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PC/POK composite material with multilayer structure and preparation method thereof

A composite material, multi-layer structure technology, applied in chemical instruments and methods, household appliances, layered products, etc., can solve the problem of insufficient comprehensive performance of materials, and achieve the effect of improving chemical resistance and gas barrier.

Inactive Publication Date: 2020-04-17
无锡赢同新材料科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the current patent literature on PC / POK composite materials, the technical scheme of alloying is used to modify PC, such as to improve the wear resistance or chemical resistance of PC, but the comprehensive performance of the material is insufficient.

Method used

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  • PC/POK composite material with multilayer structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this embodiment, a multi-layer coat hanger-type die head is used for co-extrusion, and a multi-layer co-extrusion die head is used to produce POK / PC sheets. Among them, 35mm (screw diameter) single screw extruders are used for POK and PC / ABS / POK. Plastic extrusion, PC is extruded by a 65mm single-screw extruder, POK is on the surface of the sheet, PC is the main material, and PC / ABS / POK is the bonding layer between the PC layer and the POK layer. The thickness is about 10 microns . The material enters the multi-layer die through different melt channels for compounding. The thickness of the POK layer in the formed sheet is 100 microns, and the thickness of the PC layer is 1.2 mm. Among them, the PC and POK raw materials used do not add any components except antioxidants (0.1% Irganox 1010 and 0.1% Irganox 168); and in the PC / ABS / POK system, the ratio of the three components is PC / ABS / POK=55 / 25 / 20.

Embodiment 2

[0031] Multi-layer co-extrusion die head is used to produce POK / high modulus flame-retardant PC sheet, among which POK and PC / ABS / POK are plasticized and extruded by 35mm single screw extruder, and high modulus flame-retardant PC is extruded by 65mm single screw. Extruded from the machine, POK is located on the surface of the sheet, PC is used as the main material, and PC / ABS / POK is used as the bonding layer between the PC layer and the POK layer, with a thickness of about 15 microns. The POK raw materials used do not add any components except antioxidants (0.1% Irganox 1010 and 0.1% Irganox 168); and in the PC / ABS / POK system, the ratio of the three components is PC / ABS / POK=55 / 20 / 25. The high modulus flame-retardant PC layer is realized by adding inorganic fillers and halogen-free flame retardants. For example, the weight ratio of 10% glass fiber and 0.5% aromatic sulfonate (benzenesulfonylbenzenesulfonic acid Potassium) was added to the polycarbonate formulation. The materi...

Embodiment 3

[0033] Multi-layer co-extrusion die head is used to produce POK / high-modulus flame-retardant PC / ABS sheet, among which POK and PC / ABS / POK are plasticized and extruded by a 35mm single-screw extruder, and high-modulus flame-retardant PC / ABS ( The specific composition is PC / ABS=55 / 15) It is extruded by a 65mm single screw extruder, POK is located on the surface of the sheet, PC is used as the main material, and PC / ABS / POK is used as the bonding layer between the PC layer and the POK layer. The thickness is about 15 microns. The POK raw materials used have no added components except antioxidants (0.1% Irganox 1010 and 0.1% Irganox 168); and in the PC / ABS / POK system, the ratio of the three components is PC / ABS / POK =55 / 20 / 25. The high modulus flame-retardant PC / ABS layer is achieved by adding inorganic fillers and halogen-free flame retardants, such as by blending 20% ​​ultrafine talcum powder and 6% phosphate (bisphenol A bis ( Diphenyl phosphate)) was added to the PC / ABS formula...

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Abstract

The invention discloses a PC / POK composite material with a multilayer structure. The PC / POK composite material comprises a matrix layer and a surface layer, wherein the matrix layer is a material layer with polycarbonate as a main component, and the surface layer is a polyketone layer. The composite material is a plate formed by co-extrusion or hot-pressing compounding of PC and POK, and the wearresistance, hydrolysis resistance, chemical resistance, gas barrier property and the like of the composite material can be remarkably improved compared with those of a single PC plate, so that the special requirements of the fields of electronic appliances, mechanical equipment, traffic, buildings, medical equipment and the like can be met.

Description

Technical field [0001] The invention relates to the technical field of polymer materials, in particular to a PC / POK composite material with a multilayer structure and a preparation method thereof. Background technique [0002] Polycarbonate (PC for short) is a high molecular weight polymer containing carbonate groups in the molecular chain, and the most commonly used is bisphenol A PC. Because its molecule contains a large number of benzene ring structures, the molecular chain is relatively rigid, difficult to crystallize, and has a high glass transition temperature. The molecular chain structure of PC determines that it has many excellent properties, such as balanced rigidity and toughness, good creep resistance and dimensional stability, heat resistance, transparency, low water absorption, non-toxicity, and excellent dielectric properties. It is widely used in electronic appliances, automobiles, telecommunications, medical treatment, home appliances and other fields. But on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/28B32B27/30B32B27/36B32B7/12B32B15/08B32B27/08B32B33/00B29D7/01
CPCB29D7/01B32B7/12B32B15/08B32B27/08B32B27/288B32B27/302B32B27/365B32B33/00B32B2307/554B32B2307/714B32B2307/7242
Inventor 吴彤李莹孙亚峰王春敏
Owner 无锡赢同新材料科技有限公司
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