Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Transparent photosensitive polyimide resin, polyimide film and preparation method of polyimide resin

A technology of photosensitive polyimide resin and polyimide resin, applied in the field of transparent photosensitive polyimide resin, polyimide film and preparation thereof, can solve the problem of non-recyclable, high cost, flexible circuit board manufacturing Complex process and other issues

Active Publication Date: 2020-02-18
SUN YAT SEN UNIV
View PDF8 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the defects of complex manufacturing process, high cost, heavy pollution and inability to recycle the flexible circuit board in the prior art, and provide a transparent photosensitive polyimide resin

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transparent photosensitive polyimide resin, polyimide film and preparation method of polyimide resin
  • Transparent photosensitive polyimide resin, polyimide film and preparation method of polyimide resin
  • Transparent photosensitive polyimide resin, polyimide film and preparation method of polyimide resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Embodiment 1 colorless transparent photosensitive polyimide resin and its film

[0072] This embodiment provides a transparent photosensitive polyimide resin and its film, the preparation process of which is as follows.

[0073] (1) Weigh 40mmol of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 10mmol of 3,5-diaminobenzoic acid monomer into a three-necked flask with nitrogen protection and mechanical stirring , add 150mL of N,N'-dimethylacetamide, stir under dry nitrogen and room temperature for 30min until the raw material is completely dissolved;

[0074] (2), weigh 50mmol of 4,4'-(hexafluoroisopropylene) diphthalic anhydride monomer, add to the above solution in 4 times, the last addition is less than or equal to half of the previous time; Stir at room temperature for 15 hours to obtain polyamic acid;

[0075] The chemical reaction equation of step (1) and (2) is as shown in [1] formula:

[0076]

[0077] (3) Add 8.5mL of acetic anhydride, pyridine and triethylam...

Embodiment 2

[0097] Embodiment 2 transparent photosensitive polyimide resin and its film

[0098] This embodiment provides a transparent photosensitive polyimide resin and its film, the preparation process of which is as follows.

[0099](1) Weigh 40mmol of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 10mmol of 3,5-diaminobenzoic acid monomer into a three-necked flask with nitrogen protection and mechanical stirring , add 150mL of N,N'-dimethylacetamide, stir for 30min under dry nitrogen and room temperature, until the solid material is completely dissolved;

[0100] (2) Weigh 50 mmol of 3,3',4,4'-benzophenone tetracarboxylic dianhydride monomer, add it to the above solution in 4 times, and the last addition amount is less than or equal to half of the previous one; After adding, stir at room temperature for 20 hours to obtain polyamic acid;

[0101] The chemical reaction equation of step (1) and (2) is as shown in [1] formula:

[0102]

[0103] (3) Add 8.5mL of acetic anhydride, pyri...

Embodiment 3

[0113] Embodiment 3 transparent photosensitive polyimide resin and its film

[0114] This embodiment provides a transparent photosensitive polyimide resin and its film, the preparation process of which is as follows.

[0115] (1), Weigh 40mmol of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 10mmol of 3.5-diaminobenzoic acid monomer into a three-necked flask with nitrogen protection and mechanical stirring, add Stir 150mL of N,N'-dimethylacetamide under dry nitrogen and room temperature for 30min until the solid material is completely dissolved;

[0116] (2) Weigh 50 mmol of 4,4'-oxydiphthalic anhydride monomer and add it to the above solution in 4 times. The last addition is less than or equal to half of the previous one; Stir for 20 hours to obtain polyamic acid;

[0117] Step (1) and (2) chemical reaction equation is as shown in [1] formula:

[0118]

[0119] (3) Add 8.5mL of acetic anhydride, pyridine and triethylamine to the above polyamic acid; the concentration of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
degree of polymerizationaaaaaaaaaa
degree of polymerizationaaaaaaaaaa
Login to View More

Abstract

The invention relates to a transparent photosensitive polyimide resin, a polyimide film and a preparation method of the polyimide resin. The polyimide resin has a structure as shown in a formula (I) or formula (II) shown in the specification. The polyimide resin and the film have photosensitivity, can change color under the irradiation of ultraviolet rays, have the characteristics of intuitive visual observation of light-induced modification area, are soluble, can be recycled, are colorless and transparent, have good flexibility, and can be used to prepare circuit boards for flexible electronic devices. The surface pattern of the film can be metalized, and metal in a plating layer on the film can be recovered.

Description

technical field [0001] The invention belongs to the technical field of photosensitive resin materials, and in particular relates to a transparent photosensitive polyimide resin, a polyimide film and a preparation method thereof. Background technique [0002] With the development of flexible electronics, microelectronic packaging, biochemical sensors and communication technology (5G) towards lightness, miniaturization and high frequency, the substrate material of the device is required to have flexibility, good heat resistance, low dielectric constant, Strong resistance to electromigration, low resistivity of metal plating wiring and other characteristics. Polyimide film has the characteristics of good flexibility, low dielectric constant, high mechanical strength, good bending resistance, high temperature resistance and strong electrical resistance. It is an ideal flexible substrate for electronic packaging and flexible electronic device substrate. It has been widely used i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1007C08G73/1039C08G73/1042C08G73/1067C08G73/1071C08G73/1078C08J5/18C08J2379/08
Inventor 容敏智莫伟杰张泽平章明秋
Owner SUN YAT SEN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com