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A kind of high thermal conductivity biodegradable polymer composite material and preparation method thereof

A technology of biodegradation and composite materials, which is applied in the field of high thermal conductivity biodegradable polymer composite materials and its preparation, can solve the problems of material mechanical properties decline, achieve the improvement of mechanical properties, glass transition temperature, and thermal decomposition temperature Effect

Active Publication Date: 2021-03-16
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, the filler forms an oriented state structure inside the polymer matrix, but permanent deformation occurs when the stretching process promotes the orientation and crystallization of the polymer molecular chain, which fixes the material defects of the polymer during the stretching process, such as The accumulation of fillers or the pores of the material cause the decline of the mechanical properties of the material

Method used

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  • A kind of high thermal conductivity biodegradable polymer composite material and preparation method thereof
  • A kind of high thermal conductivity biodegradable polymer composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] S1: Ultrasonic stirring 1g of polypropylene carbonate and 25ml of N-N dimethylformamide for 2h until completely dissolved to obtain dispersion A;

[0034]S2: Dispersing 0.4g silicon carbide nanowires in 40ml N-N dimethylformamide to obtain a silicon carbide nanowire dispersion with a concentration of 10mg / ml; (the mass ratio of the polypropylene carbonate to the thermally conductive nanofiller for 100:40)

[0035] S3: Add the silicon carbide nanowire dispersion obtained in step S2 to the dispersion A at 2 drops / second, and stir for 6 hours to obtain a silicon carbide nanowire-polymer mixture, which is added to deionized water for precipitation , to obtain a precipitate, which is washed with deionized water, filtered, dried, and thermoformed to obtain an initial composite material;

[0036] S4: The initial composite material described in step S3 was heated at 100°C for 2 minutes to soften, then stretched to 3 times its original length and lowered to room temperature to ...

Embodiment 2

[0043] The difference between embodiment 2 and embodiment 1 is:

[0044] S1: 1 g of polypropylene carbonate and 25 ml of tetrahydrofuran were ultrasonically stirred for 2 h until completely dissolved to obtain dispersion A.

[0045] S2: Disperse 0.3 g of silver nanowires in 42 ml of tetrahydrofuran to obtain a silver nanowire dispersion with a concentration of 7 mg / ml. (the mass ratio of the polypropylene carbonate and the thermally conductive nanofiller is 100:30)

[0046] S3: Add the silver nanowire dispersion liquid obtained in step S2 to dispersion liquid A at 2 drops / second, stir for 8 hours to obtain a silver nanowire-polymer mixed liquid, add the mixed liquid to deionized water for precipitation, and obtain Precipitation, the precipitation is washed with deionized water, filtered, dried, and thermoformed to obtain a composite material;

[0047] S4: The composite material described in step S3 was heated at 60°C for 10 minutes to soften, then stretched to twice its orig...

Embodiment 3

[0052] The difference between embodiment 3 and embodiment 1 is:

[0053] S1: 3 g of polypropylene carbonate and 30 ml of dimethyl carbonate were ultrasonically stirred for 2 h until they were completely dissolved to obtain dispersion A.

[0054] S2: Disperse 0.15 g of boron nitride nanosheets in 37.5 ml of dimethyl carbonate to obtain boron nitride nanosheets with a concentration of 4 mg / ml. (the mass ratio of the polypropylene carbonate and the boron nitride nanosheet is 100:20)

[0055] S3: Add the boron nitride nanosheet dispersion obtained in step S2 dropwise into the dispersion A, and stir for 10 hours to obtain a boron nitride nanosheet-polymer mixture, which is added to deionized water for precipitation , to obtain a precipitate, which is washed with deionized water, filtered, dried, and thermoformed to obtain a composite material;

[0056] S4: heating the composite material in step S3 at 60° C. for 5 minutes to soften, then stretching to 1.5 times its original length...

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Abstract

The invention discloses a biodegradable polymer composite with high thermal conductivity. The biodegradable polymer composite comprises heat-conducting nanofiller and a biodegradable polymer with a shape memory characteristic, wherein the heat-conducting nanofiller is arranged in the biodegradable polymer in order. The heat-conducting nanofiller without chemical modification is mixed with the biodegradable polymer, by use of the shape memory characteristic of the polymer, the heat-conducting nanofiller is arranged in order by stretch induced self-assembly, meanwhile, the heat-conducting nanofiller arranged in order is used as a physical crosslinking site to maintain the orientation state of the material, after the obtained material is heated secondarily, the filler still keeps high orientation, a constructed orientated structure facilitates lap joint of an ordered filler network with a small quantity of heat-conducting nanofiller, so that the production cost is reduced, the material density is reduced, the strength and ductility of the material are enhanced, and the thermal conductivity of the material is improved.

Description

technical field [0001] The invention belongs to the technical field of high thermal conductivity composite materials, and more specifically relates to a high thermal conductivity biodegradable polymer composite material and a preparation method thereof. Background technique [0002] With the rapid development of electronic equipment toward miniaturization and integration, efficient heat dissipation has become the basis for ensuring its normal operation. The operational reliability of electronic equipment deteriorates dramatically as its internal temperature rises. The main factor affecting the heat dissipation efficiency of electronic equipment is the heat transfer resistance between the heat source and the heat sink. There is a gap between the two solids due to the inability to fit closely, and the extremely low thermal conductivity of the air (0.023Wm -1 k -1 ) leads to the preferential conduction of heat between two solids in local contact. On the one hand, a large am...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L69/00C08K7/00C08K3/34C08K3/08C08K3/38C08J7/00C08J3/215
CPCC08J3/215C08J7/08C08J2300/16C08K3/08C08K3/34C08K3/38C08K7/00C08K2003/0806C08K2003/385C08K2201/001C08K2201/011C08L2201/06C08L2201/14C08L2203/206C08L69/00
Inventor 解孝林瞿昊叶昀昇尹亮亮周兴平
Owner HUAZHONG UNIV OF SCI & TECH
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