Method of continuously producing diamond wire

A technology of diamond wire and production method, applied in electrodes, electrolytic coatings, coatings, etc., can solve problems such as unfavorable slicing, deviation of steel wire, unbalanced number of diamonds, etc. Environmentally friendly effects

Inactive Publication Date: 2020-03-27
EZHOU JINFENG SUPERHARD MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the production of diamond wire generally consists of two methods: the first method is the sand-burying method, which refers to burying the steel wire in the sand tank, burying the steel wire with diamond abrasives, and the sand pile is completely soaked in the electroplating solution. Finally, under the action of electrodeposition, the diamond abrasive in contact with the steel wire sticks to the surface of the substrate, thereby completing the production of the diamond wire. The disadvantage of this method is that the pressure on the upper and lower sides of the steel wire is different, and the friction of the surface sand is also different. Inevitably, the number of diamond particles on the upper and lower sides of the wire is very different, which makes the steel wire prone to deviation during cutting.
In addition, since the steel wire passes through the sand pile, it is easy to block the newly fixed diamond particles, resulting in uneven diamond particles on the surface of the stainless steel wire.
Another method is the falling sand method, which refers to the use of diamond powder directly added to the electrolyte, suspended in the electroplating liquid, falling onto the steel wire body under the gravity of the powder itself, and then electroplating and fixing the diamond powder. This method will also cause The number of diamonds on the upper and lower parts of the steel wire is unbalanced, which is not conducive to the process of slicing. Therefore, a method and equipment for continuously producing diamond wires with simple equipment and uniform coating are needed.

Method used

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  • Method of continuously producing diamond wire
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Examples

Experimental program
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Effect test

Embodiment 1

[0023] combine Figure 1-2 , the device of this embodiment includes a pump 1, a steel wire 2 and a power supply 4, and the steel wire 2 is connected to the negative electrode of the power supply 4. Turn on the power supply and pass the current. The current passes through the annular nickel anode 5 and reaches the cathode steel wire evenly. At the same time, the anode nickel dissolves , forming nickel ions into the electrolyte. The nickel ions in the electrolyte are reduced on the cathode surface of the steel wire to form an electroplated nickel layer, and at the same time, the diamond micro-powder in the droplet is fixed on the steel wire, which is the process of pre-plating. The steel wire with the diamond powder fixed on the surface enters the electroplating tank again for electroplating. There is no diamond powder in the electroplating solution of this electroplating tank, and only the nickel layer can be electroplated. The nickel layer around the diamond powder fixed on t...

Embodiment 2

[0026] If you want to prepare diamond wire with thick diamond thickness, there are two ways to get it: First, you can increase the diamond concentration in the pre-plating solution. Although this method is simple, it is impossible to increase the diamond concentration due to the limited diameter of the nozzle. Amplitude increases, which can increase the likelihood of nozzle clogging. In this case, the method of combined electroplating with double nozzles can be used. Same as the above example, weigh diamond micropowder, nickel salt and boric acid of the same quality, add deionized water of the same quality, and prepare a pre-plating solution. Heat the pre-plating solution to 45 ° C and add ultrasonic vibration. Separate the two nozzles. Connect to the pre-plating solution container, start the two peristaltic pumps, and wait for the dual nozzles to enter a stable state respectively. The anodes of two nickel rings are passed through the steel wire, and the two nickel rings are ...

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Abstract

The invention relates to a method of continuously producing a diamond wire, which comprises two processes of diamond pre-electroplating and nickel layer electroplating and thickening. According to thepre-electroplating device, a liquid drop formed by a diamond and nickel electroplating solution ejected from a nozzle is used to form a thin mixed plating layer of nickel and diamond on the surface of a steel wire, electroplating thickening is to thicken the nickel layer, the diamond is further wrapped, and the adhesive force of the diamond is increased. The two electroplating processes are connected, so that the diamond wire with the uniform plating layer for the diamond wire saw can be produced uninterruptedly. According to the method, the production equipment is simple, the operation is simple and convenient, the required electrolyte is less in mass, the residual nickel-containing waste liquid is less, and the reduction of the production cost of the diamond wire and the maintenance ofthe environment are facilitated.

Description

technical field [0001] The invention relates to a continuous production method and device for preparing a diamond wire for cutting a sapphire crystal rod by using an electroplating method, belonging to the field of diamond wire manufacturing. Background technique [0002] Sapphire single crystal is an oxide composed of aluminum and oxygen. It has great hardness and excellent optical transmittance. It has been applied to the screens of personal consumer electronic products, such as mobile phones, Ipads and other electronic devices. At the same time, it is an extremely important substrate material in the microelectronics and optoelectronics industries and can be used as a substrate material for LED lamps. With the demand for personal consumer electronics products With the growth and the need to save energy, the demand for sapphire crystal wafers is increasing. Sapphire crystal pieces are obtained by cutting crystal rods with diamond wire saws, and the demand for diamond wire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D5/08C25D5/50C25D7/06C25D15/00C25D17/00C25D17/12
CPCC25D3/562C25D5/08C25D5/50C25D7/0607C25D15/00C25D17/00C25D17/12
Inventor 方海严春银翁佑发
Owner EZHOU JINFENG SUPERHARD MATERIALS CO LTD
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