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Aqueous solution developed dry film photoresist

A photoresist and aqueous solution technology, applied in the field of circuit board production, can solve problems such as poor sealing and affect the production quality of circuit boards, and achieve the effect of improving strength, helping production control, and reducing use.

Inactive Publication Date: 2020-03-31
ZHUHAI DYNAMIC TECH OPTICAL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the existing dry film photoresists on the market are faced with odd-shaped apertures, they generally show poor sealing, which affects the production quality of circuit boards.

Method used

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  • Aqueous solution developed dry film photoresist
  • Aqueous solution developed dry film photoresist
  • Aqueous solution developed dry film photoresist

Examples

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Effect test

Embodiment

[0066] Prepare dry film photoresists according to the formula in Table 1 below, wherein, Examples 1 to 5 are dry film photoresists according to the present invention, and the comparative example is an existing dry film photoresist, specifically as follows :

[0067] Table 1 Composition of various dry film photoresists

[0068]

[0069] In the above table 1, acrylate adhesive A is polymerized by 60wt% methacrylate, 18wt% methacrylic acid and 22wt% n-butyl acrylate in butanone solvent; Acrylic acid modification), the double bond content is 5mol; in the B2 structure (using methacrylic acid modification), the double bond content is 5mol; what the photocuring monomer B3 uses is trimethylolpropane triacrylate (TMPTA); The active monomer D used was SR480, which was purchased from Sartomer Corporation of the United States; p-methoxyphenol was used as a thermal polymerization inhibitor; the plasticizer was tributyl citrate (TBC).

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Abstract

The invention relates to the technical field of circuit board production and manufacturing. The aqueous solution developed dry film photoresist is prepared from the following components: an acrylate adhesive A, epoxy acrylate B1, urethane acrylate B2, a photocuring monomer B3, a radical initiator C, an active monomer D, N-phenylglycine, a plasticizer, an ultraviolet absorber and a thermal polymerization inhibitor, wherein the epoxy acrylate B1 accounts for 1-15% of the total mass of the dry film photoresist, and the content of carbon-carbon double bonds in the epoxy acrylate B1 is 1-30 mol; wherein the urethane acrylate B2 accounts for 1-15% of the total mass of the dry film photoresist, and the content of carbon-carbon double bonds in the urethane acrylate B2 is 1-30 mol; the hole sealingcapability of the aqueous solution developed dry film photoresist is obviously higher than that of a commercially available dry film photoresist, so that the aqueous solution developed dry film photoresist has a wide application prospect and a high market value.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to an aqueous solution developed dry film photoresist. Background technique [0002] Generally, the components of dry film photoresists include thermoplastic polymers formed from acrylic or methacrylic monomers, photopolymerizable monomers, thermal polymerization inhibitors, free radical photoinitiators, and ultraviolet light absorbers. They are usually sold as dry film rolls, with the components sandwiched between a flexible support film PET and a cover film PE. Among them, thermoplastic polymers are generally non-reactive substances. [0003] In the prior art, free radical polymerization usually has obvious shrinkage characteristics. The shrinkage during polymerization will not only have a negative impact on the adhesion of the dry film photoresist on the copper surface, but also affect the current popular outer layer. The ability to seal holes during circuit bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/033
CPCG03F7/004G03F7/033
Inventor 杜永杰
Owner ZHUHAI DYNAMIC TECH OPTICAL IND
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