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Etching solution composition and method for forming metal circuit

A composition and etching solution technology, applied in the field of display panels, can solve problems such as difficult etching, affecting the back-end process, and unfriendly environment

Inactive Publication Date: 2020-02-28
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the copper / molybdenum-titanium metal film layer, because the molybdenum-titanium layer is difficult to etch, the etching solution used basically contains fluoride, although fluoride can have a certain beneficial effect on the removal of molybdenum layer residues in the etching process, but fluorine The compound will react with the substrate glass, fluoride ions (F - ) and silicon dioxide (SiO 2 ) produces a chemical reaction, and then destroys the substrate glass, affecting the subsequent process, and fluoride is an environmentally unfriendly substance, which has adverse effects on the health of personnel and increases the cost of wastewater treatment

Method used

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  • Etching solution composition and method for forming metal circuit
  • Etching solution composition and method for forming metal circuit
  • Etching solution composition and method for forming metal circuit

Examples

Experimental program
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Effect test

Embodiment 1

[0031] figure 1 Shown is a schematic diagram of the display panel 10 entering the etching machine 50 in this embodiment, the etching temperature of the etching machine 50 is set to 32°C, and the plate speed is 2m / min;

[0032] Figure 2a Shown is a schematic cross-sectional view of the display panel 10 of this embodiment, including a glass substrate 100, a copper / molybdenum-titanium (Cu / MoTi) alloy film layer 200 covering the glass substrate 100, and a copper / molybdenum-titanium (Cu / MoTi) alloy film layer 200, and a copper / molybdenum-titanium (Cu / MoTi) ) the photoresist layer 300 coated on the alloy film layer 200, after being exposed through a photomask and developed by a developer, as Figure 2b As shown, the area not covered by the photoresist layer 300 is the area to be etched.

[0033] The pH value of the etching solution composition used is 4.7, and the content is as shown in Table 1 below:

[0034]

[0035] Table I

[0036] image 3 Shown is a schematic diagram ...

Embodiment 2

[0039] figure 1 Shown is a schematic diagram of the display panel 10 entering the etching machine 50 in this embodiment, the etching temperature of the etching machine 50 is set at 34°C, and the plate speed is 1.8m / min;

[0040] Figure 2a Shown is a schematic cross-sectional view of the display panel 10 of this embodiment, including a glass substrate 100, a molybdenum-titanium / copper / molybdenum-titanium (MoTi / Cu / MoTi) alloy film layer 200 covering the glass substrate 100, and a molybdenum-titanium / molybdenum-titanium (MoTi / Cu / MoTi) alloy film layer 200, and The photoresist layer 300 coated on the copper / molybdenum-titanium (MoTi / Cu / MoTi) alloy film layer 200, after being exposed through a photomask and developed by a developer, as Figure 2b As shown, the area not covered by the photoresist layer 300 is the area to be etched.

[0041] The pH value of the used etching solution composition is 5.8, and the content is as shown in Table 2 below:

[0042]

[0043]

[0044]...

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Abstract

The invention provides an etching solution composition and a method for forming a metal circuit. The etching solution composition comprises 10-20wt% of hydrogen peroxide, 4-13wt% of organic acid, 1-5wt% of hydrogen peroxide stabilizer, 2-10wt% of organic base, 0.001-1wt% of corrosion inhibitor, 2-5wt% of PH buffering agent and 47-80wt% of deionized water. The method comprises the step of etching acopper-containing metal film by using the etching solution composition to pattern the copper-containing metal film to form the metal circuit.

Description

【Technical field】 [0001] The invention relates to the technical field of display panels, in particular to an etching solution composition and a method for forming metal circuits. 【Background technique】 [0002] The copper lines used in the gate and data metal lines of large-scale displays have the advantage of low impedance compared with the aluminum lines in the prior art, but the adhesion between copper and glass substrates is poor, so molybdenum or molybdenum alloys are usually used as transition layer. [0003] The copper / molybdenum metal structure widely used in the industry has galvanic corrosion (Galvaniccorrosion) during the etching process, which easily causes the etching rate of the two layers to mismatch, resulting in undercut phenomenon, which may lead to light leakage. Affecting the contrast ratio and producing thin film transistor (thin film transistor, TFT) electric shift and other problems, affecting the display effect. However, since the titanium in the mo...

Claims

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Application Information

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IPC IPC(8): C23F1/18C23F1/26C23F1/02
CPCC23F1/02C23F1/18C23F1/26
Inventor 秦文
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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