thereof

A technology of copper clad laminate and low dielectric, applied in the field of flame retardant low dielectric copper clad laminate and its preparation, can solve the problems of insufficient mechanical strength, poor adhesion of copper clad laminate, etc.

Active Publication Date: 2020-04-24
艾蒙特成都新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above patents, copper clad laminates with good dielectric properties can be obtained by using styrene-butadiene resin and unsaturated polybutadiene as the resin components of copper clad laminates. However, due to the non-polar carbon chain structure of styrene butadiene resin and unsaturated polybutadiene , the resulting copper clad laminates have defects such as poor adhesion and insufficient mechanical strength

Method used

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  • Flame-retardant low-dielectric copper-clad plate and preparation method thereof
  • Flame-retardant low-dielectric copper-clad plate and preparation method thereof
  • Flame-retardant low-dielectric copper-clad plate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0054] The preparation of unsaturated phosphorus-containing phenolic resin, implementation steps are as follows:

[0055] Dissolve 100 parts by mass of phosphorus-containing phenolic resin and 31 to 56 parts by mass of esterifying agent in 400 to 600 parts by mass of an organic solvent, add 7 to 68 parts by mass of a basic catalyst at 50 to 80°C for 2 to 3 hours, filter, Wash with water until neutral and remove the organic solvent to obtain the unsaturated phosphorus-containing phenolic curing agents of Examples 1-1 to 1-4.

[0056] Table 1: List of ingredients and performance parameters of the unsaturated phosphorus-containing phenolic curing agent of Examples 1-1 to 1-5:

[0057]

[0058] Note in Table 1: DOW 92741, phosphorus-containing bisphenol A phenolic resin, hydroxyl equivalent 350g / eq; DFE392, phosphorus-containing bisphenol A phenolic resin, hydroxyl equivalent 380g / eq; LC-770, phosphorus-containing phenolic resin, hydroxyl equivalent 280~320g / eq, the unit of co...

Embodiment 2

[0061] The preparation steps of flame-retardant low-dielectric copper-clad laminates are as follows:

[0062] (1) Prepare flame retardant thermosetting resin composition glue:

[0063] 28-44 parts by mass of epoxy resin, 56-72 parts by mass of unsaturated phosphorus-containing phenolic curing agent, 21-48 parts by mass of hydrocarbon resin, 0.1-0.5 parts by mass of accelerator, 0.1-0.5 parts by mass of initiator, 45- 70 parts by mass of the filler and an appropriate amount of solvent are uniformly mixed to prepare a glue solution of a flame-retardant thermosetting resin composition with a solid content of 60% to 70%.

[0064] (2) Preparation of flame retardant low dielectric copper clad laminate:

[0065] After impregnating the glass fiber cloth in the tank containing the glue solution of the flame-retardant thermosetting resin composition described in step 2, remove most of the solvent A through a drying tunnel at 50°C to 100°C, and then bake at 130°C to 170°C for 4 ~7min t...

Embodiment 3

[0087] A flame-retardant low-dielectric copper-clad laminate, the flame-retardant low-dielectric copper-clad laminate consists of 28 parts by mass of epoxy resin, 56 parts by mass of unsaturated phosphorus-containing phenolic curing agent, 21 parts by mass of hydrocarbon resin, 0.1 part by mass of accelerator, A flame retardant thermosetting resin composition consisting of 0.1 parts by mass of initiator, 45 parts by mass of filler, uniformly mixed with (appropriate amount) solvent A to make a resin solution, impregnated glass fiber cloth, and then removed most of the solvent A through a 50°C drying tunnel , and then bake the impregnated glass fiber cloth at a temperature of 130°C for 7 minutes to make a prepreg, then stack the three-layer prepreg with copper foil on both sides, and cure it in a hot press.

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Abstract

The invention discloses a flame-retardant low-dielectric copper-clad plate and a preparation method thereof. The method is characterized by comprising the following steps: mixing a flame-retardant thermosetting resin composite composed of 28 to 44 parts by mass of epoxy resin, 56-72 parts by mass of an unsaturated phosphorus-containing phenolic aldehyde curing agent, 21-48 parts by mass of hydrocarbon resin, 0.1-0.5 part by mass of an accelerant, and 0.1-0.5 part by mass of an initiator with 45-70 parts by mass of a filler and a solvent A to prepare a resin solution; and impregnating the glass fiber cloth, removing most of the solvent A through a drying tunnel at 50-100 DEG C, baking the impregnated glass fiber cloth at 130-170 DEG C for 4-7 minutes to obtain prepregs, superposing 3-20 layers of prepregs, attaching copper foils to the two sides of the prepregs, and curing in a hot press. The flame-retardant low-dielectric copper-clad plate has excellent dielectric property, heat resistance, mechanical strength and the like while halogen-free flame retardance is realized.

Description

technical field [0001] The invention belongs to an electronic copper-clad laminate (laminated board) and its manufacture, and relates to a flame-retardant low-dielectric copper-clad laminate and a preparation method thereof. The (prepared) flame-retardant low-dielectric copper-clad laminate of the invention is widely applicable to the field of printed circuit boards. Background technique [0002] Among printed circuit board substrates, epoxy resin is widely used due to its good manufacturability and comprehensive performance. However, the dielectric properties of epoxy resin-based copper clad laminates on the market are generally poor, such as FR-4 copper clad laminates at 1MHz. Electrical constant 4.7~5.0, dielectric loss 0.015~0.019 (Tian Yong, Pi Pihui et al. Polyphenylene ether / epoxy resin system for high-performance copper clad laminates [J]. Plastic Science and Technology, 2006, 34 (2)), not Meet the high-frequency / high-speed development needs of signal communication....

Claims

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Application Information

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IPC IPC(8): B32B38/08B32B38/16B32B37/06B32B37/10B32B15/20B32B17/02B32B17/06B32B27/04B32B27/38B32B27/42B32B27/28H05K1/03H05K3/02C08L61/14C08L63/00C08K7/14C08K3/36C08J5/24
CPCB32B38/08B32B38/164B32B37/06B32B37/10B32B15/20B32B15/14B32B5/02B32B5/26H05K1/0366H05K1/0373H05K3/022C08J5/24B32B2038/168B32B2262/101B32B2260/021B32B2260/046B32B2307/3065B32B2457/08C08J2361/14C08J2463/00C08K7/14C08K3/36
Inventor 周友邹静孟宪媛马兴华陈立兴
Owner 艾蒙特成都新材料科技有限公司
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